JPH01302731A - Connection of electric circuit component and electric circuit device - Google Patents

Abstract

PURPOSE:To strongly and stably establish the connections between electric circuit components at a time by connecting electric circuit components and other electric circuit component using electrical connecting members. CONSTITUTION:A semiconductor element 101 and a circuit board are provided opposed to each other and an electric connecting member 125 consisting of an electric conductor member 107 and a holding member 111 is disposed between both members. Aluminum of connecting part 102 of semiconductor element 101 and gold of connecting part 108 of electrical connecting member 125 are connected, and gold of connecting part 105 of circuit board 104 and gold of connecting part 109 of connecting member 125 are both connected through metallization and/or formation of alloy by the high frequency induction heating or microwave heating method. Next, the electric circuit components 101 and 104 thus connected are molded with a sealing material 170, completing a semiconductor device.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for connecting electrical circuit components and an electrical circuit device.

[Prior Art] Conventionally, the following technology is known as a technology related to an electric circuit device in which an electric circuit member configured by electrically connecting electric circuit components to each other is sealed.

■Wire bonding method FIGS. 13 and 14 show typical examples of semiconductor devices that are connected and sealed by the wire bonding method. Hereinafter, the wire bonding method will be explained based on FIGS. Explain.

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame 1 are connected with ultrafine material such as gold. This is a method of electrically connecting using metal wires 7.

After the connection, the semiconductor element 4 and the lead frame 1 are sealed using a thermosetting resin 8 such as an epoxy resin by a method such as a transfer molding method, and then the lead frame extends outward from the resin-sealed component. A semiconductor device 9 is made by cutting off unnecessary portions of the semiconductor device 1 and bending it into a desired shape.

■T A B (Tape Automated Bo
ndjng ) method (for example, Japanese Patent Application Laid-Open No. 59-139636
15 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. This method will be explained based on FIG. 15.

In this method, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead part 17 of the carrier film substrate 16 and the connecting part 5 of the semiconductor element 4 are connected by thermocompression bonding. After the connection, the semiconductor device 9 is sealed with resin 20 or resin 21 which is a thermosetting resin such as epoxy resin.

■CCB (Controlled Co11ap
Figure 16 shows a typical example of a semiconductor device bonded and sealed by the CCB method. This method will be explained based on FIG. 16. Note that this method is also called a flip chip bonding method.

A solder bump 31 is provided in advance on the connection portion 5 of the semiconductor element 4,
The semiconductor element 4 provided with the solder bumps 31 is mounted on the circuit board 3.
Position and mount it on 2. Thereafter, the circuit board 32 and the semiconductor element 4 are connected by heating and melting the solder, and after cleaning with flux, the semiconductor device 9 is sealed.

■The method shown in FIGS. 17 and 18. An insulating film 71 made of polyimide or the like is formed on a portion of the first semiconductor element 4 other than the connecting portion 5, and the connecting portion 5 is made of Au.
Then, the exposed surfaces 73° and 72 of the metal material 70 and the insulating film 71 are flattened. On the other hand, an insulating film 71' made of polyimide or the like is formed on a portion other than the connecting portion 5° of the second semiconductor element 4°, and an insulating film 71'' is formed on the connecting portion 5'.
A metal material 70'' made of u etc. is provided, and then the metal material 70
The exposed surfaces 73' and 72'' of the insulating film 71' are flattened.

Thereafter, as shown in FIG. 18, the first semiconductor element 4 and the second semiconductor element 4 degrees are positioned, and after positioning, they are bonded by thermocompression, thereby connecting the connecting part 5 of the first semiconductor element 4 and the second semiconductor element 4.
Connecting part 5'' of semiconductor element 4° with metal material 70.70'
Connect via.

■The method shown in FIG. 19 An anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit board 75 and the second circuit board 75'. After positioning the circuit board 75 and the second circuit board 75°, pressure is applied or pressure and heat is applied to connect the connection portion 76 of the first circuit board 75 and the second circuit board 7.
This is a method of connecting a 76° connecting portion of 5°.

■Method shown in Fig. 20 Between the first circuit board 75 and the second circuit board 75°,
An elastic connector 83 made of an insulating material 81 in which metal wires 82 made of e.g., Cu, etc. are arranged in a certain direction.
between the first circuit board 75 and the second circuit board 75
This is a method in which the connecting portion 76 of the first circuit board 75 and the connecting portion 76' of the second circuit board 75' are connected by applying pressure after positioning the circuit board 75'.

E Problems to be Solved by the Invention However, the conventional bonding method has the following problems.

■Wire bonding method■ When designing the connecting part 5 of the semiconductor element 4 to be placed inside the semiconductor element 4, the ultra-fine metal wire 7 has an extremely small wire diameter, and therefore the outer peripheral edge 10 of the semiconductor element 4 or the word This makes it easier to contact the outer peripheral edge 11 of the element mounting portion 2 of the frame 1. When the ultrafine metal wire 7 comes into contact with these outer peripheral edges 10 or 11, a short circuit occurs. Furthermore, the length of the ultra-fine metal wire 7 has to be increased, and if the length is increased, the ultra-fine metal wire 7 becomes easily deformed during transfer molding.

Therefore, the connecting portions 5 of the semiconductor element 4 need to be distributed around the semiconductor element 4, which imposes restrictions on circuit design.

■In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires 7, the pitch dimension of the connecting portions 5 on the semiconductor element 4 (the distance M between the centers of adjacent connecting portions)
We have no choice but to maintain a certain amount of distance between each other. Therefore, once the size of the semiconductor element 4 is determined, the maximum number of connection portions 5 is necessarily determined.

However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connecting parts 5 must be reduced.

■The height h of the ultrafine metal wire 7 measured from the connection part 5 on the semiconductor element 4 is usually 0.2 to 0.4 mm, but it is 0.2 mm.
Since it is relatively difficult to make the device thinner than below, the device cannot be made thinner.

■Wire bonding takes time. In particular, when the number of connection points increases, bonding time becomes longer and production efficiency deteriorates.

- If the transfer molding condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or, in the worst case, may be cut.

Further, in the connection portion 5 on the semiconductor element 4, since the AJZ that is not alloyed with the ultrafine metal wire 7 is exposed, A° C. corrosion is likely to occur, resulting in a decrease in reliability.

(2) If the resin 8 is injected at high pressure, the ultrafine metal wire 7 will be deformed or cut, so thermoplastic resins that need to be injected at high pressure cannot be used, and there are restrictions on the resin.

(2) When performing thermocompression bonding, if there is a material with poor heat resistance in the vicinity of the semiconductor element 4, there will be design or manufacturing restrictions.

■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be placed inside the semiconductor element 4, the length of the inner lead part 17 of the carrier film substrate 16 becomes long, and the inner lead part 17 becomes easily deformed. , the inner lead part cannot be connected to the desired connection part 5, or the inner lead part 17
may come into contact with a portion of the semiconductor element 4 other than the connection portion 5 . In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery above the semiconductor element 4, which is subject to design limitations.

■ Even in the TAB method, the pitch dimension of the connecting parts on the semiconductor element 4 must be set to about 0°09 to 0.15 mm. Therefore, as mentioned in the problem (■) of the wire bonding method, the number of connected parts must be increased. It becomes difficult to do so.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with portions other than the connection portions 5 of the semiconductor element 4, a connection shape of the inner lead portions 17 is required for this purpose, which increases costs.

(2) In order to connect the connecting portion 5 of the semiconductor element 4 and the inner lead portion 17, gold bumps must be attached to the connecting portion 5 of the semiconductor element 4 or the connecting portion of the inner lead portion 17, which increases the cost.

■The thermal expansion coefficient of the semiconductor element 4 is between resin 20 and resin 21.
Since the coefficient of thermal expansion is different from that of , when heat is applied to the semiconductor device 9 , thermal stress is generated and the characteristics of the semiconductor element 4 are deteriorated. Furthermore, cracks occur in the semiconductor element 4, the resin 20, or the resin 21, reducing the reliability of the device. Such a phenomenon becomes remarkable when the size of the semiconductor element 4 is large.

■ CCB method ■ Solder bumps 31 must be formed on the connection portions 5 of the semiconductor element 4, which increases costs.

■ If there is a large amount of solder on the bumps, a bridge (a phenomenon in which adjacent solder bumps come into contact with each other) will occur between adjacent solder pep, and conversely, if there is a small amount of solder on the bumps, the connection part 5 of the semiconductor element 4 and the circuit board will be formed. 32 connection part 33 no longer connects,
Electrical continuity is lost. In other words, the reliability of the connection becomes low. Furthermore, the amount of solder and the solder shape of the connection affect the reliability of the connection ("Geometric Optimi").
zationof Controlled (:oll
apse Interconnections”.

L, S, Goldman, IBM J, RES
, DEVELOP, 1969°MAY, pp, 2
51-265. ”Re1ability of C
ontrolledCollapse Interc
K, C, Norri
s.

^,lL Landzberg, IBM J,R
ES, DEVELOP, 1969°MAY, pp
, 266-271. Brazing Technology Research Group Technical Data, No.
017-'84, published by the Brazing Technology Study Group).

As described above, since the amount of solder bumps 31 affects the reliability of the connection, it is necessary to control the amount of solder bumps 31.

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■Poor heat dissipation of semiconductor elements (reference material: Electr
onic Packagin3 Technology
1987.1゜(Vol, 3. No, l) P, 5
6-71. NTKKEI MICRO DEVICES
(May 1986, P. 97-108), therefore, great efforts are required to improve the heat dissipation characteristics.

■When heating and melting solder, if there is a material with poor heat resistance, there will be design or manufacturing restrictions.

■Techniques shown in FIGS. 17 and 18■Exposed surface 72 of the insulating film 71, exposed surface 73 of the metal material 70, or exposed surface 72' of the insulation 11iJ71' and the metal material 70
It is necessary to flatten the exposed surface 73' of ', which increases the number of steps and increases costs.

■If there are irregularities on the exposed surface 72 of the insulating film 71 and the exposed surface 73 of the metal material 70 or on the exposed surface 72' of the insulating film 71' and the exposed surface 73' of the metal material 70°, the metal material 70 and the metal material 70° will no longer connect, reducing reliability.

■Technology shown in Fig. 19■ After positioning, when applying pressure to connect the connecting portion 76 and the connecting portion 76°, it is difficult to apply constant pressure, resulting in variations in the connection state. The variation in contact resistance value increases. Therefore, the reliability of the connection becomes poor. In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■Even if a constant pressure is applied, the anisotropic conductive film 78
Due to the arrangement of the conductive particles 79, variations in the resistance value become large. Therefore, the reliability of the connection becomes poor. Furthermore, it is not suitable for cases where a large amount of current needs to flow.

(2) If the pitch between adjacent connecting parts (the distance between the centers of adjacent connecting parts) is narrowed, the resistance value between adjacent connecting parts will decrease, which is not suitable for high-density connections.

(2) Since the resistance value changes due to variations in the protrusion ffi h + of the connecting portion 76.76' of the circuit board 75.75", it is necessary to accurately control the amount of variation in h.

■Furthermore, when an anisotropic conductive film is used to connect a semiconductor element and a circuit board, or to connect a first semiconductor element and a second semiconductor element, in addition to the drawbacks of It is necessary to provide a bump at the connection part, which increases the cost.

■Technology shown in Figure 20 ■Pressure is required, and a pressure jig is required.

■The contact resistance between the metal wire 82 of the elastic connector 83 and the connection part 76 of the first circuit board 75 or the connection part 76' of the second circuit board 75' changes depending on the pressing force and surface layer, so the connection lack of reliability.

■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83
There is a high possibility that the surfaces of the first circuit board 75 and the second circuit board 75' will be damaged. Moreover, if the pressing force is small, the reliability of the connection will be poor.

■Furthermore, the connection part of the circuit board 75.75° is 76.76°.
Protrusion: ft h 2 or elastic connector 8
Since the protrusion rM h 3 of the metal wire 82 of No. 3 and its dispersion affect resistance value change and damage, it is necessary to take measures to reduce the dispersion.

(2) Furthermore, when an elastic connector is used to connect a semiconductor element and a circuit board, or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as described in (1) to (4) occur.

The present invention solves all of the above-mentioned problems, and proposes 11 new electrical circuit devices that are high in power, highly reliable, and low in cost. stop button
Not only can the formula be replaced, but also high-density multi-point connections can be obtained, and thermal characteristics and other timekeeping performance can be improved.

(Left below) [Means for Solving the Problems] The first gist of the present invention is to provide a device comprising a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder. and an electrical connection member in which one end of the electrically conductive member is exposed on one surface of the holder, and the other end of the electrically conductive member is exposed on the other surface of the holder. and; at least one or more connecting portions, to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected. Electric circuit component: has at least one or more connection parts, and in the connection part,
and at least one or more other electrical circuit components to which the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected. The method for connecting electrical circuit components includes: connecting at least one electrically conductive member exposed on one surface of the holder to at least one electrical circuit component; or connecting at least one electrically conductive member exposed on one surface of the holder; The connection between at least one or more electrically conductive members and at least one or more electrical circuit components exposed in the Alternatively, there is provided a method for connecting electrical circuit components, characterized in that the electrically conductive member of the electrical connection member and the electrical circuit component are connected by metallization and/or alloying by heating the connection portion of the electrical circuit component. .

A second aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface and the other end of the electrically conductive member is exposed on the other surface of the holder; and at least one or more electric circuit components connected to one end of at least one of the electrically conductive members exposed on one surface of the holder.

It has at least one or more connecting parts, and in the connecting parts,
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is mainly made by heating the connection part and the other end directly or indirectly using an internal heating method using high-frequency electrical heating or microwave heating, thereby making the connection part and the other end metal. at least one other electrical circuit component connected to the electrical circuit component by alloying and/or alloying; the electrical circuit component connected to the electrical connection member on one side of the holder and the holder; a sealing material that embeds and seals at least a portion of either or both of the other electrical circuit components connected to the electrical connection member on the other surface of the electrical connection member; An electric circuit device characterized by:

A third aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface and the other end of the electrically conductive member is exposed on the other surface of the holder; At least one end of the electrically conductive member exposed on one side of the holder is connected, and the connection is mainly performed by internal heating using a high frequency dielectric heating method or a microwave heating method. at least one electrical circuit component connected by metallizing and/or alloying the connecting portion and the one end by heating the connecting portion and the one end directly or indirectly using a method; and; having at least one or more connecting portions, in which the connecting portions include:
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is mainly made by heating the connection part and the other end directly or indirectly using an internal heating method using a high-frequency dielectric heating method or a microwave heating method, thereby metallizing the connection part and the other end. and/or with at least one other electrical circuit component connected by alloying; the electrical circuit component connected to the electrical connection member on one side of the holder and the holder; and a sealing material that embeds and seals at least a portion of either or both of the other electrical circuit components connected to the electrical connection member on the other surface; The electrical circuit device is characterized by:

A fourth aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one side and the other end of the electrically conductive member is exposed on the other side of the holder; at least one electrical circuit component to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; , in the connection part,
The other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected, and the connection is mainly performed by an internal heating method using a high frequency dielectric heating method or a microwave heating method. At least one or more other parts connected by metallizing and/or alloying the connecting part and the other end by heating the connecting part and the other end directly or indirectly using an electrical circuit component connected to the electrical connection member on one surface of the holder and another electrical circuit component connected to the electrical connection member on the other surface of the holder; at least one cap in which at least one of the electrical circuit components is cap-sealed;

An electric circuit device comprising at least the following.

A fifth aspect of the present invention is to have a holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, and one end of the electrically conductive member is connected to the holder. an electrical connection member that is exposed on one surface and the other end of the electrically conductive member is exposed on the other surface of the holder; One end of at least one of the electrically conductive members exposed on one side of the holder is connected to the part, and the connection is mainly performed by internal heating using high-frequency dielectric heating or microwave heating. At least one or more parts connected by metallizing and/or alloying the connecting part and the one end by directly or indirectly heating the connecting part and the one end using a heating method. with an electric circuit component: having at least one or more connection portion 1-1 At the connection portion, at least one other end of the electrically conductive member exposed on the other surface of the holder is connected. The connection is made by directly or indirectly heating the connection part and the other end using an internal heating method using high-frequency dielectric heating or microwave heating. and at least one other electrical circuit component connected by metallization and/or alloying.

The electrical circuit component connected to the electrical connection member on one surface of the holder, and the other electrical circuit component connected to the electrical connection member on the other surface of the holder. An electric circuit device characterized in that it has at least one cap in which at least 1-) is sealed with a cap;

The constituent elements of the present invention will be individually explained below.

(Electrical circuit components) Examples of the electrical circuit components in the present invention include circuit boards (hereinafter simply referred to as circuit boards) such as resin circuit boards, ceramic boards, metal boards, and silicon boards, semiconductor elements, lead frames, etc. can be given.

Note that only one electric circuit component connected to the electrical connection member may be present on one surface of the holder, or a plurality of electric circuit components may be present on one surface of the holder.

The object of the present invention is a component having a connection part as an electric circuit component. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be.

Further, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

Note that the connecting portion is an electrically conductive material.

(Electrical Connection Member) The electrical connection member according to the present invention includes a plurality of electrically conductive members embedded in a holder made of an electrically insulating material. The buried conductive members are electrically insulated from each other.

One end of the electrically conductive member is exposed on one side of the holder, and the other end is exposed on the other side of the holder.

Furthermore, the electrical connection member may be composed of one layer or multiple layers of two or more layers.

(Electrically conductive member) The electrically conductive member may be anything as long as it exhibits electrical conductivity. Although metal materials are generally used, materials other than metal materials such as those exhibiting superconductivity may also be used.

Gold is preferred as the material for the metal member, but any metal or alloy other than gold may also be used. For example, Ag, Be, Ca, Mg.

Mo, Ni, W, Fe, Ti, In, Ta.

Examples include metals or alloys such as Zn, Cu, Afl, Sn, and Pb-5n.

In addition, the metal member and the alloy member may include the same type of metal or different types of metal in the same electrical connection member. Furthermore, one of the metal members and alloy members of the electrical connection member may be made of the same metal or alloy, or may be made of different metals or alloys.

Furthermore, materials other than metals and alloys may be used, as long as they exhibit conductivity, and may include a metal material containing one or both of an organic material and an inorganic material. Further, a combination of an inorganic material and an organic material may be used as long as it exhibits conductivity.

Furthermore, the cross section of the electrically conductive member can be circular, square, or any other shape.

Further, the thickness of the electrically conductive member is not particularly limited. Considering the pitch of the connection part of the electric circuit member, for example, 20 μm
It may be greater than or equal to φ or less than 20 μmφ.

Note that the exposed portion of the electrically conductive member may be on the same surface as the holder, or may protrude from the surface of the holder. This protrusion may be on one side only or on both sides. If it is made to protrude further, it may be made into a bump shape.

Further, the intervals between the electrically conductive members may be the same as the intervals between the connecting parts of the electric circuit components, or may be narrower than the intervals between the connecting parts of the electric circuit components. When the interval is narrow, it becomes possible to connect the electric circuit component and the electrical connection member without requiring positioning of the electric circuit component and the electrical connection member.

Further, the electrically conductive member does not need to be arranged vertically in the holder, but may be obliquely arranged from one surface of the holder to the other surface of the holder.

(Holding body) The holder is made of electrically insulating material.

Any electrically insulating material may be used.

Examples of electrically insulating materials include organic materials and inorganic materials. Alternatively, it may be a metal or alloy material that has been treated so that the electrically conductive members are electrically insulated from each other. Furthermore, one or more types of inorganic materials, metal materials, and alloy materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed in the organic material. good. Furthermore, one or more of organic materials, metal materials, and alloy materials having a desired shape such as powder, fibers, plate-like bodies, rod-like bodies, and spherical bodies may be dispersed in the inorganic material. good. In addition, metal materials include powder, fibers, plate-shaped bodies, rod-shaped bodies,
One or more types of inorganic and organic materials may be dispersed and held in a desired shape such as a spherical body. In addition,
When the holder is made of a metal material, for example, an electrically insulating material such as resin may be provided between the electrically conductive member and the holder.

Here, as the organic material, for example, an insulating resin may be used, and the resin may be a thermosetting resin, an ultraviolet curing resin, or a thermoplastic resin. For example, polyimide resin, polyphenylene sulfide resin, polyethersulfone resin, polyetherimide resin, polyurethane resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin , polystyrene resin, methyl methacrylate resin, polyphenylene oxide resin, phenol resin, melanin resin, epoxy resin, urea resin, methacrylic resin, vinylidene chloride resin, alkyd resin, silicone resin and other resins can be used.

Preferably, a resin having a relatively large product of dielectric constant and dielectric power factor may be used. In that case, vinyl chloride resin, melamine resin, urea resin, phenol resin, polyurethane resin, epoxy resin, methacrylic resin, polyimide resin, vinylidene chloride resin, styrene resin, and other resins can be used.

Furthermore, examples of the inorganic material include strong telephone material. For example, BaTi0° system, PbZrO3
system, P b TiOs system, L f N b Os system, S r TiOs system, Mg0-TiO2 system, Ba
0-Tie, system, La2 o, -Tto2 system, Ca T
i O3 series, CaSnO3 series, BaSnO3 series, Ba
ZrO3-based, MgTiOs-based, B i 2 (S n O
3) 3 system, N15nO, system, B i 2 (T i 02
)3 system, (Ba-Sr)TiO3 system, (Ba-Ca
) T i 03 system, (Ba-Pb) T i O, system, B
a(Ti-Zr) 03 series, Ba(Ti-Sn)
Os series, P b Z r 03-P b T i O3
system, N a N b Os system, KNbO3 system, Li
Examples include N b O3-based, B i , W 2 O-based, soda quartz glass, and other inorganic materials.

Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin. Furthermore, if the resin is selected to have the same or similar coefficient of thermal expansion as the circuit board, and if at least one hole or multiple bubbles are present in the organic material, thermal expansion and thermal contraction can be achieved. It becomes possible to further prevent a decrease in reliability of the device due to

In addition, specific examples of metal materials and alloy materials include, for example,
Ag, Cu, Au, Aj2. Be, Ca.

Mg, Mo, Fe, Ni, St, Co, Mn.

W, Cr, Nb, Zr, Ti, Ta, Zn.

Examples include metals or alloys such as Sn and Pb-5n.

Examples of inorganic materials include 5i02°B203, A
, ff20s, Na2o, ic2o.

Cab, ZnO, Bad, PbO, 5b20*.

As, 03. La20. , ZrO2, Bad.

P20s, TiO2, MgO, SiC, Bed.

BP, BN, AuN, B4C, TaC.

TiB2, CrB2, TiN, S
i:+N4.

Examples include ceramics such as Ta205, diamond, glass, carbon, boron, and other inorganic materials.

(Connection; Connection by metallization and/or alloying) The following two configurations can be considered for the connection between the end of the electrical connection member and the connection of the electrical circuit component.

Note that two or more electric circuit components may be connected to one electrical connection member, but at least one of the connected electric circuit components must be connected according to the following configuration. Bye.

■ One end of the plurality of electrically conductive members exposed on one side of the holder and at least one of the plurality of connections of one electric circuit component are mainly heated using high frequency 8 electric heating method or microwave heating method. a plurality of connections between the other ends of the plurality of electrically conductive members exposed on the other side of the holder and the other electrical circuit component; A configuration in which the parts are connected by a method other than the above-mentioned metallization and/or alloying.

■One end of the plurality of electrically conductive members exposed on one side of the holder and at least one of the plurality of connections of one electric circuit component are mainly heated using high frequency electric heating method or microwave heating method. a plurality of connections between the other ends of the plurality of electrically conductive members exposed on the other side of the holder and the other electrical circuit component; At least one of the parts is metallized and/or
or configurations connected by alloying.

The present invention mainly uses an internal heating method using a high-frequency dielectric heating method or a microwave heating method to directly or indirectly heat the connecting portion, thereby connecting the connecting portion by metallizing and/or alloying the connecting portion. It is something.

Here, the high-frequency telephone heating method means that many of the molecules constituting the dielectric material present in the holder, which is an electrically insulating material of an electrical connection member, or at least a part of an electrical circuit component, etc. It forms electrical dipoles with equal amounts of positive and negative charges, and a dielectric material is considered to be an aggregate of many such dipoles. Each dipole points in its own direction, but when a voltage is applied to the electrode and an electrode field is applied to the dielectric, the positive and negative charges of the dipole change to electrode charges of opposite signs. As a result of creating an attractive force between them and rotating their orientation, each dipole begins to align in the direction of the electromagnetic field. However, since the polarity of high-frequency voltage changes periodically, when the voltage polarity of the electrode is reversed, the direction of the dipole is also reversed.

In this way, when the dielectric molecules repeatedly invert according to the frequency of the high-frequency voltage, they collide and rub against each other, generating heat.

The thermal energy generated in a substance by high frequency 8 electric heating is expressed by the following equation.

P engineering ε・tan δ・f ε; Relative dielectric constant tan δ of the material; Dielectric power factor f of the material conducts to electrical circuit components and connections of electrical circuit components, heating the connections,
Metalized and/or alloyed and connected.

Metallization and/or alloying causes metals to diffuse into each other, and if the metals are of the same type, the same type of crystal structure is obtained, and if the metals are of different types, solid solutions, intermetallic compounds, etc. are created.

The principle of heat generation by micro-heated heating is the same as that of high-frequency dielectric heating, but because the frequency is high, it has different characteristics from high-frequency dielectric heating.

Micro-heated heating differs from high-frequency dielectric heating in the following points: ■There are no electrodes for heating.

■It is possible to generate heat even if the shape of the dielectric is irregular and complex.

■ Heat generation is possible even when it contains electrolyte components and has conductivity.

(2) In the microwave heating method, the larger the dielectric loss coefficient (the product of ε and tan δ), the shallower the penetration depth, so there is a possibility that a temperature difference will occur between the surface and the inside.

In any case, whether to use the high frequency dielectric heating method or the microwave heating method, which frequency to choose, etc. is determined depending on the conditions.

Further, although the present invention connects using a high frequency dielectric heating method or a microwave heating method, both heating methods may be used together to promote heating, or other internal heating methods or external heating methods may be used. Laws may be combined.

Next, connection by metallization and/or alloying by the high frequency dielectric heating method or microwave heating method will be described.

When the electrically conductive member to be connected and the connecting portion are made of the same type of pure metal, the connection layer formed by metallization has the same type of crystal structure as the electrically conductive member or the connecting portion.

When the electrically conductive member to be connected and the connecting portion are made of different types of pure metals, the connecting layer to be formed is made of an alloy of both metals.

When one of the electrically conductive member and the connecting portion to be connected is made of a pure metal and the other is made of an alloy, or when both are made of the same or different alloys, the connecting interface is made of an alloy.

Regarding multiple electrically conductive members in one electrical connection member, if each electrically conductive member is made of the same kind of metal or alloy, if each is made of different kinds of metal or alloy, or in other cases. In addition, a single electrically conductive member may be made of the same type of metal or alloy, or may be made of different metals or alloys, or in other cases, but in any case, the above-mentioned requirements apply. Metallization or alloying takes place. The same applies to the connection portion.

Note that the electrically conductive member or the connecting part may be made of metal or an alloy at the contact part between the two, and the other parts may be, for example, metal mixed with an inorganic material such as glass, or metal mixed with an organic material such as resin. The material may be in a mixed state.

Furthermore, a plating layer made of a metal or alloy that is easily alloyed may be provided on the surface of the portion to be connected.

To make connections other than metallization or alloying as described above,
For example, the connection may be made by pressing the electrical circuit component and the electrically conductive member of the electrical connection member.

(Sealing material) In the present invention, electrical circuit components are embedded and sealed using a sealing material.

Sealing may be performed on only one electrical circuit component or on multiple electrical circuit components.

(Material of Encapsulant) In the present invention, thermoplastic resin can be used as the material of the encapsulant. Examples of thermoplastic resins include polyimide resins, polyphenylene sulfide resins, polyethersulfone resins, polyetherimide resins, polysulfone resins, fluororesins, polycarbonate resins,
Polydiphenyl ether resin, polybenzylimidazole resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin, polystyrene resin, methyl methacrylate resin and other resins can be used for shoe making.

The sealing material may be the above-mentioned resin, or one or more of powder, fiber, plate-like body, rod-like body, spherical cylinder, metal, alloy, and inorganic material in any shape can be added to the above-mentioned thermoplastic resin. (1) The method of dispersion is (3) adding powder, fibers, plate-shaped bodies, rod-shaped bodies, spherical bodies, etc. to the resin (1) and stirring the resin (1).
Bye. Of course, the powder, fibers, plate-shaped bodies, rod-shaped bodies, spherical bodies, etc. may be dispersed in the resin by any other method other than this method.

Examples of the metal or alloy include Ag.

Cu, Au, Afl, Be, Ca, Mg, Mo.

Examples include metals or alloys such as Fe, Nt, Si, Co, Mn, and W.

Examples of inorganic materials include SiO□.

B203. AJ2203, Na2O, 20°Ca,
O, ZnO, B&d, PbO, 5b20s.

ASz　o,,La2　o,,Zr()2. Bad.

P205, T i 02, M gd
, S i C, Bed.

BP, BN, AI N, B4
C, TaC.

TiB2, CrB, , TtN, S
i3N4.

Examples include ceramics such as Ta and 05, diamond, glass, carbon, fron, and other inorganic materials.

The size and shape of the powder and fibers to be dispersed, as well as the position and quantity of the dispersed particles in the insulator, must be within a range that does not cause contact or short circuit between the metal parts embedded in the insulator due to the powder or fibers. If so, it is optional. However, powder,
The size of the fibers, plate-shaped bodies, rod-shaped bodies, spherical bodies, etc. is preferably smaller than the distance between adjacent metal members. That is, the electrically conductive members are powder 1, fibers, plate-like materials,
It is preferable that there is no contact via a rod-shaped body, a spherical body, or the like.

Further, the powder and fibers may or may not be exposed to the outside of the insulator. In addition, powder, fiber, fiber,
The plate-shaped bodies, rod-shaped bodies, spherical bodies, etc. may or may not be in contact with each other. Powder, fiber, plate-shaped body, rod-shaped body, spherical cylinder, or any other shape may be dispersed in the wiped resin for sealing. In this method, an electrical circuit member (a member consisting of an electrical connection member and the electrical circuit components connected to it) is placed in the cavity of the mold, and the sealing material is inserted into the cavity using an injection mold. Alternatively, the electric circuit member may be sealed by any method such as injection molding, extrusion molding, medium molding, blow molding, or any other method.

Furthermore, the above-mentioned sealing material and a plate (the plate is made of a different material from the sealing material) may be used. Such a load-bearing form includes a case where a plate is bonded to at least a part of the surface of the encapsulant, and the electrical circuit component and other electrical circuit components connected to the electrical connection member by the encapsulant. If at least a part of a plate that is joined on the opposite side to the electrical connection member is embedded in at least one part of the electrical circuit component and the electrical connection member by a sealing material, At least a portion of a plate disposed near one or more sides of an electric circuit component connected to the electric circuit component may be embedded.

(Plate) The material of the plate may be any material as long as it is different from the material of the sealing material.

For example, in the case of a stainless steel plate, the plate thickness is 0.05~
0.5 mm is preferred.

When joining plates, the method for joining the plates is not particularly limited.

For example, it may be attached using an adhesive or the like, or any other method may be used as long as the board is structured to hold the electric circuit device.

(Cap) In the present invention, the electric circuit component may be sealed with a cap.

Here, the term "cap sealing" refers to wrapping an electric circuit component and sealing the electric circuit component so that a hollow portion exists inside.

The cap may be provided on only one electrical circuit component, or may be provided on multiple electrical circuit components.

In addition, when sealing with a cap, it is preferable to seal so that the electric circuit component is firmly held on the electrical connection member. For example, the inner surface of the cap may be shaped to correspond to the outer surface shape of the electric circuit component, and the cap may be sealed such that the inner surface of the cap comes into contact with the outer surface of the electric circuit component.

Note that the cap can be attached to electrical circuit components or other caps (electric circuit components on one side of the holder and the other side) by adhesive, mechanical, welding, or any other method. If both electrical circuit components are capped), it is sufficient to join them.

(Material of Cap Sealing) The material of the cap may be an organic material, an inorganic material, a metal material, or a composite material thereof.

As for the sealing form, one or more electric circuit components may be sealed with the same cap. Further, the cap may be sealed so as to protect or hold the electric circuit component.

Furthermore, a member may be interposed between the electric circuit component and the cap for sealing. In this case, the effect will be more pronounced if a plurality of electrical circuit components are sealed with the same cap.

Any method may be used to join the cap to the electric circuit components and the like.

(Adjustment member) In the present invention, an adjustment member may be interposed between the cap and the electronic circuit component.

The material for the adjustment member may be any metal, inorganic, or organic material, but is preferably an elastic material. .

Further, the shape may be any shape as long as the dimension in the height direction of the electric circuit component can be adjusted.

[Function] In the present invention, since the electrical connection member described above is used to connect an electrical circuit component to another electrical circuit component, the connecting portion of the electrical circuit component is arranged not only on the outer periphery but also inside. This also makes it possible to increase the number of connection parts, which in turn makes it possible to increase the density.

Further, it is possible to make the electrical connection member thinner, and from this point of view as well, it is possible to make the electrical circuit member thinner.

Furthermore, since the amount of metal members used for the electrical connection member is small, costs can be reduced even if expensive gold is used as the metal member.

In the present invention, one or both of the connections between the connection portion of the electric circuit component and the electrically conductive member exposed on the surface of the holder are connected mainly by heat generated by internal heating using high-frequency dielectric heating or microwave heating. Therefore, even if there is a material with poor heat resistance in at least a part of the electric circuit member or in the vicinity of the electric circuit member, selective heating is easy, and deterioration or alteration of the material due to heating can be prevented, resulting in a good result. connection is possible.

Note that if a material with poor heat resistance is present near the electric circuit member, it may be shielded from exposure to high frequency electromagnetic field energy.

Further, the influence of thermal expansion and contraction caused by heating on at least a portion of the electric circuit member or materials in the vicinity of the electric circuit member can be reduced.

Furthermore, since a uniform high-frequency electromagnetic field can be applied, uniform heating becomes possible. Furthermore, since non-contact heating can be performed, the jig and equipment for the non-contact heating section can be simplified.

When sealing is performed using a sealing material in the present invention, since the electrical connection member is configured with an electrically conductive member embedded in a holder, the sealing pressure when the sealing material is injected, Any sealing method can be used since it is not affected by sealing speed or the like. In other words, it has become possible to seal with materials that require extremely high-pressure injection, such as thermoplastic resins, which were previously impossible.

Further, in the present invention, when a plate is bonded to at least a part of the surface of the sealing material, at least one of the electrical circuit components connected to the electrical circuit component and the electrical connection member by the sealing material is If at least a part of the plate that is joined on the side opposite to the electrical connection member is embedded, or if the electrical circuit component and the electrical connection member are connected by a sealing material. If at least a portion of the plate disposed near one or more sides of the electrical circuit components is embedded, internal stress may occur in the device or external force may be applied to the device. However, stress concentration can be alleviated even when stress concentration occurs, and cracking, etc. that may occur due to stress concentration can be prevented.

This board also has the effect of lengthening the path from the outside world to the electrical circuit components, making it difficult for water from the outside to enter the electrical circuit components. Therefore, the reliability of the device can be improved.

In addition, if the material of the plate is metal such as stainless steel, ceramic with good thermal conductivity, carbon, diamond, etc., the heat generated from the electric circuit components can be quickly radiated to the outside world, so the heat radiation characteristics An excellent electric circuit device can be obtained. Furthermore, if the material of the plate is metal, it can block out noise from the outside world and is less susceptible to noise.Furthermore, it can block out electromagnetic noise generated from inside, so it is less likely to generate noise and has good characteristics. An electrical circuit device is obtained.

Further, when sealing with a cap in the present invention, since the electric circuit device is hollow, there is little thermal stress generated even when heat is applied, and a highly reliable electric circuit device can be obtained. In addition, if the cap and electrical circuit components are in contact and the cap is made of a material with good thermal conductivity, the heat generated from the electrical circuit components will be quickly conducted to the outside through the cap, resulting in better heat dissipation characteristics. You can get electrical circuit equipment. Furthermore, if the cap is made of a material with good noise shielding properties, particularly metal such as iron, an electric circuit device with even better shielding effect can be obtained. Further, when an adjustment member is interposed between the cap and the electric circuit component, it is possible to assemble the electric circuit component efficiently even when the height of the electric circuit component varies.

In addition, in the present invention, when a material with good thermal conductivity is used for the insulator of the electrically conductive member, powder, fiber, plate-shaped body, rod-shaped body, spherical body, etc. with good thermal conductivity is used as the sealing material. When the heat is dispersed, the heat generated from the electric circuit components escapes to the outside world more quickly, and an electric circuit device with good heat dissipation properties can be obtained. In addition, when the insulator of the electrically conductive member is made of a material with a thermal expansion coefficient close to that of the electric circuit component, the sealing material may be a powder, fiber, plate-shaped body, rod-shaped body, etc. whose thermal expansion coefficient is close to that of the electric circuit component. If one or both of the spherical bodies etc. are dispersed, the coefficient of thermal expansion approaches that of the electrical circuit components, which may cause cracks in the encapsulant or electrical circuit components, which may occur when heat is applied. A phenomenon that impairs the reliability of an electric circuit device, such as a change in characteristics of electric circuit components, can be prevented, and a highly reliable electric circuit device can be obtained.

In the present invention, when both electrical circuit components are connected by a connecting body formed by metallization and/or alloying via an electrical connection member, the electrical circuit components are strong (strong in terms of strength). In addition, since the connection is reliable, it is possible to obtain an electrical circuit device that has a low connection resistance value, small variation thereof, is mechanically strong, and has an extremely low defective rate.

In addition, if electrical circuit components are connected by a connecting body formed by metallization and/or alloying through an electrical connection member, jigs, etc. may be used during and after the production process of the electrical circuit device. There is no need to use and hold the electric circuit components, and it is easy to create and manage the electric circuit device after it is created.

Furthermore, if electrical circuit components are connected by a connecting body formed by metallization and/or alloying through an electrical connection member, the contact resistance between the electrical circuit components will increase when only one electrical circuit component It is smaller than when connected.

On the other hand, if electrical circuit components or other electrical circuit components are connected by a connection other than metallization and/or alloying, deterioration of the electrical circuit components due to heat that occurs during metallization and/or alloying can be prevented. . Additionally, depending on the application, there may be cases where it is desired to make electrical circuit components removable, and in such cases, such requests can be met if the electrical circuit components have connections other than connections made by metallization and/or alloying. becomes.

Furthermore, by selecting a material with a high shielding effect as an insulator, it is possible to reduce electromagnetic noise that exits from the electric circuit components to the outside world, and it is also possible to reduce noise that enters the electric circuit components from the outside world.

(The following is a blank space) [Example] (Example 1-DI) Example 1-DI of the present invention is shown in Fig. 1(a) and Fig. 1(b).
, will be explained based on FIG. 1(c)-1 and FIG.

This embodiment includes a holder 111 made of an organic material mixed with powder, and a plurality of metal members 107 that are electrically conductive members embedded in the holder 111.
7 is exposed on one surface of the holder 111, and the other end of the metal member 107 is exposed on the other surface of the holder 111; At the connecting portion 102, the holding body 11
one semiconductor element 101 connected to one end of the metal member 107 exposed on one surface of the semiconductor element 101 by metallization and/or alloying using high frequency dielectric heating or microwave heating; connection portion 105; At the connecting portion 105, the other end of the metal member 107 exposed on the other surface of the holder 111 is metallized and/or alloyed and connected using high frequency dielectric heating or microwave heating. The semiconductor element 101 and the circuit board 104 are both coated with the sealing material 17.
It is sealed by 0.

This example will be explained in more detail below.

First, the electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

FIG. 2 shows one manufacturing example.

First, as shown in FIG. 2(a), metal wires 121 made of a metal such as Au or an alloy with a diameter of 20 μm are wired at a pitch of 4.
The metal wire 121 is wound around a rod 122 with a thickness of 0 μm, and after wrapping, the metal wire 121 is embedded in a resin 123 such as polyimide.

Before embedding, powder made of barium titanate is mixed into the resin and the powder is dispersed in the resin. After embedding, the resin 123 is cured. The cured resin 123 becomes an insulator. Thereafter, it is sliced at the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIGS. 2(b) and 2(C). Note that the powder is not shown. In this example, the powder was dispersed by stirring the resin, but the powder may be dispersed by other methods. Further, in this example, powder made of barium titanate is dispersed, but powder or fiber made of other strong wire materials, or particles of any shape may be embedded.

In the electrical connection member 125 created in this way,
The metal wire 121 constitutes the metal member 107, and the resin 123 constitutes the holder (insulator) 111.

In this electrical connection member 125, metal wires 121 serving as metal members are electrically insulated from each other by resin 123. Further, one end of the metal wire 121 is exposed to the semiconductor element 101 side, and the other end is exposed to the circuit board 104 side. These exposed portions become connection portions 108 and 109 to the semiconductor element 101 and the circuit board 104, respectively.

Next, as shown in FIG. 1(a), a semiconductor element 101,
An electrical connection member 125 and a circuit board 104 are prepared. The semiconductor element 101 and circuit board 104 used in this example have a large number of connection parts 102 and 105 inside thereof.

Note that the connection portion 102 of the semiconductor element 101 is connected to the circuit board 1
Metal is exposed at positions corresponding to the connection portion 105 of 04 and the connection portions 108 and 109 of the electrical connection member 125.

Connection portion 102 of semiconductor element 101 and electrical connection member 1
25 or the connecting portion 105 of the circuit board 104 corresponds to the connecting portion 109 of the electrical connecting member 125. After positioning, the A° C. of the connecting portion 102 of the semiconductor element 101 is adjusted. The Au of the connection part 108 of the electrical connection member 125 and the Au of the connection part 105 of the circuit board 104 and the Au of the connection part 109 of the electrical connection member 125 are further heated using high-frequency par heating or microwave heating. connection by alloying and/or alloying (Fig. 1(b)
)). Note that the conditions of the high frequency 8 electric heating device or the microwave heating device were determined based on experimental conditions.

Here, there are the following three methods for connecting the semiconductor element 101, the electrical connection member 125, and the circuit board 104 by metallization and/or alloying, and any of these methods may be used.

■ After positioning the semiconductor element 101, the electrical connection member 125, and the circuit board 104, the connection part 1 of the semiconductor element 101 is
02 and the connection part 108 of the electrical connection member 125, and the connection part 105 of the circuit board 104 and the electrical connection member 125.
A method of simultaneously metallizing and/or alloying the connecting portion 109 of

(2) After positioning the semiconductor element 101 and the electrical connection member 125 and connecting the connection part 102 of the semiconductor element 101 and the connection part 108 of the electrical connection member 125 by metallizing and/or alloying, the circuit board 104 is connected. Position the connection portion 109 of the electrical connection member 125 and the connection portion 1 of the circuit board 104.
Method of connecting by metallizing and/or alloying 05.

■Position the circuit board 104 and the electrical connection member 125, and
After connecting the connecting portion 109 of the electrical connection member 125 by metallizing and/or alloying the connecting portion 109 of the semiconductor element 101, the semiconductor element 101 is positioned, and the connecting portion 108 of the electrical connecting member 125 and the connecting portion 102 of the semiconductor element 101 are metallized and/or alloyed. How to convert and connect.

Next, the parts created as described above (electric circuit parts)
The electric circuit components were sealed (Fig. 1(C)-1). Note that in this example, both the semiconductor element 101 and the circuit board 104 were sealed. A thermoplastic resin was used as the sealing material, and an injection molding method was used as the sealing method.

When the connectivity of the connection portions of the electrical circuit device produced as described above was examined, it was found that the connections were highly reliable.

Furthermore, the reliability of various characteristics was also excellent.

(Example 1-D 2) Example 1-Dl is shown in FIG. 1(C)-2.

In this example, in Example 1-Dl, one of the sealing materials 17
Plate 151 made of stainless steel and having a thickness of 0.1 m is placed on the surface of 0.
Paste and join.

Other points are the same as in Example 1-Dl.

(Example 1-D3) Example 1-Dl is shown in FIG. 1(C)-3.

In this example, in Example 1-Dl, a plate 151 made of stainless steel and having a thickness of 0.1 mm is bonded to the surface of the semiconductor element 101 opposite to the electrical connection member 125. Note that in this example, the plate 151 is bonded only to the semiconductor element 101.

Other points are the same as in Example 1-Dl.

(Example 1-D4) Example 1-D4 is shown in FIG. 1(C)-4.

In this example, in Example 1-Dl, the semiconductor element 101
A plate 151 made of stainless steel and having a thickness of 0.1 mm is disposed near the plate.

Other points are the same as in Example 1-Dl.

(Example 1-El) Example 1-El is shown in FIG. 1(C)-5.

In this example, in Example 1-Dl, the semiconductor element 101
Both the circuit board 104 and the circuit board 104 are sealed with a cap.

The cap has two holes inside, as shown in Figure 1(c)-5.
A cap 155゜155'' having two concave portions is used.The concave portion of this cap is the hollow portion 158,
8", and the protruding portion is in contact with the back surface of the semiconductor element 1011 circuit board 104, and the semiconductor element 101
, the circuit board 104 is firmly held by the electrical connection member 125.

In this example, the caps 155 and 155' are bonded together using an adhesive.

Other points are the same as in Example 1-Dl.

(Example 1-E2) Example 1-E2 is shown in FIG. 1(C)-6.

In this example, in Example 1-El, the semiconductor element 101
Adjustment members are interposed between the circuit board 104 and the cap 156, and between the circuit board 104 and the cap 156 to seal the caps.

Other points are the same as in Example 1-El.

(Example 2-D1) Example 2-Dl is shown in FIG. 3(a) and FIG. 3(b)-1.

In this example, a circuit board 51 is used as a first electric circuit component having a connection part 52, and a semiconductor element 4 having a large number of connection parts 5 therein is used as a second electric circuit component.

In this example, as the electrical connection member 125, a holder in which powder (not shown) made of barium titanate and 5in2 was dispersed in an organic material was used.

Further, in this example, the connection portion 54 of the electrical connection member and the connection portion 52 of the circuit board 51 are connected by metallization and/or alloying by high-frequency 8-electric heating, while the electrical connection member 125 and the semiconductor element 4 were connected by a connection method other than metallization and/or alloying. That is, the semiconductor element 4 was pressed against the electrical connection member 125 and temporarily held with an adhesive or the like, and then sealed from above.

Note that as the electrical connection member 125, one having dimensions corresponding to the semiconductor element 4 was used.

In this example, a lead frame 55 is connected to the lower surface of the circuit board 51.

In this example, only the semiconductor element 4 was sealed. The sealing material used was a thermoplastic resin in which 5in2 powder was dispersed.

Other points are the same as in Example 1-Dl.

In this example as well, the connections were connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Example 2-Dl) FIG. 3(b)-2 shows Example 2-Dl.

In this example, in Example 2-Dl, one sealant 17
Plate 151 made of stainless steel and having a thickness of 0.1 m is placed on the surface of 0.
Paste and join.

Other points are the same as in Example 2-Dl.

(Example 2-D3) FIG. 3(b)-3 shows Example 2-Dl.

In this example, in Example 2-Dl, stainless steel is used on the surface of the semiconductor element 4 opposite to the electrical connection member 125.
A plate 151 having a thickness of 0.1 mm is pasted and joined.

In this example, the plate 151 is bonded only to the semiconductor element 4.

Other points are the same as in Example 2-Dl.

(Example 2-D4) Example 2-D4 is shown in FIG. 3(b)-4.

In this example, in Example 2-Dl, a plate 151 made of stainless steel and having a thickness of 0.1 mm is disposed near the semiconductor element 4. In this example, one side of the plate 151 is sealed, and the negative side is exposed to the outside.

Other points are the same as in Example 1-Dl.

(Example 2-E 1) Example 2-El is shown in FIG. 3(b)-5.

In this example, the semiconductor element 4 is cap-sealed with a cap 155 in Example 2-Dl.

The cap used is a cap 155 having one recess inside as shown in FIG. 3(b)-5. Using this cap 155, hollow portions 15 are provided on both sides of the semiconductor element 4.
The cap is sealed so that 8 is formed. In this example, only the semiconductor element 4 is sealed with a cap. .

The other points are the same as in Example 2-Dl.

(Example 2-E2) Example 2-E2 is shown in FIG. 3(b)-6.

In this example, in Example 1-El, an adjustment member 156 is interposed between the semiconductor element 4 and the cap 155 to seal the cap.

Other points are the same as in Example 1-El.

(Example 3-DI) Example 3-DI is shown in Figure 4(a)-1 and Figure 4(b)-1.
shows.

In this example, the first electric circuit component is the semiconductor element 4, and the second electric circuit component is the circuit board 51.

After the connection, the Lee frame 1 was connected to the upper surface of the circuit board 51, and then the electric circuit member was set in the cavity of the mold, and injection was performed to form the sealing material 170.

The sealing material 170 was made by dispersing 5i02 powder in a thermoplastic resin.

Note that FIG. 4(a) shows an example in which the semiconductor element 4 is entirely filled with a sealing material, and FIG. 4(b) shows an example in which the top surface of the semiconductor element 4 is exposed to the outside and the sides are sealed. This is an example of filling it with wood.

Other points are the same as in Example 1-Dl.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Example 3-D2) Example 3-D2 is shown in FIG. 4(a)-2.

In this example, in Example 3-D], one of the sealing materials 17
Plate 15 made of stainless steel and having a thickness of 0.1 m is placed on the surface of 0.
Paste and join 1.

Other points are the same as in Example 3-Dl.

FIG. 4(b)-2 shows a modification of Example 3-D2.

In this modification, in the modification of Example 3-Dl, one plate 1 is provided on the surface of the sealing material 170 and the exposed surface of the semiconductor element 4.
51 is pasted and joined.

The other points are the same as the modified example of Example 3-Dl.

(Example 3-D3) Example 3-D3 is shown in FIG. 4(a)-3.

In this example, in Example 3-Dl, stainless steel is applied to the surface of the semiconductor element 4 opposite to the electrical connection member 125.
A plate 151 having a thickness of 0.1 mm is pasted and joined.

Other points are the same as in Example 3-Dl.

FIG. 4(b)-3 shows a modification of Example 3-D3.

In this modification, a plate 151 is pasted and bonded to the exposed surface of the semiconductor element 4 in the modification of Example 3-Dl. The surface of the plate 151 opposite to the semiconductor element is exposed to the outside.

The other points are similar to the modified example of Example 3-Dl.

(Example 3-D4) Example 3-D4 is shown in FIG. 4(a)-4.

In this example, in Example 3-Dl, a combination 1 of stainless steel plates with a plate thickness of 0.1 mm is placed near the semiconductor f4.
51 is arranged. In this example, the plate combination 151 is arranged to surround the semiconductor element 4.

Other points are the same as in Example 3-Dl.

FIG. 4(b)-4 shows a modification of Example 3-D4.

In this modification, plates 151 are provided on both sides of the semiconductor element 4, respectively, in the modification of Example 3-Dl. One side of each plate 151 is exposed to the outside.

Other points are similar to the modified example of Example 3-DI.

(Example 3-El) FIG. 4(a)-5 shows Example 3-El.

In this example, in Example 3-Dl, the semiconductor element is 4.
4, and the heights of the two semiconductor devices are made to differ by 4.4°.
The cap is sealed.

As shown in FIG. 3(b)-5, a cap 155 is used which has a recessed portion with a step inside. This cap 155 is used to seal the semiconductor element 4.4' so that a hollow part 158 is formed on both sides of the semiconductor element 4.4'.

Other points are the same as in Example 3-Dl.

FIG. 4(b)-5 shows a modification of Example 3-El.

In this modification, each of the semiconductor element 4 and the semiconductor element 4' is separately cap-sealed in the present embodiment.

Other points are similar to this embodiment.

(Example 3-El) Example 3-El is shown in FIG. 4(a)-6.

In this example, in Example 3-El, an adjustment member 156 is interposed between the semiconductor element 4 and the cap 156 to seal the cap.

Other points are the same as in Example 3-El.

(Example 4-Di) FIG. 5(a)-1 shows Example 4-Dl.

In this example, the first electric circuit component is a semiconductor element 4'',
This is an example in which the second electric circuit component is the semiconductor element 4. In this example, an electrical connection member having a size corresponding to the semiconductor element 4 is used, and the lead frame 1 is connected to the first electrical connection member 125. It is connected to the metal member exposed on the semiconductor element 4' side.

As the insulator of the electrical connection member 125, an organic material in which either or both of powder and fiber of a strong electric material such as barium titanate was dispersed was used. Figure 5(a)
-1 both show the case where connection is made by metallization and/or alloying by high frequency 8 electric heating or microwave heating. On the other hand, in the example shown in FIG. 5(b)-1, only one side was connected by metallization and/or alloying by high-frequency 8-electric heating or microwave heating.

Note that FIG. 5(a)-1 indicates the upper semiconductor element 4.4"
This is an example in which the entire area is filled with sealing material, as shown in Figure 5(b)-1.
This is an example in which the upper surfaces of the semiconductor elements 4, 4' are exposed to the outside, and the side portions are filled with a sealing material.

Other points are the same as in Example 3-Dl.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Example 4-D2) Example 4-D2 is shown in FIG. 5(a)-2.

In this example, in Example 4-Dl, both sealing materials 17
A plate 151 made of stainless steel and having a thickness of 0.1 m is placed on the surface of 0.
Paste and join.

Other points are the same as Example 4-Dl.

FIG. 5(b)-2 shows a modification of Example 4-D2.

In this modified example, in the modified example of Example 4-Dl, a single plate 151 is pasted and joined to the surface of the encapsulant 170 and the exposed surface of the semiconductor element at 4°, and the encapsulant 170
A single plate 151 is attached to the surface of the semiconductor element 4 and the exposed surface of the semiconductor element 4 for bonding.

The other points are the same as the modified example of Example 4-Dl.

(Example 4-D3) Example 4-D3 is shown in FIG. 5(a)-3.

In this example, in Example 4-Dl, stainless steel is attached to the surface of the semiconductor element 4 opposite to the electrical connection member 125.
A plate 151 with a thickness of 0.1 mm is pasted and joined,
Further, a plate 151 made of stainless steel and having a plate thickness of 0.1 mm is placed on the side opposite to the electrical connection member 125 of the semiconductor element 4°.
Paste and join.

Other points are the same as Example 4-Dl.

FIG. 5(b)-3 shows a modification of Example 4-D3.

This modification is a modification of Embodiment 4-Dl in which a plate 151 is attached and bonded to the exposed surface of the semiconductor element 4, and a plate 151 is attached to the exposed surface of the semiconductor element 4. It is joined. Note that the semiconductor element 4 of the plate 151
, 4° is exposed to the outside.

The other points are the same as the modified example of Example 4-Dl.

(Example 4-D4) Example 4-D4 is shown in FIG. 5(a)-4.

In this example, in Example 4-Dl, a plate 15 made of stainless steel and having a plate thickness of 0.1 mm is placed near both sides of the semiconductor element 4''.
1 are respectively disposed, and a plate 151 is disposed near the semiconductor element 4. Note that one surface of the plate 151 disposed near the semiconductor element 4 is exposed to the outside.

Other points are the same as Example 4-Dl.

FIG. 5(b)-4 shows a modification of Example 4-D4.

In this modification, in the modification of Embodiment 4-Dl, plates 151 are disposed near both side surfaces of the semiconductor element 4''. Note that one surface of the plate 151 is exposed to the outside.

The other points are the same as the modified example of Example 4-Dl.

(Example 4-El) Example 4-El is shown in FIG. 5(a)-5.

In this example, in Example 4-Dl, the semiconductor element is 4.
Each of the 4 degrees is sealed with a cap.

Other points are the same as Example 4-Dl.

(Example 4-El) Example 4-El is shown in FIG. 5(a)-8.

In this example, in Example 4-El, a tall semiconductor element is cap-sealed by interposing an adjustment member 156 having a step between 4, 4' and the cap 155.

Other points are the same as in Example 4-El.

(Example 5) Example 5 is shown in FIG.

Embodiment 5 is an example in which circuit boards 101 and 104 whose portions other than the connecting portions are covered with insulating films 103 and 106 are used as the first electric circuit component and the second electric circuit component.

Further, as an electrical connection member, one shown in FIG. 7 was used. That is, in the electrical connection member 125 shown in FIG. 7, the exposed portion of the metal member 107 protrudes from the surface of the holder (resin insulator) 111. Such electrical connection member 125 may be created, for example, by the following method.

First, by the method described in Example 1-Dl, FIG.
) and (C) are prepared. Next, both surfaces of this electrical connection member may be etched until the metal wire 121 protrudes from the polyimide resin 123 by about 10 μm.

Note that in this embodiment, the amount of protrusion of the metal wire 121 was set to 10 μm, but any amount may be used.

Furthermore, the method for making the metal wire 121 protrude is not limited to etching, and other chemical or mechanical methods may be used.

Other points are the same as in Example 1-Dl.

Note that the protruding portion and the electrical connection member 125 are connected to the metal wire 121.
A bump 150 as shown in FIG. 8 may be formed by inserting the metal wire 121 into a mold having a recess at the position and crushing the protrusion 126 of the metal wire 121. In this case, the metal wire 121 becomes difficult to fall off from the insulator 111.

Note that in this example as well, the metal wire 121 constitutes the metal member 107, and furthermore, the resin 123 constitutes the insulator 111.

Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Example 6-DI) Example 6-Dl is shown in FIG. 9(a) and FIG. 9(b)-t.

In this example, a semiconductor element 4 is used as the first electrical circuit component, and a lead frame 1 is used as the second electrical component.

The connection part 6 of the lead frame 1 has Ag on the surface of the 4270i.
I used a plated one.

For connection, a thermocompression bonding method using both high-frequency dielectric heating and external heating was used.

The other points are the same as in Example 5.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Example 6-D2) Example 6-D2 is shown in FIG. 9(b)-2.

In this example, in Example 6-Dl, one of the sealing materials
Hole 15 made of stainless steel and 0.1m thick on the surface of 70
The plates 151 with 2 holes are pasted and joined.

Other points are the same as in Example 6-Dl.

(Example 6-D3) Example 6-D3 is shown in FIG. 9(b)-3.

In this example, in Example 6-Dl, stainless steel is attached to the surface of the semiconductor element 4 opposite to the electrical connection member 125.
A plate 151 having a thickness of 0.1 mm and a gap of 152 is pasted and joined.

Other points are the same as in Example 6-Dl.

(Example 6-04) Example 6-D4 is shown in FIG. 9(b)-4.

In this example, in Example 6-Dl, a plate 151 made of stainless steel and bent at an approximately right angle and having a plate Ji of 0.1 mm is disposed near the semiconductor element 4.

Other points are the same as in Example 6-Dl.

(Example 6-E 1) Example 6-El is shown in FIG. 9(b)-5.

In this example, the semiconductor element 4 and the lead frame 1 are each sealed with a cap.

Other points are the same as in Example 6-Dl.

(Example 6-El) FIG. 9(b)-6 shows Example 6-El.

In this example, an adjusting member 156 is interposed between the semiconductor element 4 and the cap 155 to seal the cap in Example 6-E].

Other points are the same as in Example 6-El.

(Example 7) Example 7 is shown in FIG.

In this example, the electrical connection member 125 is different from the electrical connection member shown in the fifth embodiment. That is, in the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in Example 5. That is, in this example, the pitch between the metal members 107 is set to be narrower than the interval between the first circuit board connecting portions.

In other words, in the fifth embodiment, since the connection position of the electrical connection member 125 was arranged at the connection position between the first circuit board 101 and the second circuit board 104, it was necessary to position the electrical connection member 125. , in this example, the first circuit board 10
Although it is necessary to position the circuit board 1 and the second circuit board 104, positioning the electrical connection member 125 is not necessary. Therefore, the first circuit board 101 and the second circuit board 10
It is also possible to connect without positioning by selecting appropriate values for the connection dimensions (d++, P++) of No. 4 and the connection dimensions (d12.PI3) of the electrical connection member.

The electrical connection member 125 used had protrusions 126 on both sides.

Other points are the same as in Example 1-Dl.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Example 8) FIG. 11 shows an electrical connection member used in Example 8.

FIG. 11(a) is a perspective view of the electrical connection member, FIG.
b) is a sectional view of the electrical connection member.

An example of making such an electrical connection member will be described below.

First, three electrical connection members 128, 129, and 130 are prepared using the manufacturing method shown in Example 1-Dl.

The position of metal wire 1°21 of the first sheet 128 is m row and n column,
It is displaced from the center by ma and nb.

The position of the metal wire 121 in the second sheet 129 is ma at row m and column n.
It is displaced from the center by c and nbc.

The position of the metal wire 121 in the third sheet 130 is mad in m rows and n columns.
, nbd from the center. a.

The values of b, c, and d are such that the upper and lower metals 121 are electrically conductive, but the left and right sides are not electrically conductive with each other. The three electrical connection members are positioned and laminated using a method such as thermocompression bonding to create the electrical connection member 125.

In addition, in this example, the positions of the metals of the electrical connection members were selected according to rules such as m rows and n columns, but the metals on the top and bottom were conductive, and the left and right sides were not electrically conductive with each other. It can be random if you do.

In addition, although this example describes the case where three layers are laminated, two
Any number of sheets may be used as long as it is more than one sheet. Further, although it has been described that the layers are laminated using a method such as thermocompression bonding, methods such as high frequency 8 electric heating, pressure bonding, adhesion, etc. may also be used. Furthermore, the electrical connection member of this example may be processed to provide a protrusion as shown in FIG. 7, or a bump 150 as shown in FIG. 8.

Other points are the same as in Example 1-Dl.

In this example as well, the connections were connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

(Example 9) FIG. 12 shows an electrical connection member used in Example 9.

FIG. 12(a) is a cross-sectional view of the electrical connection member during manufacture;
FIG. 12(b) is a perspective view of the electrical connection member,
Figure (c) is the above sectional view.

A hole 142 having a diameter larger than 20 μmφ is previously drilled in the holder 127 made of alumina ceramic and barium titanate. Next, one metal wire 121 made of a metal such as Au or an alloy with a diameter of 20 μm is passed through the hole 142, and the resin 123 is inserted into the hole 142.
is inserted between the holding body 127 and the metal wire 121, and the resin 12
Cure 3. The hardened resin 123 becomes an inclusion.

Thereafter, the metal wire 121 is sliced at the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIG. 12(b).
Shown in (c).

Further, the electrical connection member of this example may be processed to provide a protrusion as shown in FIG. 7, or a bump 150 as shown in FIG. 8.

Other points are the same as in Example 1-Dl.

In this example as well, the connection section was connected with high reliability.

Furthermore, the reliability of various characteristics was also excellent.

"Effects of the Invention" Since the present invention is configured as described above, the following numerous effects can be obtained.

1. Highly reliable connections between semiconductor elements and electrical circuit components such as circuit boards and lead frames can be obtained. Therefore, the conventionally used wire bonding method, T
It becomes possible to replace the AB method and the CCB method (Claims 1 to 13).

2. According to the present invention, since the connection part of the electric circuit component can be placed in any position (especially inside), it is possible to connect at more points than the wire bonding method or the TAB method, making it a method suitable for connection with a large number of pins. becomes. Furthermore, since an insulating material exists between adjacent metals of the electrical connection member, electrical conduction between adjacent metals does not occur even if the adjacent pitch is narrowed, making it possible to connect more points than the CCB method. (Claims 1 to 13).

3. Since the amount of metal members used in the electrical connection member is small compared to conventional ones, even if expensive metals such as gold are used for the metal members, it will be cheaper than conventional ones (Claims 1 to 3) 13).

4. Electric circuit devices such as high-density semiconductor devices can be obtained (
Claims 1 to 13).

5. In the present invention, one or both of the connections between the connection portion of the electric circuit component and the electrically conductive member exposed on one or the other surface of the holder are mainly performed by high-frequency Parr heating method or microwave heating method. The internal heating method directly or indirectly heats and connects the connection part, so selective heating can be performed even if there is a material with poor heat resistance in at least a part of the electric circuit member or in the vicinity of the electric circuit member. , prevents material deterioration and deterioration due to heating, is better and more reliable,
Furthermore, connections with a wide range of applications are possible.

Further, the influence of thermal expansion and contraction caused by heating on at least a portion of the electric circuit member or materials in the vicinity of the electric circuit member can be reduced. Furthermore, since it becomes possible to apply a uniform high-frequency electromagnetic field, uniform heating becomes possible. Furthermore, since non-contact heating can be performed, the jig etc. of the heating section can be simplified.

(Claims 1 to 13) 6. When one or the other electric circuit component is connected by a connection other than metallization and/or alloying, the heat generated in the electric circuit component during metallization and/or alloying Deterioration can be prevented.

Additionally, depending on the application, it may be desirable to make electrical circuit components removable.
It becomes possible to meet such requests (claims 2 and 4).

In addition, if both electrical circuit components are connected via an electrical connection member and a connection body formed by metallization and/or alloying, the electrical circuit components are strong (strong in terms of strength). The connection is secure and mechanically strong.
It is possible to obtain electrical circuit devices with extremely low defective rates (
Claim 3, Claim 5).

7. Since the sealing material can be injected at high pressure, it is possible to seal not only thermosetting resin for constant pressure transfer but also thermoplastic resin that needs to be injected at high pressure (Claim 2, Claim 3) .

8. When one or both of powders or fibers of one or more of metals, alloys, and ceramics are dispersed in the sealing material,
Since the thermal expansion coefficient of the encapsulant approaches the thermal expansion coefficient of the electric circuit component, even when heat is applied, less thermal stress is generated, and a highly reliable electric circuit device and, by extension, a semiconductor device can be obtained. 6).

9. When sealing with a cap in the present invention, since the electric circuit device is hollow, there is little thermal stress generated even when heat is applied, and a highly reliable electric circuit device can be obtained. Also,
When the cap and electrical circuit components are in contact and the cap is made of a material with good thermal conductivity, the heat generated from the electrical circuit components is quickly conducted to the outside through the cap, resulting in an electrical circuit with better heat dissipation characteristics. You can get the equipment. Furthermore, when the cap is made of a material with good noise shielding properties, particularly metal such as iron, an electric circuit device with even better shielding effect can be obtained (Claims 4 and 5).

10. When an adjustment member is interposed between the cap and the electric circuit component, it is possible to assemble the electric circuit component efficiently and easily even if the height of the electric circuit component varies (Claim 8).

11. When a plate is bonded to at least a part of the surface of the sealing material, when the plate is bonded to an electric circuit component and at least a portion of at least one of the plates is embedded with the sealing material, and If at least a portion of the board placed near the electrical circuit components is embedded, stress concentration can be alleviated even if internal stress is generated in the device or force is applied from the outside.
Cracks that may occur due to stress concentration can be prevented. This plate also has the effect of lengthening the path from the outside world to the electrical circuit components, making it difficult for water or the like to enter the electrical circuit components from the outside. Therefore, the reliability of the device can be improved (Claims 7 and 9).

In addition, if the material of the plate is metal such as stainless steel, ceramic with good thermal conductivity, carbon, diamond, etc., the heat generated from the electric circuit components can be quickly radiated to the outside world, so the heat radiation characteristics An excellent electric circuit device can be obtained. Furthermore, when the material of the plate is metal, noise from the outside world can be blocked, and an electric circuit device with good characteristics that is less susceptible to noise can be obtained.

12. When the insulating material of the holder of the electrical connection member contains one or more types of powder or fiber portion of the metal material, an electric circuit device with a high shielding effect can be obtained (
Claim 12, Claim 13).

13. The holder for the electrical connection member is a holder made of an insulator dispersed with one or both of powder and fiber made of one or more of metal materials and inorganic materials with good thermal conductivity. Alternatively, if the holder is made of a metal material insulated with an insulating material so that the electrically conductive members are insulated, or if the holder is made of an inorganic material with good thermal conductivity, the heat generated by the electric circuit components can be removed. Since the generated heat can be radiated to the outside via the electric circuit member and other electric circuit components, an electric circuit device with good heat dissipation properties can be obtained.

Furthermore, when one or both of powders or fibers of one or more kinds of metal materials and inorganic materials having a coefficient of thermal expansion relatively close to that of the electric circuit components is dispersed in the insulator of the electrical connection member. Since the coefficient of thermal expansion is close to that of the electric circuit component, even if heat is applied, less thermal stress is generated, and a highly reliable electric circuit device, and by extension, a semiconductor device can be obtained (Claim 12, Claim 13).

[Brief explanation of the drawing]

FIG. 1(a), FIG. 1(b), FIG. 1(C)-1 to FIG. 1(c)-6 are from Example 1-Dl to Example 1-El.
FIG. 1(a) is a cross-sectional view showing the state before connection, and FIG.
b) after connection, from Figure 1(c)-1 to Figure 1(c)-6
indicates the state after sealing. FIG. 2 is a diagram for explaining an example of a manufacturing method of an electrical connection member used in Example 1-Dl to Example 1-El, and FIG. 2(a) is a cross-sectional view; (b) is a perspective view;
FIG. 2(C) is a sectional view. Figure 3(a), Figure 3(b)-1 to Figure 3(b)-6
shows Example 2-Dl to Example 2-El, FIG. 3(a) is a perspective view, FIG. 3(b) = 1 to FIG. 3(b)
-6 is a sectional view. FIG. 4(a)-1 to FIG. 4(a)-6 show Example 3-
FIG. 4(b)-i to FIG. 4(b)-5 are cross-sectional views showing modified examples of Example 3-El from Example 3-Dl. It is a diagram. FIG. 5(a)-1 to FIG. 5(a)-6 show Example 4-
It is a sectional view showing Example 4-El from Dl, and FIG.
b)-1 to FIG. 5(b)-4 are cross-sectional views showing modifications of Example 4-Dl to Example 4-D4. FIG. 6 shows Example 5, and FIG. 6(a) shows the sixth embodiment before connection.
Figure (b) is a sectional view showing the state after connection. FIGS. 7 and 8 also show Example 5, with FIGS. 7(a) and 8(a) being perspective views, and FIGS. 7(b) and 8(b)
is a sectional view. Figure 9(a), Figure 9(b)-1 to Figure 9(b)-6
shows Example 6-Dl to Example 6-El, FIG. 9(a) is a perspective view showing the state before connection, and FIG. 9(b) is a perspective view showing the state before connection.
)-1 to FIG. 9(b)-6 are cross-sectional views showing the state after connection. FIG. 10 is a sectional view showing Example 7, and FIG.
) shows the state before connection, and FIG. 10(b) shows the state after connection. FIG. 11 shows an electrical connection member according to Example 8, and the first
FIG. 1(a) is a perspective view, and FIG. 11(b) is a sectional view. FIG. 12 shows an example of manufacturing an electrical connection member according to Example 9, and FIGS. 12(a) and 12(C) are cross-sectional views.
Figure (b) is a perspective view. 13 to 20 show conventional examples, except for FIG. 14, which is a sectional view, and FIG. 14 is a plan perspective view. (Explanation of symbols) 1... Lead frame, 2... Element mounting part of lead frame, 3... Silver paste, 4.4°... Semiconductor element, 5,5°... Semiconductor element Connection part, 6... Connection part of lead frame, 7... Ultrafine metal wire, 8...
Resin, 9... Semiconductor device, 10... Outer periphery of semiconductor element, 11... Outer rim of element mounting portion of lead frame, 16... Carrier film substrate, 17... Carrier film substrate Inner lead part, 20...resin, 21...resin, 31...solder bump, 32...
- Substrate, 33... Connection part of the board, 51... Circuit board, 52... Connection part of the circuit board, 54... Connection part of the electrical connection member, 55... Lead frame, 70, 70
°...Metal material, 71,71°...Insulating film, 72,7
2°...Exposed surface of insulating film, 73,73°...Exposed surface of metal material, 75.75'...Circuit base material, 76.76°
... Connection portion of circuit base material, 77 ... Insulating material of anisotropic conductive film, 78 ... Anisotropic conductive film, 79 ... Conductive particles, 81 ... Insulating material of elastic connector, 82・
... Metal wire of elastic connector, 83 ... Elastic connector, 101 ... Electric circuit component (semiconductor element, circuit board), 102 ... Connection part, 103 ... Insulating film, 106 ... Insulating film , 104... Electric circuit component (circuit board), 105... Connection part, 107... Electrically conductive member (metal member), 108... Connection part, 109
... Connection part, 111 ... Holder (insulator), 121
...metal wire, 122...rod, 123...resin, 1
24... Dotted line, 125... Electrical connection member, 126
...Protrusion, 127...Holder, 128, 129, 1
30... Electrical connection member, 131, 132... Metal wire guide plate, 150... Bump, 151... Plate, 14
2゜152... Hole, 155.155°... Cap, 156... Adjustment member, 158, 158'... Hollow part, 170... Sealing material. Figure 1 (0) 102 +01 Figure 1 (C) -7 +70 Figure 1 (c) -2 +70 Figure 1 Cc) -3 10 Figure 1 (c) -5 Figure 1 (c) - 6 Figure 2(a) Figure 3(0) Figure 3(b)-7 Figure 3(b)-2 Figure 3(b)-,( Figure 3(b)-4 Figure 3( b) -5 Figure 3 (b) -6 Figure 4 (a) -J Figure 5 Ca) -1 +70 54 125 Figure 4 (a) -2 Figure 5 (0) -2 Figure 4 ( a)-,3 Fig. 5(a)-J Fig. 4(a)-4 Fig. 5(a)-4 Fig. 4(a)-5 Fig. 5(a)-5 Fig. 4(a) ), -6 Figure 5(a)-6 Figure 4(b)-7 Figure 4(b)-2 Figure 5(b)-2 Figure 4(b)-, T Figure 5(b) )-3 Fig. 4(b)-4 Q8 Fig. 6(0) Fig. 6(b) Fig. 7(a) Fig. 7(b) ♂ l,? l Ill Figure 8(a) Figure 8(b) Figure 9(a) Figure 9(b)-7 Figure 9(b)-2 IU/Ill 6 Figure 9(b)-3 9th Figure (b)-4 1 et al ICJ/ II+ 6 Figure 9 (b)-6' Figure 10 (0) Figure 10 (b) Figure 11 (a) Figure 11 (b) Figure 12 ( a) Figure 12 (c) Figure 13 Figure 15 Figure 17 Old figure

Claims (13)

[Claims] (1) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
at least one electrical circuit component to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; In the department,
and at least one or more other electrical circuit components to which the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected. The method for connecting electrical circuit components includes: connecting at least one electrically conductive member exposed on one surface of the holder to at least one electrical circuit component; or connecting at least one electrically conductive member exposed on one surface of the holder; metallization of one or both of the connections between at least one or more electrically conductive members and at least one or more electrical circuit components that are exposed in A method for connecting electrical circuit components, characterized in that the connection is made by alloying and/or by alloying. (2) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member, the other end of which is exposed on the other surface of the holder;
at least one electrical circuit component to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; In the department,
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made by metallizing and/or alloying the connecting portion and the other end using an internal heating method mainly using a high frequency dielectric heating method or a microwave heating method. an electrical circuit component connected to the electrical connection member on one surface of the holder and another electrical circuit component connected to the electrical connection member on the other surface of the holder; An electric circuit device comprising: a sealing material that embeds and seals at least a portion of one or both of the electric circuit components. (3) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
At least one or more electrical circuits are connected by metallizing and/or alloying the connecting portion and the one end, mainly using an internal heating method using a high-frequency dielectric heating method or a microwave heating method. with a component; having at least one or more connecting portion, in the connecting portion;
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made by metallizing and/or alloying the connecting portion and the other end using an internal heating method mainly using a high frequency dielectric heating method or a microwave heating method. an electrical circuit component connected to the electrical connection member on one surface of the holder and another electrical circuit component connected to the electrical connection member on the other surface of the holder; An electric circuit device comprising: a sealing material that embeds and seals at least a portion of one or both of the electric circuit components. (4) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
at least one electrical circuit component to which one end of at least one of the electrically conductive members exposed on one surface of the holder is connected; In the department,
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made by metallizing and/or alloying the connecting portion and the other end using an internal heating method mainly using a high frequency dielectric heating method or a microwave heating method. an electrical circuit component connected to the electrical connection member on one surface of the holder, and an electrical circuit component connected to the electrical connection member on the other surface of the holder; An electric circuit device comprising: at least one cap sealing at least one of other electric circuit components. (5) A holder made of an electrically insulating material and a plurality of electrically conductive members embedded in the holder, one end of which is exposed on one surface of the holder. and an electrical connection member with the other end of the electrically conductive member exposed on the other surface of the holder; and at least one connection part, in the connection part:
one end of at least one of the electrically conductive members exposed on one surface of the holder is connected;
At least one or more electrical circuits are connected by metallizing and/or alloying the connecting portion and the one end, mainly using an internal heating method using a high-frequency dielectric heating method or a microwave heating method. with a component; having at least one or more connecting portion, in the connecting portion;
the other end of at least one of the electrically conductive members exposed on the other surface of the holder is connected;
The connection is made by metallizing and/or alloying the connecting portion and the other end using an internal heating method mainly using a high frequency dielectric heating method or a microwave heating method. The electrical circuit component is connected to the electrical connection member on one surface of the holder, and the electrical circuit component is connected to the electrical connection member on the other surface of the holder. An electric circuit device comprising at least one cap sealing at least one other electric circuit component. (6) The sealing material is a thermoplastic resin or a thermoplastic resin in which one or both of powders and fibers made of one or more of metals, alloys, and inorganic materials are dispersed. 3. The electric circuit device according to 3. (7) The electric circuit device according to claim 2, 3, or 6, wherein a plate made of a material different from the sealing material is bonded to at least a portion of the surface of at least one of the sealing materials. (8) The electric circuit device according to claim 4 or 5, wherein an adjustment member is interposed between the electric circuit component and the cap. (9) The electrical connection member is connected to at least a portion of at least one of the electrical circuit components on the side opposite to the electrical connection member, or near any one or more sides of the electrical circuit component and/or the electrical connection member Claim 2, Claim 3, or Claim 3, wherein at least a part of the electrical circuit component and the plate made of a material different from the sealing material are embedded in the sealing material. 6. The electric circuit device according to 6. (10) The method for connecting electrical circuit components according to claim 1, wherein the electrical circuit components are semiconductor elements, circuit boards, silicon substrates, or lead frames. (11) The electric circuit device according to any one of claims 2 to 9, wherein the electric circuit component is a semiconductor element, a circuit board, a silicon substrate, or a lead frame. (12) The material of at least one part of the electric circuit component or the holding body, or one type of powder, fiber, plate-shaped body, rod-shaped body, spherical body, or any other shape that is embedded or dispersed in the holding body. Claim 1: The plurality of types of materials are composed of materials having a relatively large product of relative dielectric constant and dielectric power factor.
Or the method for connecting electric circuit components according to claim 10. (13) The material of at least a part of the electric circuit component or the holding body, or one type of powder, fiber, plate-shaped body, rod-shaped body, spherical body, or any other shape that is embedded or dispersed in the holding body. Claim 2: The plurality of types of materials are composed of materials having a relatively large product of relative permittivity and dielectric power factor.
The electric circuit device according to any one of claims 9 to 11.