JPH0140457B2 - - Google Patents
Info
- Publication number
- JPH0140457B2 JPH0140457B2 JP55080202A JP8020280A JPH0140457B2 JP H0140457 B2 JPH0140457 B2 JP H0140457B2 JP 55080202 A JP55080202 A JP 55080202A JP 8020280 A JP8020280 A JP 8020280A JP H0140457 B2 JPH0140457 B2 JP H0140457B2
- Authority
- JP
- Japan
- Prior art keywords
- electron tube
- cathode assembly
- tube cathode
- core metal
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000002474 experimental method Methods 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 229910000760 Hardened steel Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/04—Manufacture of electrodes or electrode systems of thermionic cathodes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
Description
【発明の詳細な説明】
本発明は電子管陰極組立体の製造方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electron tube cathode assembly.
一般に、電子管陰極組立体は第1図に示すよう
に、Ni−Cr合金よりなるスリーブ1の一端部に
Niよりなるデイスク2が、他端部に天頂面にカ
ソード材が設けられたNiよりなるキヤツプ3が
それぞれ溶接により固定されている。そして、溶
接部の厚さはスリーブ1が21μm、デイスク2が
100μm、キヤツプ3が50μmと非常に薄く、また
これらの部材間の溶接前の嵌合ギヤツプは30〜
60μmと非常に大きい。 Generally, as shown in Fig. 1, the electron tube cathode assembly is mounted on one end of a sleeve 1 made of Ni-Cr alloy.
A disk 2 made of Ni is fixed to the other end by welding, and a cap 3 made of Ni and having a cathode material provided on its zenith surface is fixed to the other end. The thickness of the welded part is 21μm for sleeve 1 and 21μm for disk 2.
100μm, cap 3 is very thin at 50μm, and the fitting gap between these parts before welding is 30~30μm.
It is very large at 60μm.
従来、かかる電子管陰極組立体の組立には主に
抵抗溶接法が用いられているが、この溶接法はち
り発生などにより安定した溶接状態が得られな
い。これに対し、レーザ溶接法は非接触熱源のた
め、部品変形、汚れ、ちりなどが発生しないの
で、最近微小溶接に使われつつある。この微小溶
接は一般に1.06μm波長のNd−YAGレーザを用
い、5〜10msのパルス幅で行なわれている。し
かるに、前記の如く電子管陰極組立体の部材厚は
20〜100μmと非常に薄く、また嵌合ギヤツプが
30〜60μmと非常に大きいので、前記したレーザ
溶接条件では安定した溶接状態が得られなく、
時々つかないものあるいは開孔が生じる欠点があ
つた。また従来、スリーブ1、デイスク2、キヤ
ツプ3を位置決めする芯金はスリーブ1に嵌合す
るストレート形状よりなり、その材質は熱伝導率
の良いCr−Cu合金、W−Cu合金などが用いられ
ている。しかしながら、これらの材質は比較的柔
かいので、自動組立において熱が繰返し作用され
て芯金が摩耗、変形、溶融し、電子陰極組立体の
組立精度が悪くなると共に、芯金の融けた部分が
スリーブ1に付着するなどの欠点があつた。 Conventionally, resistance welding has been mainly used to assemble such electron tube cathode assemblies, but this welding method does not provide a stable welding condition due to dust generation and the like. On the other hand, since laser welding uses a non-contact heat source, it does not cause part deformation, dirt, dust, etc., so it has recently been used for micro-welding. This microwelding is generally performed using an Nd-YAG laser with a wavelength of 1.06 μm and a pulse width of 5 to 10 ms. However, as mentioned above, the member thickness of the electron tube cathode assembly is
It is extremely thin at 20 to 100 μm, and the mating gap is
Since it is very large at 30 to 60 μm, stable welding conditions cannot be obtained under the laser welding conditions described above.
There was a drawback that sometimes it did not stick or there were holes. Conventionally, the core metal for positioning the sleeve 1, disk 2, and cap 3 has a straight shape that fits into the sleeve 1, and its material is made of Cr-Cu alloy, W-Cu alloy, etc., which have good thermal conductivity. There is. However, since these materials are relatively soft, heat is applied repeatedly during automatic assembly, causing wear, deformation, and melting of the core metal, resulting in poor assembly accuracy of the electron cathode assembly, and the melted portion of the core metal becoming attached to the sleeve. There were drawbacks such as adhesion to 1.
そこで、本発明の第1の目的は、芯金が変形、
溶融などすることなしにレーザ溶接により組立る
ことができる電子管陰極組立体の製造方法を提供
するにある。 Therefore, the first object of the present invention is to prevent the core metal from deforming.
An object of the present invention is to provide a method for manufacturing an electron tube cathode assembly that can be assembled by laser welding without melting or the like.
また本発明の第2の目的は、良好なレーザ溶接
状態が得られる電子管陰極組立体の製造方法を提
供するにある。 A second object of the present invention is to provide a method of manufacturing an electron tube cathode assembly that allows good laser welding conditions to be obtained.
以下、本発明を図示の実施例により説明する。
第2図は本発明になる電子管陰極組立体の製造方
法の一実施例を示す説明図である。芯金4はレー
ザ光5によつて溶接される溶接点の裏側の部分が
小径に形成された逃げ部4aを有している。そこ
で、芯金4によつてスリーブ1、デイスク2、キ
ヤツプ3をそれぞれ位置決めし、レーザ光5によ
つて溶接すると、熱は逃げ部4aによつて発散さ
れ、またレーザ熱が直接芯金4に伝達されないの
で、芯金4の溶融、変形が防止されると共に、芯
金4がスリーブ1に付着することも防止される。
ここで、芯金4の材質は従来と同様にCr−Cu合
金、W−Cu合金などを用いてもよいが、焼入鋼
を用いると剛性が向上し、組立精度は更に良くな
る。 Hereinafter, the present invention will be explained with reference to illustrated embodiments.
FIG. 2 is an explanatory diagram showing an embodiment of the method for manufacturing an electron tube cathode assembly according to the present invention. The core metal 4 has a relief part 4a formed with a small diameter on the back side of the welding point to be welded by the laser beam 5. Therefore, when the sleeve 1, disk 2, and cap 3 are each positioned by the core metal 4 and welded by the laser beam 5, the heat is dissipated by the relief part 4a, and the laser heat is directly applied to the core metal 4. Since there is no transmission, melting and deformation of the core metal 4 is prevented, and adhesion of the core metal 4 to the sleeve 1 is also prevented.
Here, the material of the core metal 4 may be a Cr-Cu alloy, a W-Cu alloy, etc. as in the past, but if hardened steel is used, the rigidity will be improved and the assembly precision will be further improved.
そこで、かかる芯金4を用いて安定した溶接状
態を得るため、第1図で説明した電子管陰極組立
体の寸法条件で、またレーザ光の焦点位置をアン
ダーフオーカスにしてレーザ溶接条件を種々代え
て実験したところ、次のような効果が得られた。 Therefore, in order to obtain a stable welding condition using such a core metal 4, various laser welding conditions were used, with the dimensional conditions of the electron tube cathode assembly explained in FIG. As a result of the experiment, the following effects were obtained.
まず、集束レンズf=40mm、パルス幅7msec、
焦点ずらし量0.5mm、出力エネルギー0.4Juleとし
て実験を行なつた結果、過半数は良好な溶接状態
が得られたが、たまに開孔するものがあつて安定
しなく、また十分ではなかつた。 First, focusing lens f = 40 mm, pulse width 7 msec,
As a result of conducting experiments with a focus shift of 0.5 mm and an output energy of 0.4 Joule, a good welding condition was obtained in the majority of the cases, but occasionally holes were formed, making it unstable and not sufficient.
次に上記実験と焦点レンズ、焦点ずらし量は同
一条件で、パルス幅を0.8msecと非常に小さく、
出力エネルギーを0.6Juleとして100個実験した結
果、全数良好な結果が得られた。 Next, the focusing lens and focus shift amount were the same as in the above experiment, and the pulse width was very small at 0.8 msec.
As a result of 100 experiments with an output energy of 0.6 Joule, good results were obtained for all of them.
このようにして種々実験を重ねた結果、焦点ず
らし量が0.2〜1.5mmの範囲で最良の溶接状態が得
られるパルス幅は0.5〜1.5msecであることが判明
した。ここで、パルス幅が1.5msec以上である
と、開孔するものおよび溶接しないものが生じ
た。 As a result of various experiments conducted in this way, it was found that the pulse width that provides the best welding condition when the amount of focus shift is in the range of 0.2 to 1.5 mm is 0.5 to 1.5 msec. Here, when the pulse width was 1.5 msec or more, some holes were opened and some were not welded.
以上の説明から明らかな如く、本発明になる電
子管陰極組立体の製造方法によれば、レーザ溶接
点の裏側に逃げ部が設けられた芯金を用いて溶接
するので、芯金が溶融、変形などすることがな
く、また溶接部品が芯金に付着することも防止さ
れ、品質的に優れた製品が得られる。またレーザ
光の焦点位置をアンダーフオーカスとして用いる
ので、融す範囲が大となり、嵌合ギヤツプが大き
くてもギヤツプが埋められ、またパルス幅を0.5
〜1.5msecと非常に小さくして用いるので、薄い
部品も開孔することがないなどにより、良好な溶
接状態が得られる。 As is clear from the above description, according to the method for manufacturing an electron tube cathode assembly according to the present invention, welding is performed using a core metal with a relief part provided on the back side of the laser welding point, so the core metal melts and deforms. This also prevents the welded parts from adhering to the metal core, resulting in a product of excellent quality. In addition, since the focal position of the laser beam is used as an underfocus, the melting range is large, and even if the fitting gap is large, the gap can be filled, and the pulse width can be reduced by 0.5.
Since the welding time is extremely small at ~1.5 msec, a good welding condition can be obtained because even thin parts will not have holes.
第1図は電子管陰極組立体の一例を示す断面
図、第2図は本発明になる電子管陰極組立体の製
造方法の一実施例を示す説明図である。
1……スリーブ、2……デイスク、3……キヤ
ツプ、4……芯金、4a……逃げ部、5……レー
ザ光。
FIG. 1 is a sectional view showing an example of an electron tube cathode assembly, and FIG. 2 is an explanatory view showing an embodiment of the method for manufacturing the electron tube cathode assembly according to the present invention. 1... Sleeve, 2... Disk, 3... Cap, 4... Core metal, 4a... Relief portion, 5... Laser light.
Claims (1)
金を用いて電子管陰極組立体の組立部品を位置決
めし、レーザ光により電子管陰極組立体を容接固
定する電子管陰極組立体の製造方法において、前
記レーザ光はパルス幅を0.5〜1.5msecとし、焦点
位置をアンダーフオーカスにして用いることを特
徴とする電子管陰極組立体の製造方法。1. In a method of manufacturing an electron tube cathode assembly, the assembly parts of the electron tube cathode assembly are positioned using a core metal having a relief part formed on the back side of the laser welding point, and the electron tube cathode assembly is receptively fixed by laser light, A method for manufacturing an electron tube cathode assembly, characterized in that the laser beam is used with a pulse width of 0.5 to 1.5 msec and with an underfocused focal position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8020280A JPS577042A (en) | 1980-06-16 | 1980-06-16 | Manufacture of electron gun cathode assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8020280A JPS577042A (en) | 1980-06-16 | 1980-06-16 | Manufacture of electron gun cathode assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS577042A JPS577042A (en) | 1982-01-14 |
JPH0140457B2 true JPH0140457B2 (en) | 1989-08-29 |
Family
ID=13711792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8020280A Granted JPS577042A (en) | 1980-06-16 | 1980-06-16 | Manufacture of electron gun cathode assembly |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS577042A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58186951A (en) * | 1982-04-24 | 1983-11-01 | Toshiba Corp | Packaging method for electronic part |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5074962A (en) * | 1973-11-02 | 1975-06-19 | ||
JPS50103250A (en) * | 1974-01-11 | 1975-08-15 |
-
1980
- 1980-06-16 JP JP8020280A patent/JPS577042A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5074962A (en) * | 1973-11-02 | 1975-06-19 | ||
JPS50103250A (en) * | 1974-01-11 | 1975-08-15 |
Also Published As
Publication number | Publication date |
---|---|
JPS577042A (en) | 1982-01-14 |
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