JPH01292832A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH01292832A JPH01292832A JP12421888A JP12421888A JPH01292832A JP H01292832 A JPH01292832 A JP H01292832A JP 12421888 A JP12421888 A JP 12421888A JP 12421888 A JP12421888 A JP 12421888A JP H01292832 A JPH01292832 A JP H01292832A
- Authority
- JP
- Japan
- Prior art keywords
- ice
- burrs
- shot material
- water
- shot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000463 material Substances 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 7
- 239000002699 waste material Substances 0.000 abstract description 7
- 238000005868 electrolysis reaction Methods 0.000 abstract description 4
- 230000008030 elimination Effects 0.000 abstract 2
- 238000003379 elimination reaction Methods 0.000 abstract 2
- 239000000843 powder Substances 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910001651 emery Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C2045/0077—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping removing burrs or flashes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、半導体装置の製造方法に係り、特に半導体
装置のモールド後のリードフレーム上に発生したバリの
除去方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for removing burrs generated on a lead frame of a semiconductor device after molding.
従来の半導体装置の製造工程におけるリードフレーム上
のバリ取りを第２図について説明する。Deburring on a lead frame in a conventional semiconductor device manufacturing process will be explained with reference to FIG.
第２図において、１は半導体装置のモールド部、２は半
導体装置のリードフレーム、３はこのり−ドフレーム２
上に発生したバリ、９は高圧ポンプ、１ｏはショット材
である水を収容するシー１１１・ツ材タンク、１１は前
記バリ３に水ンＢ ＋−ツを吹き付けるノズルである。In FIG. 2, 1 is the mold part of the semiconductor device, 2 is the lead frame of the semiconductor device, and 3 is the lead frame 2.
9 is a high-pressure pump, 1o is a tank 111 for storing water as a shot material, and 11 is a nozzle for spraying water B+- onto the burr 3.
従来のバリ取り動作は、まず、電解にてリードフレーム
２上のバリ３を膨潤させたのち、シ９トッ材タンク１ｏ
内の水を高圧ポンプ９により、ノズル１１を介してバリ
３に吹き付けてバリ取りを行っている。In the conventional deburring operation, first, the burr 3 on the lead frame 2 is swollen by electrolysis, and then the burr 3 on the lead frame 2 is swollen.
The water inside is sprayed onto the burrs 3 through a nozzle 11 by a high-pressure pump 9 to remove burrs.
なお、バリ取り時に用いるシアット材としては、水の外
、エメリ粉、ガラスパウダ等も用いられている。In addition to water, emery powder, glass powder, and the like are also used as the sheet material used for deburring.
上述のような従来のバリ取り方法は、シ、ッ１、月とし
て水を用いているため、リードフレーム２上のバリ３が
厚く、電解後のバリ３の膨潤不足が発生した場合、バリ
３が完全に除去できない。また、他のショット材、例え
ばエメリ粉等を用いた場合には、ホコリの発生やシロッ
ト材の廃棄物処理を行わなければならない等の問題点が
あった。The conventional burr removal method described above uses water as a filler, so if the burr 3 on the lead frame 2 is thick and insufficient swelling of the burr 3 occurs after electrolysis, the burr 3 will be removed. cannot be completely removed. Further, when other shot materials such as emery powder are used, there are problems such as the generation of dust and the necessity of disposing of the waste material of the shot materials.
この発明は、上記のような問題点を解消するためになさ
れたもので、ショット効果を上げるとともに、ホコリの
発生、廃棄物処理等を必要としないバリ取り方法を得る
ことを目的とする。This invention was made to solve the above-mentioned problems, and aims to provide a deburring method that increases the shot effect and does not require dust generation or waste disposal.
この発明に係る半導体装置の製造方法は、シフット材と
して氷を用い、この氷と水とを混合した状態でバリに吹
き付けてバリを除去するものである。A method of manufacturing a semiconductor device according to the present invention uses ice as a shift material, and sprays a mixture of ice and water onto burrs to remove burrs.
この発明においては、シｍ７１・材として氷を用いたこ
とから、これをバリに吹き付けなた場合、氷の研削効果
とともに、厚いバリでも除去することができる。また、
ショット材が氷のため、ホコリの発生はなくなり、かつ
廃棄物処理も必要でなく、無公害でバリ取りが行える。In this invention, since ice is used as the shim 71, when it is sprayed onto burrs, even thick burrs can be removed along with the grinding effect of ice. Also,
Since the shot material is ice, there is no dust generation, no waste disposal is required, and deburring can be done without pollution.
以下、この発明の一実施例を第１図によっ゛〔説明する
。An embodiment of the present invention will be described below with reference to FIG.
第１図において、第２図と同一符号は同じものを示し、
４は高圧ポンプ、５は製氷機、６は圧力水と氷シフッ１
−材を混合して噴射するノズル、７は氷シフ・ソ１−材
、８は前記氷ンηツト材７の吹き付は後に回収する回収
部である。In Figure 1, the same symbols as in Figure 2 indicate the same things,
4 is a high pressure pump, 5 is an ice maker, 6 is a pressure water and ice maker 1
7 is a nozzle that mixes and sprays the ice shaving material 7, and 8 is a recovery unit that collects the ice shaving material 7 after spraying it.
第１図におけるバリ取り方法は、リードフレーム２上の
バリ３に製氷機５で作られた氷を高圧ポンプ４からの圧
力水とともに、ノズル６より水と氷が混合された氷ショ
ット材７として吹きつけ、氷の研削効果を利用してバリ
３の除去を行う。氷ショット材７は、バリ取り後回収部
８にて回収され、製氷機５ヘリターンさせる。The deburring method shown in FIG. 1 is to apply ice made by an ice maker 5 to a burr 3 on a lead frame 2 along with pressure water from a high pressure pump 4, and use it as an ice shot material 7, which is a mixture of water and ice, from a nozzle 6. The burr 3 is removed by spraying and using the grinding effect of ice. After deburring, the ice shot material 7 is recovered in a recovery section 8 and returned to the ice making machine 5.
この方法でバリ取りを行うと、従来の水圧のみでのバリ
取りと異なり研削力が付加されることで、腔潤し−（い
ないバリまた（よ厚いバリでも除去できる。さらに、ホ
コリの発生もなく、廃棄物処理も必要としない、。When deburring with this method, unlike conventional deburring using only water pressure, grinding force is added, which removes burrs that are not moist or even thick burrs.Furthermore, it does not generate dust. , does not require waste disposal.
以上説明したように、この発明は、シｉｙ＋・材として
氷を用い、この氷と水とを混合した状態でバリに吹き付
けてバリを除去するので、バリに吹き付けられるりヨツ
ト材は、研削効果により電解による膨潤されないバリま
たは厚いバリ等でも除去することができる。また、ショ
ツト材に氷を用いたため、回収利用が可能であり、ホコ
リの発生がなく、かつ廃棄物処理の必要がない無公害の
バリ取りが行える利点がある。As explained above, this invention uses ice as the grinding material and sprays the mixture of ice and water on the burrs to remove the burrs. Even thick burrs or burrs that are not swollen by electrolysis can be removed. In addition, since ice is used as the shot material, it can be recovered and reused, and there are advantages in that pollution-free deburring can be performed without generating dust and requiring no waste disposal.
第１図はこの発明のバリ取り方法を説明するための構成
図、第２図は従来のバリ取り方法を説明するための構成
図である。
図において、１はモールド部、２はリード７レム、３は
バリ、４は高圧ポンプ、５は製氷機、６はノズル、７は
氷ショット材、８は回収部である。
なお、各図中の同一符号は同一または相当部分を示す。
代理人 大 岩 増 雄 （外２名）第１図
第２図FIG. 1 is a block diagram for explaining the deburring method of the present invention, and FIG. 2 is a block diagram for explaining the conventional deburring method. In the figure, 1 is a mold part, 2 is a lead 7 rem, 3 is a burr, 4 is a high pressure pump, 5 is an ice maker, 6 is a nozzle, 7 is an ice shot material, and 8 is a recovery part. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa (2 others) Figure 1 Figure 2
Claims (1)
上に発生したバリにショット材を吹き付けて前記バリの
除去を行う方法において、前記ショット材として氷を用
い、この氷と水とを混合した状態で前記バリに吹き付け
て前記バリを除去することを特徴とする半導体装置の製
造方法。In a method of removing burrs by spraying a shot material onto burrs generated on a lead frame of a semiconductor device during a resin molding process, ice is used as the shot material, and a mixture of ice and water is used to remove the burrs. A method for manufacturing a semiconductor device, characterized in that the burrs are removed by spraying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12421888A JPH01292832A (en) | 1988-05-19 | 1988-05-19 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12421888A JPH01292832A (en) | 1988-05-19 | 1988-05-19 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01292832A true JPH01292832A (en) | 1989-11-27 |
Family
ID=14879918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12421888A Pending JPH01292832A (en) | 1988-05-19 | 1988-05-19 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01292832A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5283989A (en) * | 1990-05-30 | 1994-02-08 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for polishing an article with frozen particles |
-
1988
- 1988-05-19 JP JP12421888A patent/JPH01292832A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5283989A (en) * | 1990-05-30 | 1994-02-08 | Mitsubishi Denki Kabushiki Kaisha | Apparatus for polishing an article with frozen particles |
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