JPH01310593A - Circuit element forming substance of hybrid ic substrate - Google Patents

Abstract

PURPOSE:To improve a circuit element forming substance raw material in affinity for an organic solvent and increase a circuit forming solution in a solid content when the circuit forming solution is prepared so as to improve a dispersion in stability with time by a method wherein particle faces of the circuit element forming substance raw material are coated with polymer. CONSTITUTION:Microparticles formed of particles of circuit element forming substance raw material whose surfaces are coated with polymer are dispersed into an organic solvent of low vapor pressure to form a circuit forming solution. Therefore, not only the microparticles are improved in dispersion stability but also the circuit forming solution hardly causes clogging of a ink jet nozzle. And, the circuit forming solution can be optionally varied in a solid content and increased in a metal content, so that a circuit pattern of low sheet resistance can be formed, and moreover microparticles tens nm in diameter whose surfaces are coated with polymer can be manufactured. By this process, the stability of a dispersion with time can be improved.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a circuit element formed material ejected from an inkjet head when forming a circuit pattern of a hybrid IC on a circuit board using an inkjet head. be.

[Prior Art] In the circuit formation of a hybrid IC, the present applicant discharges droplets containing dissolved circuit elements onto a substrate using an inkjet head, and draws a circuit pattern on the same substrate on the same night. proposed a method of bonding circuit patterns to substrates by baking them.

The circuit forming solution used in the inkjet method is neodecane IS! A solution prepared by dissolving an organometallic compound such as silver in a non-polar astringent solvent such as xylene was used.

Cq H,? cOOH+NH40H → C, H,? coONH4,+820C9+-1,,
C○ONH 斗 +A CI NO.

Since an organic solvent with a relatively high vapor pressure is used to dissolve the inkjet head, there is a problem that the nozzle of the inkjet head is easily clogged. Furthermore, since the paid metal compound is a metal salt of a carboxylic acid having a long alkyl chain, there is a problem in that it is difficult to increase the metal content in the solution and the sheet resistance increases.

Therefore, in order to solve the above problem, the present applicant evaporates the raw material for forming circuit elements in a vacuum, and collects the evaporated fine particles as ultrafine particles for forming circuit elements using a recovery liquid with low vapor pressure. We are proposing a circuit forming liquid in which the same particles are dispersed in the recovered liquid or other solvent.

[Problems to be Solved by the Invention] However, since the surface of these ultrafine particles was not subjected to any fast-balling, in the circuit forming liquid in which the ultrafine particles were dispersed, when the ultrafine particles were dispersed in a dispersion medium, However, there was a problem in that it was very easy to coagulate and precipitation of the circuit element formed product was likely to occur.

The object of the present invention is to provide a circuit forming liquid that can prevent clogging of nozzles of an inkjet head and to arbitrarily change the metal content, and a circuit element formed for a hybrid IC substrate that has good dispersibility in the forming liquid. An object of the present invention is to provide a method for manufacturing the same.

[Means for Solving the Problems] In order to solve the above problems, the present invention was constructed as follows.

The particle surface of the circuit element formed product was coated with a polymer to obtain a circuit element formed product of a hybrid IC substrate.

Further, a circuit forming liquid for a Hybrid 11 board was prepared by dispersing the ultrafine particles of the circuit element formed in a liquid containing a low vapor pressure organic solvent.

In addition, as a method for producing the ultrafine particles of the circuit element formation, a 7-mer gas is diffused into the atmosphere of the core particle of the circuit element formation, and it is excited to a plasma state to cause a polymerization reaction on the surface of the core particle. We adopted a method of polymer coating.

The apparatus used for manufacturing the ultrafine particles of the circuit element formation includes a chamber whose pressure is reduced by a pressure reduction means, a particle generation means arranged in the chamber and which converts the raw material of the circuit element formation into core particles, It was announced that ultrafine particles of circuit element formations would be produced, which consists of a monomer gas introduction means for introducing monomer gas into the chamber, and an excitation means for exciting the introduced monomer gas and producing polymerization active species.

[Function] As mentioned above, the ultrafine particles whose particle surfaces of the circuit element forming raw material 1 are coated with a polymer have good affinity with precipitated solvents,
In addition, when dispersed in an organic solvent, coagulation of ultrafine particles does not occur, and the dispersibility is good (it may be slightly weaker. Therefore, it is possible to increase the solid content when preparing a circuit forming liquid, and the dispersion liquid The chronological quality of the test is also good.

In addition, by making it possible to disperse the circuit forming liquid in a liquid containing a low vapor pressure organic solvent, the viscosity stability of the circuit forming liquid is improved, making it possible to spray stably with an inkjet nozzle, and Since the solvent does not evaporate and circuit element formation materials do not accumulate, nozzle clogging does not occur.

In addition, when a 7-mer gas is diffused into the core particle atmosphere of the circuit element formation and excited to a plasma state, the monomer excited to the plasma state and the unexcited monomer as polymerization active species become the raw material particles that become the core. It adheres to the surface and a polymerization reaction proceeds on the particle surface, producing ultrafine particles of circuit element formation whose surfaces are coated with polymer.

In addition, in the ultrafine particle manufacturing apparatus described above, monomer gas is introduced into the chamber by the monomer gas introducing means, and this is excited to a plasma state by the excitation means, and
The Zimmer gas and the raw material core particles are mixed in a chamber to induce a polymerization reaction on the surface of the raw material core particles to produce the ultrafine particles.

[Embodiment 1] An embodiment embodying the present invention will be described below with reference to the drawings.

FIG. 1 shows the basic configuration of a manufacturing device for circuit element formations,
The chamber 1 has a discharge port 2 formed at its bottom, and communicates with a vacuum decompression device V as a pressure reduction means through the discharge port 2. Then, the pressure inside the chamber 1 is reduced by the same pressure reducing device V. An evaporator 3 as a dish-shaped particulate means made of molybdenum (MO) or tungsten (W) is disposed inside the chamber 1, and the evaporator 3 is connected to electrodes 4a and 4b provided on both side walls of the chamber 1 and electrically. A voltage from a heating power source 5 provided outside the chamber 1 is applied to the evaporator 3 via electrodes 4a and 4b.

The evaporator 3 contains Au, A(+, Cu,
Pd.

Raw metals such as Ru, Ta, etc. for forming circuit elements are accommodated, and the heating causes the raw metals to turn into vapors such as fine metal particles and scatter into the chamber 1. Note that a grounded electric pole tfi 6 is disposed below the evaporator 3, and this @ pole 6 is cooled by a cooling device (not shown).

At the center of the chamber 1, a monomer gas inlet 7 is arranged as a seven-day gas supply means. The monomer gas inlet 7 contains styrene and MMA in the chamber 1.
(methyl methacrylate), propylene, etc.

A plasma generating section 8 is installed in the upper part of the chamber 1, and a high frequency is applied from a high frequency generator as excitation means, which is provided outside the chamber 1 and includes a high frequency power source 9, a matching box 10, and the like.

A carrier gas inlet 11 as a carrier gas introducing means is provided in the plasma generating section 8, and a carrier gas such as argon, nitrogen, oxygen, hydrogen, etc. is introduced from the inlet 11. These introduced carrier gases are excited to a plasma state by high frequency, and the carrier gas excited to the plasma state converts the 7-mer gas introduced from the 7-mer gas inlet 7 into polymerization active species such as radicals or ions. .

A mesh electrode 12 is disposed at an intermediate position between the evaporator 3 and the monomer gas inlet 7, so that the polymerization reaction takes place near the monomer gas inlet 7.

Next, a method for producing ultrafine particles of gold (Au>) using the apparatus for producing ultrafine particles of a circuit element formed as described above will be explained.

With gold (AU) placed in the evaporator 3 and the pressure inside the chamber 1 being reduced by the vacuum depressurizer V, the gold in the evaporator 3 is heated by the heating power source 5 to turn the gold into vapor and put it into the chamber 1. scatter.

On the other hand, argon gas is introduced into the chamber 1 from the carrier gas inlet 11 as a carrier gas, and styrene is introduced into the chamber 1 from the monomer gas inlet 7 as a monomer gas. At this time, the argon gas is excited to a plasma state in the plasma generating section 8 by high frequency waves from a high frequency generator including a high frequency power source 9, a matching box 10, and the like. The argon excited to a plasma state collides with the styrene as the monomer and converts the styrene into polymerization active species such as radicals or ions.

The styrene monomer and styrene excited into radicals or ions, and the polymerization active species adhere to the surface of the ultrafine gold particles evaporated and scattered from the evaporator 3, and a polymerization reaction proceeds on the particle surface.

As a result, the surface of the gold fine particles is covered with polystyrene, that is, the gold particles become ultrafine particles coated with a polymer. The ultrafine particles coated with the polymer are then discharged out of the chamber 1 through the discharge port 2 by suction from the vacuum decompression device V and collected.

The collected ultrafine particles are converted into α-
Terpineol or butylcarpitol acetate (
It is dispersed in a low thermopressure organic solvent such as BCA) and becomes a circuit forming liquid.

The ultrafine gold (AU) particles produced as described above have a particle diameter of several tens of nanometers and have extremely good dispersibility in a solvent. Moreover, since the particle surface is coated with a polymer called polystyrene, it has good affinity for organic solvents and is difficult to coagulate. Of course, even if the coated ultrafine particles of different metals are dispersed in each intercalation, coagulation does not occur due to the effect of the coating.

Therefore, the gold content in this circuit forming liquid can be changed arbitrarily, and there is no fear of clogging the nozzles of the inkjet head. As a result, it becomes extremely unreliable as a circuit forming liquid to be filled into an inkjet head used to form and cover a circuit pattern on a hybrid IC substrate.

In this example, gold (Au) was used as the metal raw material, but
In order to form circuit patterns for conductors, resistors, insulators, or dielectrics,
It may be carried out using raw materials for circuit elements such as u, Ta, etc. Also, instead of argon as the carrier gas, nitrogen, oxygen,
It may also be carried out using hydrogen or the like.

In this case, when nitrogen or oxygen is used as the gear gas, nitrogen plasma or oxygen plasma is generated.

The metal vapor of the raw material metal is oxidized or nitrided by these plasmas to obtain ultrafine particles of metal oxide or metal nitride that can be used as circuit element formation materials for resistors.

Furthermore, in the above embodiments, the carrier gas is excited to a plasma state to serve as a polymerization active species that induces a polymerization reaction, but there is no problem if the monomer gas is directly excited to a plasma state by a single frequency wave. In this case, the monomer gas may be introduced from the carrier gas inlet 11 (as shown in FIG. 1).

Further, the manufacturing apparatus is not limited to the above embodiment, and for example, as shown in FIG.
However, ultrafine particles can also be produced using a manufacturing apparatus in which the monomer gas inlet 7 is disposed in the plasma polymerization tank B (or the metal evaporation tank A) and the carrier gas inlet 11 is disposed in the plasma polymerization tank B. be able to. In this case, the flow of gases such as metal vapor, monomer gas, carrier gas, etc. is limited to one direction, so it is suitable for constructing a continuous production system.

Further, in the above embodiments, the raw metal was heated to generate metal vapor, but as shown in FIG. 3, ion beam sputtering may be used. That is, a target 13 made of raw metal is sputtered with an ion beam emitted from an ion beam gun 14 to scatter metal fine particles into the chamber 1. When this sputtering is used, if an alloy material is used for the target 13, the type and amount of metal can be freely selected and various ultrafine particles can be manufactured.

[Effects of the Invention] Since the present invention is configured as described above, it produces the effects as described below.

Ultra-fine particles with polymer-coated particle surfaces of circuit element forming raw materials have low vapor pressure! By dispersing it in a solvent to form a circuit forming liquid, the dispersion stability of the ultrafine particles is improved, and at the same time, the forming liquid causes clogging of the inkjet nozzle and becomes wasteful.

Furthermore, since it is possible to arbitrarily change the solid content in the circuit forming liquid and, therefore, to increase the metal content, it is possible to form a sheet (circuit pattern with low resistance).

Further, by the method or apparatus for producing ultrafine particles described above, it is possible to produce ultrafine particles having a surface coated with a polymer and having a size of approximately several tens of nanometers, which are suitable for use in the circuit element forming liquid of the present invention.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an embodiment of an ultrafine particle manufacturing apparatus embodying the present invention, and FIG. 2 is a schematic diagram showing another example of the configuration of the chamber of the ultrafine particle manufacturing apparatus. ! Conceptual diagram, FIG. 3 is a conceptual diagram showing another example of a metal vapor generator. In the figure, 1 is a chamber, 3 is an evaporator as a particulate means, 4a, 4b are electrodes as particulate means, 5 is a heating power source as particulate means, 7 is a seven-day gas inlet as a seven-day gas inlet, 9 is a high frequency power supply as an excitation means; 10 is a matching box also as an excitation means; 1 is a carrier gas inlet as an excitation means; 14 is an ion beam gun as a particulate means. Patent applicant Toyota Industries Corporation Figure 2

Claims (4)

[Claims] 1. A circuit element formation of a hybrid IC substrate in which the particle surface of the circuit element formation is coated with a polymer. 2. A circuit forming liquid for a hybrid IC board, which is obtained by dispersing ultrafine particles whose surfaces are coated with a polymer in a liquid containing a low vapor pressure organic solvent. 3. Production of ultrafine particles of circuit element formations by dissipating monomer gas in the core particle atmosphere of circuit element formations and exciting it to a plasma state to cause a polymerization reaction on the surface of the core particles and coating the surface with a polymer. Method. 4. A chamber to be depressurized by a depressurizing means, a particulate means to turn a raw material of a circuit element formed in the chamber into nuclear particles, a monomer gas introducing means to introduce a monomer gas into the chamber, and a monomer gas introduction means to introduce a monomer gas into the chamber. excites the monomer gas,
An apparatus for producing ultrafine particles of a circuit element forming product, comprising an excitation means as a polymerization active species.