JPH01500274A - Polyetherimide-polyamide composition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Polyetherimide-polyamide compositions The present invention provides reduced absorption in humid environments. Polyethers with improved moisture resistance as demonstrated by water-based and swellable properties The present invention relates to imide-polyamide compositions. More specifically, polyetherimide - Incorporation of certain phenolic compounds and polymers into polyamide compositions thus reducing its susceptibility to weight gain and swelling in a humid environment. It is something.

Background technology of the invention As a result of the well-known and generally excellent processability and solvent resistance of polyamides, It has been a huge commercial success, especially in the textile and bristle industries. death However, they are particularly susceptible to water absorption as a result of their low tolerance to humid environments. as a result of its tendency to increase weight and swell or swell. Their use as molding compositions has been hindered.

On the other hand, polyetherimide has been developed more recently as a high-performance special thermoplastic resin. It is something that Polyetherimide has high continuous service temperatures, inherent flame resistance, and low emissions. It has properties such as smoke resistance, good electrical properties and generally good physical properties. for a wide range of applications, especially in the high-tech electronics industry. It is becoming increasingly desirable in the manufacture of aircraft and the like. however, Due to its high temperature properties, processing of this thermoplastic requires extremely high temperatures, e.g. A temperature below 680-820 is required.

Such high temperatures can tend to adversely affect the properties of the polymer. In addition, polyether Although tellimide has many advantageous properties, it is susceptible to premature failure in certain environments. stomach.

Recently, Robeson et al. (European Patent Application No. 104659) The excellent mechanical properties of polyetherimide can be achieved by blending polyamide into the with improved processability at lower temperatures and more favorable conditions without adversely affecting quality. We have discovered that it is possible to obtain a composition with excellent chemical resistance.

However, achieving the benefits of such formulations also has some detrimental aspects, especially: Polyamides impart many advantageous properties to the formulation, but - especially against water and water absorption. It also has the undesirable property of having low tolerance with respect to swelling and swelling. This special Due to its properties, certain applications of polyetherimide resins with high performance properties, especially It is no longer useful for high-tech electronics applications where the dimensional tolerance of materials is critical. It cannot be used.

It is therefore an object of the present invention to produce a polyurethane material with improved tolerance to water or moisture. -tellimide-polyamide compositions, and the excellent properties of the formulations The goal is to provide compositions that have few, if any, adverse effects. .

Summary of the invention Now, with reduced water absorption and improved dimensional stability, the physical polyetherimide that has little, if any, adverse effect on the physical properties of the polyetherimide. The polyamide formulation may contain one or more phenols which may provide the above-mentioned improvements. It was recognized that it can be produced by blending compounds.

Specifically, the polyetherimide-polyamide blend composition comprises: -hydric, dihydric and polyhydric phenols and bisphenols and higher phenols of the formula In the formula, n is 1.2 or 3, m is 3.4 or 5, and (n+m)-6; p is 1 or 2, and each r is 0, 1 or 2, respectively. and each S is 0°1.2.3 or 4 as appropriate; t is 0.1, 2.3 or 4; each R is hydrogen; halogen, such as bromine, chlorine fluorine, etc.; C -c, 6 alkyl, CG '18 aryl or C7-02o arylalkyl group (Each of them may be substituted with a C1-012 alkyl group or a halogen atom. Accordingly, if the aryl group is present, O% CI -C3 alkylene or may be bonded by an alkylidene or -3O2- bridging group. or a hydroxyaryl or alkylhydroxyaryl group; Each R' includes a direct carbon-carbon bond or a respective halogen-substituted derivative. divalent alkyl, aryl, arylalkyl, hydroxyaryl or Alkylhydroxyaryl group; divalent ester and amide group; and -P-, etc. selected from the group consisting of cross-linking groups selected from the group consisting of hetero-containing cross-linking groups including ; However, two adjacent alkyl groups on the phenol ring with a tertiary α-carbon atom (b) there shall be no phenolic hydroxy group with suspensions along the oligomer or polymer chain or attached to the oligomer or polymer chain. Free (i.e., unreacted) phenolic hydroxyl groups in the phenolic groups are also present. However, two adjacent alkyl groups on the phenol ring with a tertiary α-carbon atom An oil characterized by the absence of phenolic hydroxyl groups with at least one phenol selected from the group consisting of oligomeric and polymeric phenols; By incorporating phenolic compounds, oligomers or polymers, water absorption and moisture absorption can be improved. conferred reduced susceptibility to swelling by minutes.

Detailed disclosure of the invention The polyetherimide component of the formulations of the present invention has the formula: [where "a" is greater than 1] a large integer, such as 10 to 1o, ooo or more, and the group -0-A is of the formula (where Rt is hydrogen, lower alkyl or lower alkoxy) Contains repeating groups. Preferably, the polyetherimide has the 10-A group of the last formula above. (where R' is hydrogen), that is, polyether The divalent bond of the 〇-2-0- group is 3.3'.

3.4'; Located at 4.3' or 4.4' position; Z is (1) CH3CH3 and (2) general formula: (In the formula, X is the formula, is a member selected from the group consisting of divalent groups, q is 0 or 1, and y is 1 to 5. R is a member of the group consisting of (1) 6 to about 20 carbon atoms aromatic hydrocarbon groups and their halogenated derivatives having (2) 2 to about 20 atoms; Alkylene group and cycloalkylene group having a carbon atom, C2-C8 alkylene powder Edge polydiorganosiloxane, and formula (3) [In the formula, Q is O II II -o +, -C-, -s-, -s- and -CXH2X-II (where X is an integer from 1 to 5) It is a divalent organic group selected from the group consisting of divalent groups. Purpose of the invention Particularly preferred polyetherimides are those in which 10-A< and Z are respectively R is Includes those selected from. A polyetherimide in which R is m-phenylene most preferred.

In addition to the etherimide unit mentioned above, polyetherimide has the formula [wherein R is as defined above and M is (wherein B is -S- or -C- is a copolymer further containing a repeating unit selected from the group consisting of It is also possible to get it. These polyetherimide copolymers have a number of references. No. 3,983,093 to Williams et al., cited as It is.

Polyetherimide has the formula: (wherein Z is as defined above) and an aromatic bis(ether anhydride) of the formula %formula% (wherein R is as defined above) with an organic diamine. It can be obtained by any method known to those skilled in the art.

The aromatic bis(ether anhydride) of the above formula is, for example, 2-bis[4-(2,3 -dicarboxyphenoxy)phenyl]brobanedianhydride, 4,4'-bis(2 ,3-dicarboxyphenoxy)diphenyl ether dianhydride; 1゜3-bis( 2,3-dicarboxyphenoxy)benzenedianhydride, 4,4'-bis(2,3 -dicarboxyphenoxy)penzophenone dianhydride, 4,4'-bis(2,3 -dicarboxyphenoxy)diphenylsulfone dianhydride; 2,2-bis[4- (3,4-dicarboxyphenoxy)phenyl]broban dianhydride, 4,4'- Bis(3,4-dicarboxy)diphenyl ether dianhydride; 4,4'-bis( 3,4-dicarboxy)diphenylsulfide dianhydride; 1,3-bis(3,4 -dicarboxyphenoxy)benzenedianhydride; 1,4-bis(3,4-dical Boxyphenoxy)benzenedianhydride; 4,4-bis(3,4-dicarboxyf) phenoxy)penzophenone dianhydride; 4-(2,3-dicarboxyphenoxy) -4'-(3,4-dicarboxyphenoxy)diphenyl-2,2-broban dianhydrides; and such dianhydrides.

Furthermore, the aromatic bis(ether anhydride) included in the above formula is Koton, M, M,; Florinski, F, S,; Be5sonovura, 1. ;Rudak .

v, A, P, (Instltute of Heteroorganlc Co 5pounds, Academy Sciences, U, S, S, R,) , U.S.S.R. (USSR) Patent No. 257.010 dated November 11, 1969 No. (filed May 3, 1987). Furthermore, the dianhydride is M, M., Koton, F., S., Florinski, Zh., Org., Khln. , 4(5)774(19[i8).

The organic diamine of the above formula is, for example, m-phenylenediamine, p-phenylene Diamine, 4.4'-diaminodiphenylpropane, 4.4'-diaminodi Phenylmethane, benzidine, 4,4'-diaminodiphenyl sulfide, 4. 4'-diaminodiphenyl sulfone, 4.4'-diaminodiphenyl ether , 1.5-diaminonaphthalene, 3.3'-dimethylbenzidine, 3.3'- Dimethoxybenzidine, 2,4-bis(β-amino-t-butyl)toluene, Bis(p-β-amino-t-butylphenyl)ether, bis(p-β-methyl- 〇-aminophenyl)benzene, 1,3-diaminotoluene, 2,6-diamino Toluene, bis(4-aminocyclohexyl)methane, 3-methylhebutamethylene diamine, 4,4-dimethylhbutamethylenediamine, 2,11-dodecanediamine Amine, 2,2-dimethylpropylenediamine, octamethylenediamine, 3- Methoxyhexamethylenediamine, 2,5-dimethylhexamethylenediamine, 2.5-dimethylhbutamethylenediamine, 3-methylhbutamethylenediamine , 5-methylnonamethylenediamine, 1,4-cyclohexanediamine, 1.1 2-octadecanediamine, bis(3-aminopropyl) sulfide, N-methy rubis(3-aminopropyl)amine, hexamethylenediamine, heptamethyl Diamine, nonamethylene diamine, decamethylene diamine, bis(3-amylene diamine) nopropyl)tetramethyldisiloxane, bis(4-aminobutyl)tetramethy and mixtures of such diamines.

Generally, the reaction is carried out using well-known solvents to carry out the interaction between the dianhydride and the diamine. For example, using 0-dichlorobenzene, m-cresol/toluene, etc. This can be done by using temperatures from 0.degree. C. to about 25.theta..degree.

Alternatively, the polyetherimide can be combined with any of the dianhydrides and the organic diamide. by melt polymerization with any of the components, i.e. by heating a mixture of these components to high temperatures. They can be produced by heating and mixing with each other at the same time. Generally, about Melt polymerization temperature in the range 200°C to 400°C, preferably in the range 230°C to 300°C degrees can be used. The reaction conditions and component ratios are determined based on the desired molecular weight, intrinsic viscosity, and solubility resistance. Varies widely depending on drug properties! - get. Generally for high molecular weight polyetherimides equimolar amounts of diamine and dianhydride are used, although in some cases some molar excess is used. (approximately 1 to 5 mol%) of diamine to form a polyetherimide with terminal amine groups. can be manufactured. Generally, useful polyetherimides are m-cresol greater than 0.2 dl/g, preferably 0.35-0. 60 or 0.7 dl/g or even higher.

Many methods for the production of polyetherimides include) Feath et al. No. 3,847,867, Williams U.S. Patent No. 3,847.869; No. 3,850,885 to Takekoshi et al., U.S. Pat. The methods disclosed in Patent No. 3.852゜242 and Patent No. 3,855,178 etc. Included. These disclosures include polyethers suitable for use in the formulations of the present invention by way of illustration. It is included as a reference for the purpose of teaching general and specific methods for the preparation of imides. I quote them in their entirety.

Polyamides suitable for use in the practice of this invention are well known and widely available. be. Basically, they have at least two carbon atoms between the amino group and the carboxylic acid group. by polymerizing monoamino-monocarboxylic acids or their lactams having elementary atoms. or a diamine containing at least 2 carbon atoms between two amino groups; by polymerizing with carboxylic acid in a substantially equimolar ratio; or limited to the above. When monoaminomonocarboxylic acid or its lactam is added in substantially equimolar proportions, It can be obtained by polymerization with an amine and a dicarboxylic acid. Zika Rubonic acid can be used in the form of its functional derivatives, such as esters or acid chlorides. Ru.

The term °substantially equimolar °proportions (of diamines and dicarboxylic acids) refers to strict equimolar proportions. is carried out in conventional techniques for the synthesis and stabilization of the viscosity of the resulting polyamide. It is used to include both equimolar ratios and ratios that deviate slightly from equimolar ratios.

The aforementioned monoamino-monocarboxylic acid or its lactate useful in the production of polyamide Examples of such compounds include 2 to 16 carbon atoms between the amino group and the carboxylic acid group. compounds, in which the carbon atom is combined with the -CONH- group in the case of lactams. shall form a ring. Specific examples of aminocarboxylic acids and lactams include: 6-aminocaproic acid, butyrolactam, pivalolactam, caprolactam, caprolactam Prill lactam, enantlactam, undecanolactam, dodecanelactam and and 3- and 4-aminobenzoic acids.

Diamines suitable for use in the production of polyamides include alkyl, aryl and alkyl. Includes aryl diamines.

For example, the diamine has the general formula: %formula% (wherein n is an integer from 2 to 16), such as trimester ethylenediamine, tetramethylenediamine, pentamethylenediamine, octame ethylene diamine and especially hexamethylene diamine; trimethyl hexamethylene diamine Amines: meta-phenylenediamine; meta-xylylenediamine, etc., and Includes things like those mentioned above.

Dicarboxylic acids are aromatic, such as isophthalic and terephthalic acids, or aliphatic. The aliphatic dicarboxylic acid can be of the formula: %formula% (wherein Y represents a ni-aliphatic group containing at least 2 carbon atoms) Examples of such acids are sebacic acid, octadecanedioic acid, superric acid, and glutaric acid. , pimelic acid and adipic acid.

These polyamides or nylons (i.e. they are often called nylons) ), for example, polypyrrolidone (nylon 4) Polycaprolactam (nylon 6) Polycapryllactam (Nylon 8) Polyhexamethylene adipamide (Nylon 8) Nylon 6.6) Polyundecanolactam (Nylon 11) Polydodecanelactam (Nylon 12) Polyhexamethylene Azerai (Nylon 6.9) Amide Polyhexamethylene diamine (nylon 6.10) polyhexamethylene isof Tal (nylon 6, I) amide Polyhexamethylene terephthal (nylon 6, T) amide Polymer of hexamethylene diamine and (nylon 6.12) n-dodecanedioic acid Mido and terephthalic acid and/or isophthalic acid and trimethylhexamethylenedi Polyamides obtained from amines, adipic acid and metaxylylene diamines polyamide, adipic acid, azelaic acid and 2,2-bis-(p-amino cyclohexyl)propane and terephthalic acid and 4) , 4'-diamino-dicyclohexylmethane. .

Copolymers of the aforementioned polyamides or prepolymers thereof also find use in the practice of this invention. Appropriate. These copolymers include: Hexamethylene adipamide/(nylon 6.6/6) caprolactam Hexamethylene adipamide/to (nylon 6° xamethylene-isophthalamide Do 6/61) Hexamethylene adipamide/He (Nylon 6° xamethylene 1/N) - Terephthalamide 6/6T) Hexamethyleneadipamide/to (Nylon 6 ゜Xamethylene-Azelaamide 6/6.9) Hexamethylene adipamide/ (Nylon 6゜Hexamethylene-Azelaumi 6/6.9/6) Do/Caprola Kutam A mixture of two or more of the polyamides or their initial polymers and/or Alternatively, copolymers are also within the scope of the invention.

Particularly preferred polyamides are polyamides 6; 6.6; 11; 12 and at least one Seed crystalline polyamide, e.g. 6; 6.6 and at least one amorphous polyamide 6°L, S, I, T; both are preferably polyamide. It is 6.6.

The use of the term “polyamide” in this specification and in the appended claims refers to It should also be understood that it is intended to encompass tough polyamides. Ru. Super-tough polyamide, or super-tough nylon (as it is commonly called), is a commercially available Commercially, for example, E.I. DuPont (registered trademark Zytel) ST resin), Wilson fiber fill (11son Fibcrrfl l) (! Nuwai (NY) Itsukita), Badishe (registered trademark Ultramide (UL) TRAMID resin), Allied (registered trademark CARPION) tree resins) and Celanese (7000 series resins); Epstein, U.S. Pat. No. 4,174,358, among others; Novak, U.S. Pat. U.S. Patent No. 4,474,927; ROura U.S. Patent No. 4.346,194 and Joffrlon, U.S. Pat. No. 4,251,644. Can be manufactured in accordance with the US patent. These super strong nylons are one type or another. one or more polymeric or copolymer elastomers in one or more polyamides It is manufactured by adding a reinforcing agent. Suitable toughening agents are described in the U.S. patents cited above. Caywood, J.R., U.S.A. Patent No. 3,884,882 and U.S. Patent No. 4,147,740 to Sνiget No. and Ga1lucci et al.'s “Preparatlon and Roaeti ons of Epoxy-Nod! fled Po1yet11ylene” , J, APPL, POLY, SC1, Volume 27, Pages 425-437 (19 82). Typically, these elastomeric polymers and Polymers can be linear or branched and include core-shell graft copolymers. Graft polymers and copolymers may be used, and their structure may include copolymerization or copolymerization. Interaction with polyamide matrix by grafting onto preformed polymers functional and/or active or highly polar groups that can react with or be attached to Increasing the toughness of polyamide polymers by combining monomers with It is characterized by

The blending ratio of polyetherimide to polyamide is usually about 5 to 95% by weight, preferably about 5 to 95% by weight of the former. or about 30-70% by weight, while the latter is about 95-5% by weight, preferably about 70% by weight. ~30% by weight. If the polyamide is less than 5% by weight, its solvent resistance The improvement effect is small; on the other hand, when the polyamide content exceeds 95% by weight, the heat distortion temperature and thermal properties such as dimensional stability tend to be poor.

The benefits of the present invention are realized in polyetherimide-polyamide blends in which the blends are desirable. an effective amount of a phenolic compound capable of reducing water absorption, an undesirable and harmful property; This can be achieved by blending compounds or phenolic polymers or oligomers. Ru. Suitable phenolic compounds, oligomers and polymers have the formula (a): -hydric, dihydric and polyhydric phenols and bisphenols and higher phenols of the formula (where n is 1.2 or 3 and m is 3.4 or 5) (n+m)-6; p is 1 or 2, and each r is 0.1 or 2, respectively. and each S is 0°1.2.3 or 4, respectively, as appropriate; t is 0,1.2.3 or 4; each R is hydrogen; halogen, such as bromine, chlorine, fluorine, etc.; e-c alkyl, CB'1g aryl or C-C arylalkyl group, ( Each of them may be substituted with a C1-C12 alkyl group or a halogen atom. and thereby the aryl group, if present, -0-1C1-03 alkylene or may be bonded by alkylidene or -802- bridging group. ) or a hydroxyaryl or alkylhydroxyaryl group; and each R' each includes a direct carbon-carbon bond or a respective halogen-substituted derivative; divalent alkyl, aryl, arylalkyl, hydroxyaryl or aryl alkylhydroxyaryl groups; divalent ester and amide groups; and ooo.

II II 11 1 -O-, -C-, -S-, -3-, -S-, -P-.

O A group consisting of crosslinking groups selected from the group consisting of Peter-containing crosslinking groups including -P-, etc. (b) along the oligomer or polymer chain or inM (i.e., unreacted) in the pendant phenolic groups attached to the chain or polymer chain. ) oligomeric and polymeric phenols with phenolic hydroxy groups; (provided that two phenolic rings on the phenol ring having a tertiary α-carbon atom (no phenolic hydroxy groups with adjacent alkyl groups) .

Examples of suitable mono-, di- and polyphenols according to formula I above include decanafthol. 2-butylphenol (secondary and tertiary), 4-tert-butylphenol, Thymol, 4-t-pentylphenol, octylphenol, nonylphenol dodecylphenol, 4-hydroxydiphenyl, 2-hydroxydiphenyl Al, alkyl-substituted hydroxydiphenyl (disclosed in West German Patent No. 1ji 1943230) ), 1-naphthol, 2-naphthol, benzylphenol, benzylphenol lucresol, 2-phenyl-2-(4-hydroxyphenyl)propane, 4- Hydroxydiphenyl sulfone, 4-hydroxydiphenyl ether, 2- and 4-cyclohexylphenol, resorcinol, hydroquinone, 1.2.4- Includes benzenetriol, chloroglucinol, and mixtures thereof . Particularly preferred are nonylphenol, dodecylphenol, and 2-hydroxybinol. phenyl and 2-phenyl-2-(4-hydroxyphenyl)propane .

Examples of suitable bisphenols and polyphenols according to formula H above include 2.2 -bis(4-hydroxyphenyl)propane; bis(4-hydroxyphenyl) Methane; 2゜2-bis(4-hydroxyphenyl)hebutane, 2.2-bis(3 -chloro-4-hydroxyphenyl)propane; 2,2-bis(3,5-dichloro) -4-hydroxyphenyl)propane; 2,2-bis(3,5-dibrom-4 -hydroxyphenyl)propane; 2,2-bis(3-methyl-4-hydroxy phenyl)propane; 4,4'-(p-phenylenediisopropylidene)bis( 2,6-xy-1nonol); 4,4'-(p-phenylenediisopropylidene) Bisphenol; methylene bisphenol; bisphenol; naphthalene diol 4.4'-cyclohexylidene bisphenol; α, α', α'-tris (4-hydroxyphenyl)-1,2,5-triisopropylbenzene; 2.2 -bis(3,5-dimethyl-4-hydroxyphenyl)sulfone, 2,2-bis (4-hydroxyphenyl)sulfone; 2,2-bis(2,4-dihydroxyphenyl) phenyl) sulfone (2). In particular, 2,2-bis(4-hydroxy Cyphenyl)propane is preferred.

Examples of suitable oligomeric and polymeric phenols include polyvinylphenol. and phenol formaldehyde resins (e.g. novolak and resol resins) can be given. Generally, such polymeric phenols have up to 40°000 , preferably having a number average molecular weight of about 400 to 30,000.

The amount of phenolic compound or polymer used in the practice of this invention limide-polyamide composition, preferably prepared without the use of phenol. Dimensional stability improved and reduced by at least 10% compared to similar compositions This is the amount that can provide good water absorption. Generally, the amount of phenol is from about 0.5 to about 30, preferably from about 1 to about 100 parts by weight of the mixture of 20, most preferably about 1.5 to about 10 parts by weight.

The specific amount of phenolic compound or polymer used may be due in part to the phenol itself. efficacy, the weight ratio of polyamide to polyetherimide in the resin mixture and the material preparation. It relates to the extractability of phenol during conditioning and/or processing.

The invention further provides additional thermoplastic polymers and/or polymeric or copolymeric impact resistant polymers. Can also be applied to polyetherimide-polyamide blends containing properties modifier resins It is something.

Suitable thermoplastic polymers that may be included in the formulations contemplated by the present invention include liimide, polyamideimide, polycarbonate, polyalkylene ether, polyamide Includes riesters and the like. All of these thermoplastic polymers are well known and widely used. It is readily available.

Suitable rubbery impact modifiers are also well known and widely available.

Examples of a number of rubbery impact modifiers encompassed within the scope of this invention include polyolefin Fins and copolyolefins such as polyethylene, polypropylene, ethylene - propylene copolymer, copolymer of ethylene with acrylic acid and alkyl acrylic acid Polymers, etc.; ethylene-propylene-diene monomer rubber (EPDM); diene rubber and copolymers such as polybutadiene, polyisoprene, styrene-butadiene nitrile copolymer, styrene-butadiene-styrene block copolymer, etc. polymers and copolymers, such as styrene-acrylonitrile, acrylonitrile-build Includes tajene-styrene type copolymers and the like. Appropriate rubbery impact resistance improvement Agents are described, inter alia, in U.S. Pat. No. 2,933,480; ; Same No. 3゜000.11166 - Same No. 3.093,620; Same No. 3゜093 ．． 621: Same No. 3,063,973; Same No. 3゜147.230; Same No. 3, No. 154,528; No. 3゜260.708 and “5tere” of S+ttig o Rubber and 0ther Elastonlc Process″s s”, Noyes Development Corporation, P ark RIdge, NJ (1987).

Optionally, the compositions of the invention also include one or more fillers and/or supplements. May contain strong agents. Examples of fillers and/or reinforcing agents include glass fibers, Carbon fiber, glass spheres, inorganic fillers including mica and silica, carbon black etc. can be given. If fillers and/or reinforcing agents are used, this do not exceed up to about 50% by weight of the composition, based on the total composition, preferably about 5%. It should constitute an amount of ~30% by weight.

Finally, the compositions of the invention may further include flame retardants, colorants, nucleating agents, anti-drip agents, Other ingredients such as stabilizers and the like are known in the art for conventional purposes. may be contained in an effective amount of

The compositions of the invention are made by any method known as melt blending. be able to. For example, the ingredients may be dry blended and extruded or mixed on a mill. It can be milled and ground, or it can be manufactured by extrusion compounding. Ru. Equipment suitable for this method is an extruder, Banbury mixer, roller, kneader. - etc. Furthermore, these compositions can be manufactured by continuous or batch methods. can do.

The following examples are presented to enable those skilled in the art to better understand how to practice the invention.

These examples are for illustrative purposes only and are not intended to limit the invention thereto. It's not something you do. All formulations are in parts by weight unless otherwise indicated.

All formulations were made using either a single screw or two wheel screenie extruder; Manufactured by extrusion at 250-300°C. mix all ingredients and supplied together. After drying the blended composition, it is injection molded to produce test parts. Ta. Moisture absorption and degree of swelling were measured for specimens immersed in deionized water at 75°C for approximately 40 hours. It was measured using The coupons were cooled to room temperature for testing.

Example 1-6. Comparative example A-B A series of Polyny'f sileimide polyamide blend compositions were prepared and covered within the scope of the present invention. The water absorption and swelling degree of parts molded from the composition include various phenolic compounds in demonstrated the ability to reduce The specific example formulations and results achieved using each of them The results are shown in Table 1.

Some of the phenolic compounds, particularly p-cumylphenol, were tested. Some variation in potency is observed at specific concentrations, but all compounds have a and the degree of swelling was clearly and significantly reduced. Higher percentage of p-cumylphenol It is thought that this would probably give an even greater improvement.

Example 7-9. Comparative example C 2,2-bis(4-hydroxyphenyl)propane (i.e. bisphenol A ) to demonstrate the effectiveness at various loadings of polyethers An imide-polyamide blend was prepared. achieved for the specific composition and each The results are shown in Table 2.

polyamide 6.6 50 50 50 50 polyetherimide a50 50 50 50 Bisphenol A 2 5 11 Weight increase %” 4.2 3.7 3.3 2.4 Swelling degree 8 mil/inch 9.0 8.3 7.2 3.9 (g) (20) (57) a and 8 - See footnotes to Table 1. Examples 10-12. Comparative example D-F The applicability of the present invention to various formulations of polyetherimides and polyamides has been demonstrated. For demonstration purposes, a final series of compositions were prepared. The specific formulation of each composition and its The results obtained are shown in Table 3.

Published Obviously, other modifications and variations of the present invention are possible in light of the above teachings. did Accordingly, the specific embodiments of the invention as described are as defined by the appended claims. It is understood that modifications may be made within the fully intended scope of the invention as described. should be understood.

international search report ANNEX TorlE INTER-NAτ工0hiAL 5EARCHR EPOR” 0NINT three ribs; AT! 0NAL:’LICATION No. To PCT 8S 87100263 (SA 16196) The Europe an　Patent　office　is　i*　:roway 1iab le for these parts which are me relay given for the purp mouth se offinforia tion.

Claims (1)

[Claims] 1. a) at least one polyetherimide; b) at least one polyamide and c) unreacted phenolic hydrogen along the chain, which may provide the improvements described below. Oligomeric and polymeric phenols and ( ii) Formulas: (I) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ and (II) ▲ Mathematical formulas, chemical formulas, etc. There are formulas, tables, etc. ▼ (In both formulas, n is 1, 2 or 3, and m is 3, 4 or 5. and (n+m)=6; p is 1 or 2, and each r is 0, 1 or is 2 and each s is 0, 1, 2, 3 or 4, respectively; t is 0, 1 , 2, 3 or 4; each R is hydrogen; halogen, C1-C16 alkyl , C6-C18 aryl or C7-C20 arylalkyl group, each of which has C1 -C12 alkyl group or halogen atom optionally substituted and thereby , the aryl group, if present, is -O-, C1-C3 alkylene or alkylide or -SO2- bridging group) or hydro xaryl or alkylhydroxyaryl; and each R' is A divalent alkali containing a direct carbon-carbon bond or a halogen-substituted derivative of each Kyl, aryl, arylalkyl, hydroxyaryl or alkylhydroxy Sialyl group; divalent ester and amide group; and -O-, ▲ mathematical formula, chemical formula, table There are ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ There are mathematical formulas, chemical formulas, tables, etc. There are ▼, -S-, ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼, ▲ Mathematical formulas, chemical formulas, tables, etc. From the cross-linking group selected from the group consisting of hetero-containing cross-linking groups including ▼ etc. monohydric, dihydric and polyhydric phenols represented by At least one phenolic additive selected from the group of Phenolic hydride with two adjacent alkyl groups on the phenolic ring with atoms (Assume there is no roxy group) modified with reduced water absorption and improved swelling resistance when exposed to moisture containing polyetherimide-polyamide composition.