JPH01319938A - Method and device for exfoliating thin segment - Google Patents

Abstract

PURPOSE:To exfoliate a semiconductor wafer from an abrasive board and hold it with catches by inserting two or more catches being distance-adjustable from both surfaces of a semiconductor wafer, between the semiconductor wafer and the abrasive board. CONSTITUTION:A catch 10 is moved backward so that the distance between catches 10 and 11 may become larger than a semiconductor wafer 21 by rotating the knob 5. After that, the catches 10 and 11 are applied to an abrasive board 22. Then, the distance between catches 10, 11 is narrowed by rotating the knob 5 reversely, and the periphery of the wafer 21 is grasped. As the distance between the catches 10, 11 is made narrower, exfoliation occurs inside wax 13 at the peripheral part of the wafer 21 grasped with the catches, in a state that the wax 13 softened with the inclined planes of the catches 10, 11 attaches to the wafer 21. This makes the wafer 21 exfoliate from the abrasive board 22 and the wafer 21 is held with the catches 10, 11.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is a method of fixing a thin piece of a semiconductor wafer or the like to a polishing plate using an adhesive such as wax and polishing it, and then peeling the thin piece from the polishing plate after polishing is completed. How to do it is related.

[Conventional technology]

A conventional flake peeling method will be explained with reference to FIGS. 4 to 6.

FIG. 4 is a diagram showing a state in which a plurality of semiconductor wafers are adhered to a polishing plate, and FIGS.
2 is a semiconductor wafer, 22 is a polishing plate, 23 is a spatula, 24 is a vacuum bottle set, and 25 is a spatula.

Clean open the polishing plate 22 and wax (not shown)
A plurality of semiconductor wafers 21 are bonded to the surface of the polishing plate 22 using softened wax as shown in FIG.
The semiconductor wafer 21 is polished with a polisher (not shown).

After polishing, the semiconductor wafer 21 is washed and dried together with the polishing temporary 22, and heated in a clean oven (not shown) to soften the wax.

As shown in FIG. 5, the semiconductor wafer 21 was pushed out to the edge of the polishing plate 22 using a spatula 23, and was picked up from the polishing plate 22 using vacuum tweezers 24.

Alternatively, as shown in FIG. 6, as shown in FIG. 6, a spatula 25 with a thin tip is inserted between the polishing temporary 22 and the semiconductor wafer 21 while the polishing plate 22 is at room temperature or in a cooled wax state. The semiconductor wafer 21 was being peeled off.

[Problem that the invention seeks to solve]

In this conventional method of peeling off semiconductor wafers using a spatula, when the semiconductor wafer is moved by sliding it against the polishing pad, the back side of the semiconductor wafer may be scratched, resulting in a defective product, and the wax may harden. If the semiconductor wafer is forcibly separated by 71 degrees in this state, there is a risk of it being crushed. Furthermore, handling of the semiconductor wafer after separation is unstable because it is a thin piece, and if there is an error in holding the semiconductor wafer, there is a possibility that the semiconductor wafer will be broken or chipped.

The present invention is intended to solve the above-mentioned problems, and provides a method and device for peeling off a thin piece, which can safely peel off a semiconductor wafer and can reliably hold and move the semiconductor wafer after peeling. With the goal.

[Means for solving problems]

In the present invention, a thin piece adhered to a polishing plate is peeled off from the polishing plate by inserting a plurality of claws with thinned ends from the end face of the thin piece between the thin piece and the polishing plate, and the thin piece is held by the claws! F, lI fi method, two or more claws facing each other on the same plane and provided with a recessed portion having a slope and a slope at the lower part of the opposing surface, and a distance adjustment means for adjusting the interval between the two or more claws. Prepared flakes? , i+ separation device, further comprising a drive unit that drives the distance adjustment means, a sensor that detects the peeling state, and a control device to which a sensor detection signal is input and controls the drive unit, and the peeling state is monitored by the control device. This feature is characterized by a flake peeling device that automates f, +1 separation work by controlling the drive unit.

[Effect]

In the present invention, by inserting two or more claws whose distance can be adjusted from both sides of the semiconductor wafer between the semiconductor wafer and the polishing plate, the semiconductor wafer can be peeled off from the polishing plate and held by the claws. At the time of peeling, the adhesive may or may not be softened by heating, and whether or not it should be softened is selected as appropriate depending on the properties of the wafer and wax.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing one embodiment of a peeling device according to the present invention, in which (A) is a plan view, (B) is a longitudinal sectional view, and
The figure is a diagram showing a peeling operation procedure according to this embodiment.

In addition, in the figure, the same numbers as in FIG. 4 indicate the same contents, 1 is the head, 2 is the head body, 3 is the feed screw, 4 is the spindle, 5 is the knob, 6 is the pin, 7 is the keyway, and 8 is the key, 9
10.11 is a claw, 12 is an arm, and 13 is wax.

In Fig. 1, the head 1 consists of a hollow head body 2 with one end closed, a feed screw 3 built into the head body 2, and the main parts of a spindle 4. One of the feed screws 3 has a male thread on its outer periphery. The other end of the feed screw 3 passes through the head body 2, and the knob 5 is fixed to the feed screw 3 with a pin 6. The spindle 4 has a key groove 7 that fits into a key 8 provided in the head body 2, and by turning the knob 5, the spindle 4 can be smoothly moved in the axial direction without rotating within the head body 2 via the feed screw 3. do. Also, the other end of the spindle 4 has a claw IO.
The arm 1 is fixed to the head body 2.
A pawl 11 is fixed opposite to the pawl 10 via 2. The concave portions of the claws 10 and 11 made of fluorinated ethylene resin or other mechanically strong material have approximately the same curved portion as the circumference of the semiconductor wafer 21 and are on the same plane. When the head 11 is rounded on the polishing plate 22, the claw lO and the head l
The distance from the central axis is °C. Furthermore, the claws IO are made as large as the claws 11 so that the semiconductor wafer 21 is stabilized when the semiconductor wafer 21 is grasped and lifted by the claws 10 and 11.

Next, the #lIN work procedure will be explained with reference to FIG.

Wax 1 with semiconductor wafer 21 bonded to polishing plate 22
3 in a clean oven to soften it (Fig. 2 (A)), turn the knob 5 (Fig. 1) to move the claw 10 back so that the distance between the claws 10 and 11 is larger than that of the semiconductor wafer 21. After that, the claws 10 and 11 are placed on the polishing plate 22 (FIG. 2 (b)). Next, the knob 5 is rotated in the opposite direction to narrow the gap between the claws 10 and 11, and the semiconductor wafer 21 is
When grasping the surroundings of the semiconductor wafer 21 and further narrowing the distance between the claws 10 and 11, a portion of the wax 13 softened by the sloped surface of the claws is attached to the wafer in the peripheral area grasped by the claws of the semiconductor wafer 21. 41 separation occurs in the wax (Fig. 2 (c)), and as time passes, 7.11 separation 5
It spreads and finally the entire surface is in the wax! , (+ Release (FIG. 2(d)). The semiconductor wafer 21 peeled off from the polishing plate 22 is moved to a predetermined location together with the peeling device.

Although the above embodiment describes an example in which the wax is heated to soften it, it is also possible to peel it off without softening it, and whether it softens or not depends on the thickness of the wafer, the material, etc.
Further, it may be selected appropriately depending on the properties of the wax.

In addition, in the above embodiment, an example was explained in which the wafer is gripped by hooking the claw on the tip side onto the semiconductor wafer and pushing the claw on the front side. It may be gripped by pulling the side claws closer together, or it may be gripped by both claws simultaneously narrowing the distance between them.

Note that the number of claws may be two or more. If so, it goes without saying that the shapes of the four parts of the claws 10 and 11 may be linear.

FIG. 3 is a diagram showing an embodiment of automating peeling according to the present invention. In the figure, 31 is a control device, 32 is a drive unit, and 33 is a sensor.

The drive unit 32 includes, for example, a motor, and a sensor 33 consisting of a torque sensor or a rotational speed sensor is disposed on the second head 1 which drives the head 1 to grip the semiconductor wafer 1- with the claws 9.11. Since the torque of the spindle increases when the pawl engages with the semiconductor wafer, either the torque is detected to detect the state of engagement between the pawl and the semiconductor wafer, or the rotation speed of the feed screw 3 and the amount of displacement of the pawl are proportional to each other. Therefore, the amount of displacement of the claw is detected by detecting the number of revolutions. sensor 33
The detection signal is transferred to the control device 31.

The control device 31 stores in advance a table of driving torque or rotational speed when peeling a semiconductor wafer, for example, according to the semiconductor wafer size, and by reading this and comparing it with the detection signal, peeling is completed. It is determined whether the peeling is completed or not, and the conveyance to the next process is carried out when the peeling is completed. It goes without saying that it is possible to detect both i-lux and rotational speed instead of either one, and the peeling state may be detected optically or electrically.

In this way, it becomes possible to automate the peeling operation of polished semiconductor wafers.

〔Effect of the invention〕

As described above, according to the present invention, scratches may occur on the back surface of the semiconductor wafer when the semiconductor wafer is slid against the polishing material, and Jl+ may occur when the semiconductor wafer is forcibly peeled off while the adhesive is hardened. The semiconductor wafer can be peeled off from the polishing plate without fear of being damaged, and can be handled in subsequent processing steps while being grasped by the peeling device. In addition, by installing a detector in the T1 separation device, it is possible to automate the separation work of semiconductor wafers.
It becomes possible to improve productivity.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an embodiment of a peeling device according to the present invention, in which (A) is a plan view, (B) is a longitudinal cross-sectional view, and FIG. 2 is a diagram showing a peeling operation procedure according to this embodiment , FIG. 3 is a diagram showing an embodiment of automating peeling according to the present invention, FIG. 4 is a diagram showing a state in which a plurality of semiconductor wafers are bonded to a polishing plate, and FIG.
6 and 6 are diagrams showing a procedure for peeling a semiconductor wafer using a conventional peeling spatula. l...Head, 2...Head body, 3...Feed screw, 4...Spindle, 5...Knob, 6...Pin, 7...Key groove, 8...Key , 9...Claw metal fitting, l0111...Claw, 12...Arm, work 3...
Wax, 21... Semiconductor wafer, 22... Polishing plate, 23. 25... Spatula, 24... Vacuum tweezers, 31... Drive unit, 32... Torque sensor, 33...
... Rotation speed sensor, 34... Control device. Applicant Mitsubishi Monsanto Chemical Co., Ltd. (1 other person) Representative patent attorney Masanobu Hirukawa (4 others) Figure 1 (A) Figure 2 District 3

Claims (4)

[Claims] (1) A thin piece adhered to an abrasive plate is peeled from the abrasive plate by inserting a plurality of claws with thinned ends from the end face of the thin piece between the thin piece and the abrasive plate, and is held by the claws. Delamination method. (2) Two or more claws facing each other on the same plane, each having a recessed portion having a thin and sloped lower part on the opposing surface, and a distance adjustment means for adjusting the interval between the two or more claws. Characteristic flake peeling device. (3) The flake peeling device according to claim 2, wherein the horizontal shape of the recess of the claw follows the outer shape of the flake. (4) two or more claws that face each other on the same plane and have recesses with thin and sloped lower portions on the opposing surfaces; a distance adjustment means for adjusting the interval between the two or more claws; and a distance adjustment device. A drive unit that drives the means, a sensor that detects a peeling state,
What is claimed is: 1. A flake peeling apparatus comprising: a control device to which a sensor detection signal is input and which controls a drive section; the control device controls the drive section while monitoring the peeling state to automate a peeling operation.