JPH01302899A - Arrangement apparatus of chiplike circuit component - Google Patents

Abstract

PURPOSE:To finely change an arrangement position of a component by constituting this apparatus of the following: an arrangement sheet where two or more polygonal holes have been made; two or more component-accommodating cases each having one polygonal protrusion which can be fit to the holes in two or more angular positions. CONSTITUTION:In order to mount two or more chip circuit components 1 to a circuit board, this apparatus is constituted of the following: an arrangement sheet 7 where a mounting sheet 2 used to previously arrange the two or more circuit components in a part other than the circuit board and two or more polygonal holes 11 are formed; two or more component-accommodating cases 8 which can be freely attached to and detached from the holes 11 in the arrangement sheet 7. The component-accommodating cases 8 have one polygonal protrusion 12 respectively which can be fit to the holes 11 in said arrangement sheet 7 in two or more angular positions. For example, a planar shape of through holes 11 in an arrangement sheet 7 is formed to be regular octagon; also one protrusion 12 each protruding from the center of the bottom of component- accommodating cases 8 is formed to be the regular octagon so that it can be fit to the regular octagonal through holes 11.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a chip-shaped circuit component placement device used when mounting chip-shaped circuit components on a circuit board.

[Ut: Next technology] Circuit board - Multiple chip-shaped circuit components (capacitors,
There is a well-known method in which a plurality of suction sections are provided corresponding to mounting positions of electronic components (such as resistors), and the suction sections simultaneously suck a plurality of circuit components and supply them to predetermined positions on a circuit board. When mounting circuit components using this method, multiple circuit components are placed in advance on a placement board (template) separate from the circuit board, and then the multiple circuit components are transferred onto the circuit board at the same time. It becomes possible to efficiently mount multiple circuit components.

By the way, if multiple types of component placement boards (templates) are prepared for multiple types of circuit board devices, costs will inevitably increase. In order to solve this problem, the applicant
We proposed a chip-shaped component placement device that consists of a combination of a placement board and a component storage case. In this chip-shaped component placement device, the placement plate has a large number of mounting holes for component storage cases, so it is possible to manufacture various circuit board devices by changing the mounting position of the component storage cases. Become.

[Problems to be Solved by the Invention] However, the component storage case in the conventional component placement device is provided with two mounting projections, which prevent the component storage case from rotating. There was a problem that it was not possible to make detailed changes.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a chip-shaped circuit component placement device that can solve the above problems.

[Means for Solving the Problems] To achieve the above object, the present invention provides a method for mounting a plurality of chip-shaped circuit components on a circuit board, in which the plurality of circuit components are mounted at a location different from the circuit board. A device for pre-arrangement, comprising a placement plate provided with a plurality of polygonal holes and a plurality of component storage cases detachably attached to the holes of the placement plate, the component storage case 9 relates to a chip-shaped circuit component placement device that has a component storage recess and one polygonal protrusion that can be fitted into the hole of the placement plate at a plurality of angular positions. Note that it is desirable that each polygon be a regular polygon that is an integral multiple of 4.

The protrusions and the holes in the arrangement plate of the parts storage case according to the above invention have a function of preventing rotation of the parts storage case.If the direction of the polygonal projection of the parts storage case is changed, the arrangement direction of the parts storage case can be changed. I can do it.

Embodiment Next, a mounting device and a mounting method according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6.

The mounting device of this embodiment is configured to mount a plurality of chip-shaped circuit components 1 on the same circuit board at the same time.The circuit component 1 is, for example, a cylindrical ceramic capacitor.

A component supply device 3 for supplying the circuit components 1 to the component placement device 2 is constructed by fitting a conveying vibro into a through hole 5 of a fixed [4].

The vibro is connected to a source of circuit components 1 (not shown).

The component placement device 2 includes a placement plate 7, which can also be called a template, a plurality of component storage cases 8, a suction device 9,
and a suction path forming member 10.

The circuit components 1 must be placed on the placement board 7 in correspondence with the placement locations of the circuit components on the circuit board. At this time, multiple types of circuit component placement devices 2 are prepared to correspond to the multiple types of circuit boards. This inevitably leads to higher costs. Therefore, in this embodiment, a large number of through holes 11 are provided in the arrangement plate 7 in a matrix pattern, and the component storage case 8 is inserted into the through holes 11.
The engaging protrusion 12 is removably fitted therein. This makes it possible to change the position and type of the component storage case 8 in response to changes in the component placement position and component type on the circuit board.

The through hole 11 of the arrangement plate 7 is formed into a regular octagonal planar shape as shown in an enlarged view in FIG. The component storage recess 13 of the component storage case 8, which is formed into a regular octagonal shape so as to fit together, has a bottom surface 15 provided with a suction hole 14a and a component storage detection hole 1.4b. The suction hole 14a communicates with the suction device 9 via a suction path. The bottom surface 15 is inclined along the longitudinal direction of the circuit component 1, as shown in FIG. That is, the bottom surface 15 is inclined so as to gradually become lower toward the suction hole 14a which is disposed near the first wall surface 13a of the recess 13 in FIG. The opening 14c in the end face of the protrusion 12 is formed smaller than the opening 14c.
It is located on the same straight line as the This makes it possible to optically or mechanically detect the presence or absence of the circuit component 1 using the component storage detection hole 14b. When optically detecting the presence or absence of the circuit component 1, the component storage recess 13 is used.
A light emitting element is arranged above or below the parts storage recess 13.
A light-receiving element is placed below or above the light-emitting element, and it is examined whether the light emitted from the light-emitting element can pass through the detection hole 14b and reach the light-receiving element. When detecting the presence or absence of the circuit component 1 mechanically, a rod-shaped sensor is inserted from the opening 14c toward the detection hole 14b, and it is checked whether the sensor collides with the circuit component 1.

The vibro is placed near the right end of the recess 13 in FIG.
above the inclined bottom surface 15).

Next, a method for mounting the circuit component 1 on a circuit board using this mounting device will be explained.

First, attach the component storage case 8 to the arrangement board 7 to correspond to the arrangement of the circuit components 1 on the circuit board.9 The direction of the circuit components 1 on the circuit board can be changed at 45 degree angle intervals. Even if the components are varied in this way, the required component arrangement on the circuit board can be obtained by changing the arrangement angle of the component storage case 8 at 45 degree intervals as shown in FIG. In addition, since there is only one protrusion 12 for attaching the parts storage case 8 to the arrangement plate 7, the position of the parts storage case 8 on the arrangement plate 7 can be set more precisely than in the conventional case with two protrusions. It becomes possible to do so. Note that even if there is only one protrusion 12, the outer circumferential shape is octagonal and the protrusion 12 is fitted into the octagonal hole 11, so that only a directional shift occurs.

Next, the component supply device 3 movably supported is guided onto the component placement device 2 positioned on a support stand (not shown), the suction device 9 is operated, and the vibrator is sucked through the suction hole 14a. 9. The circuit component 1 is introduced into the recess 13 via a vibro. At this time, suction hole 1
Suction of the circuit component 1 to the left based on 4a and the bottom surface of the recess 1
5, the circuit component 1 easily falls over based on the downward left slope of the 0-component storage detection hole 14b, and the circuit component 1 is positioned so that the left end surface of the circuit component 1 hits the left wall surface 13a of the four storage parts 13. However, since the component storage detection hole 14b is formed much smaller than the suction hole 14a, the suction caused by this can be ignored.

When the placement of the circuit component 1 in the component placement device 2 is completed, the circuit component 1 is taken out from the recess 13 by the component suction device 16 as shown in FIG. 5 and transferred onto the circuit board 17.

As shown in FIG. 5, the component suction device 16 includes a plurality of suction bodies 18, a plurality of holders 19, a mounting plate 20, and a vacuum suction device (not shown). This parts suction device 1
To explain in detail how to mount the circuit component 1 using the circuit board 6, the tapered tip of the suction body 18, which has been placed in advance to correspond to the planned circuit component placement position on the circuit board 17, is inserted into the recess 13, Even if there is some variation in the height position of the circuit component 1 pressed against the circuit component 1, since the adsorbent 18 is an elastically deformable object made of rubber,
These variations can be absorbed and all the component circuits 1 can be brought into contact with or close to each other. Suction hole 14 of storage case 8
By stopping the suction by a and performing suction through the through-hole 21 of the suction body 18, either the circuit board 17 or the component suction device 16 can move one or both of them in the horizontal direction. The positioning reference of the xy plane made on the circuit board 17 and the positioning reference of the xy plane 1a1 provided on the plate 2o are aligned to align the positions of both in the X and y directions. After that,
By vertically moving one or both of the component suction device 16 and the circuit board 17, the circuit component 1 is pressed onto an adhesive surface having a temporary adhesive function such as cream solder at a desired position of the circuit board 17. Note that even if there is variation in the height position of the lower surface of each circuit component 1, the adsorption body 18 is elastically deformed, so that the variation can be absorbed. Thereafter, the component suction device 16 is relatively separated from the circuit board jIi 17, and the circuit component 1 is connected to the wiring conductor 22 with solder (not shown) as shown in FIG.

[Modifications] The present invention is not limited to the above-described embodiments, and, for example, the following modifications are possible.

(1) As shown in FIG. 7, the shape of the protrusion 12 may be a regular quadrilateral, or it may be a variety of other polygons such as other regular polygons (for example, hexagons) that are an integral multiple of 4. In this case, it is desirable that the component storage case 8 be made into a polygon that can be rotated by 90 degrees.

(2) When mounting a square chip component, it is also applicable to mounting a round chip component and a square chip component at the same time.

[Effects of the Invention] As is clear from the above, according to the present invention, since there is only one protrusion on the parts storage case, fine mounting holes are formed in the arrangement plate to finely change the mounting position of the parts storage case. It is possible to provide a chip-shaped circuit component placement device that can perform the following steps.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a component supply device and a component placement device in a mounting device according to an embodiment of the present invention, FIG. 2 is a perspective view showing a component storage case, and FIG. 3 is a partially enlarged plan view of a placement plate. Figure 4 is a plan view showing different arrangement states of the component storage case, Figure 5 is a sectional view showing the state in which circuit components are sucked by a suction device and mounted on a circuit board, and Figure 6 is a plan view showing how the circuit components are mounted. FIG. 7 is a sectional view showing a modified example of the protrusion of the component storage case. ■...Circuit components, Parts arrangement device, 7... Arrangement board, 8... Parts storage case, 9... Suction device, 12
...Protrusion, 13...Recess, 17...Circuit board.

Claims (1)

[Scope of Claims] [1] An apparatus for pre-arranging a plurality of chip-shaped circuit components at a location different from the circuit board in order to mount the plurality of chip-shaped circuit components on a circuit board, the device comprising: It consists of a placement plate provided with a plurality of rectangular holes and a plurality of component storage cases that are detachably attached to the holes of the placement plate, and the component storage case has a component storage recess, and the placement plate A chip-shaped circuit component placement device characterized by having one polygonal protrusion that can be fitted into the hole at a plurality of angular positions.