JPH01284553A - Conductive resin composition - Google Patents
Conductive resin compositionInfo
- Publication number
- JPH01284553A JPH01284553A JP11384188A JP11384188A JPH01284553A JP H01284553 A JPH01284553 A JP H01284553A JP 11384188 A JP11384188 A JP 11384188A JP 11384188 A JP11384188 A JP 11384188A JP H01284553 A JPH01284553 A JP H01284553A
- Authority
- JP
- Japan
- Prior art keywords
- acrylic
- parts
- weight
- resin composition
- monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000835 fiber Substances 0.000 claims abstract description 18
- 229920000642 polymer Polymers 0.000 claims abstract description 16
- 239000003607 modifier Substances 0.000 claims abstract description 10
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 10
- 125000000524 functional group Chemical group 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 150000001412 amines Chemical class 0.000 claims description 7
- 239000000178 monomer Substances 0.000 abstract description 22
- 229910001369 Brass Inorganic materials 0.000 abstract description 4
- 125000005250 alkyl acrylate group Chemical group 0.000 abstract description 4
- 239000010951 brass Substances 0.000 abstract description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 abstract description 3
- 238000004132 cross linking Methods 0.000 abstract description 3
- 230000000379 polymerizing effect Effects 0.000 abstract description 3
- -1 (substituted) butadiene Chemical class 0.000 abstract description 2
- 229920000800 acrylic rubber Polymers 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 229920000058 polyacrylate Polymers 0.000 abstract description 2
- 229920000914 Metallic fiber Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000004677 Nylon Substances 0.000 description 5
- 229920001778 nylon Polymers 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 229910001018 Cast iron Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- FFYWKOUKJFCBAM-UHFFFAOYSA-N ethenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC=C FFYWKOUKJFCBAM-UHFFFAOYSA-N 0.000 description 1
- BLCTWBJQROOONQ-UHFFFAOYSA-N ethenyl prop-2-enoate Chemical compound C=COC(=O)C=C BLCTWBJQROOONQ-UHFFFAOYSA-N 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は導電性樹脂組成物に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to a conductive resin composition.
更に詳しくは、機械物性及び導電性に優れ、電気電子部
品、電子機器筐体及び自動車部品に好適な導電性樹脂組
成物に関するものである。More specifically, the present invention relates to a conductive resin composition that has excellent mechanical properties and electrical conductivity and is suitable for electrical and electronic components, electronic device casings, and automobile parts.
（従来の技術および発明が解決しようとする問題点）
最近の急速なエレクトロニクス化の進展に伴って、電磁
波障害対策の問題が大きくクロースアンプされてきた。(Problems to be Solved by the Prior Art and the Invention) With the recent rapid development of electronics, the problem of countermeasures against electromagnetic interference has been greatly amplified.
これは、電子機器の筐体などの主要部分が樹脂化され、
ＩＣやＬＳＩ等がら放射られる不要電磁波が透過し、電
子機器同士で障害を与え合う機会が増加したためである
。この対策としては、従来樹脂成形品表面に導電層を形
成する方法が用いられてきたが、工程の増加や導電層の
剥離等の欠点がある。この為、最近では樹脂に導電性フ
ィラーを充填した複合樹脂が注目されている。例えば特
開昭５９−２０２２５７号公報には、金属繊維とポリア
ミド樹脂及びアイオノマー樹脂からなる導電性ポリアミ
ド樹脂が耐衝撃性及び導電性に優れていることが記載さ
れている。This means that the main parts such as the housing of electronic devices are made of resin,
This is because unnecessary electromagnetic waves emitted from ICs, LSIs, etc. are transmitted through the device, increasing the chances that electronic devices will cause interference to each other. As a countermeasure against this problem, a method of forming a conductive layer on the surface of a resin molded product has conventionally been used, but this method has drawbacks such as an increase in the number of steps and peeling of the conductive layer. For this reason, composite resins in which resins are filled with conductive fillers have recently attracted attention. For example, JP-A-59-202257 describes that a conductive polyamide resin made of metal fibers, a polyamide resin, and an ionomer resin has excellent impact resistance and conductivity.
ところで導電性を付与するために、耐衝撃性能を有する
樹脂に金属繊維を複合した場合、ノツチ付きアイゾツト
試験片においてノツチ部分に加わった衝撃波が樹脂中の
金属繊維を伝播するため耐衝撃性能は低下するという欠
点がある。また、低下した耐衝撃性能を向上させるため
に強化材として非導電性のガラス繊維等を複合した場合
には、組成物の導電性を維持するために更に金属繊維を
複合する必要があり、コストアンプや加工性悪化、比重
増加の欠点がある。強化材として導電性の炭素繊維を複
合した場合には、組成物のコストアップや加工性悪化の
欠点がある。By the way, when metal fibers are composited with a resin that has impact resistance in order to impart conductivity, the shock wave applied to the notch part of the notched Izotz test piece propagates through the metal fibers in the resin, resulting in a decrease in impact resistance. There is a drawback that it does. In addition, if non-conductive glass fiber is used as a reinforcing material to improve the impact resistance, it is necessary to add metal fiber to maintain the conductivity of the composition, which increases the cost. It has the disadvantages of poor amplifier performance, poor workability, and increased specific gravity. When conductive carbon fiber is used as a reinforcing material, the composition has disadvantages of increased cost and poor processability.
また、フィラー無添加樹脂の耐衝撃性能を更に向上させ
るために、ゴム成分を配合する手法が用いられているが
、剛性や熱変形温度の低下は避けられない。こうしたポ
リマアロイに金属繊維を配合した場合、剛性や熱変形温
度は向上するが、耐衝撃性能は著しく低下する欠点があ
る。Furthermore, in order to further improve the impact resistance of filler-free resins, a method of blending a rubber component has been used, but a decrease in rigidity and heat distortion temperature is unavoidable. When metal fibers are blended into such polymer alloys, the rigidity and heat distortion temperature are improved, but there is a drawback that the impact resistance performance is significantly reduced.
本発明者等は上述した問題点を解決すべく鋭意研究した
結果、本発明を完成した。本発明の目的は、機械物性及
び導電性に優れた導電性樹脂組成物を提供するにある。The present inventors completed the present invention as a result of intensive research to solve the above-mentioned problems. An object of the present invention is to provide a conductive resin composition with excellent mechanical properties and electrical conductivity.
（問題点を解決するための手段）
即ち本発明の導電性樹脂組成物は、囚ポリアミド樹脂１
００重量部に対して、＋Ｂｌ金属繊維１５−３００重量
部及び（Ｃ）アクリル系改質剤５−８０重間部を配合し
てなり、該アクリル系改質剤（Ｑがアクリル系エラスト
マー状重合体の相［１］とアミンと反応性を有する官能
基を含有する重合体の相［２］とからなる多相アミン反
応性部分含有重合体であることを特徴とする。(Means for Solving the Problems) That is, the conductive resin composition of the present invention consists of a polyamide resin 1
00 parts by weight, 15 to 300 parts by weight of +Bl metal fibers and 5 to 80 parts by weight of (C) acrylic modifier are blended, and the acrylic modifier (Q is acrylic elastomer It is characterized by being a multi-phase amine-reactive moiety-containing polymer consisting of a coalesced phase [1] and a polymer phase [2] containing a functional group that is reactive with amines.
以下本発明の詳細な説明する。The present invention will be explained in detail below.
本発明に於いて使用するポリアミド樹脂は公知のポリア
ミドであれば特に限定されない。適当なポリアミド樹脂
の例としては、重合しうるモノアミノモノカルボン酸あ
るいはそのアミド生成誘導体、あるいは適当なジアミン
と適当なジカルボン酸とからあるいはこれらのアミド生
成誘導体から製造されるポリアミドがあり、例えばナイ
ロン４゜ナイロン６、ナイロン７、ナイロン８．ナイロ
ン１１、ナイロン１２．ナイロン６６、ナイロン６９、
ナイロン６１０．ナイロン６１１．ナイロン６１２．ナ
イロン６Ｔ等の単独重合体及びこれらの２種以上の混合
物、共重合体を挙げることができる。The polyamide resin used in the present invention is not particularly limited as long as it is a known polyamide. Examples of suitable polyamide resins include polyamides made from polymerizable monoaminomonocarboxylic acids or their amide-forming derivatives, or from suitable diamines and suitable dicarboxylic acids or from their amide-forming derivatives, such as nylon. 4゜Nylon 6, Nylon 7, Nylon 8. Nylon 11, nylon 12. nylon 66, nylon 69,
Nylon 610. Nylon 611. Nylon 612. Examples include homopolymers such as nylon 6T, mixtures of two or more thereof, and copolymers.
本発明に於いて使用する金属繊維としては黄銅繊維、鉄
系繊維、アルミニウム繊維等が挙げられるが、特に黄銅
繊維及び鉄系繊維が好ましい。The metal fibers used in the present invention include brass fibers, iron fibers, aluminum fibers, etc., with brass fibers and iron fibers being particularly preferred.
本発明に於いて使用する金属繊維の配合量は、ポリアミ
ド樹脂１００重量部に対して１５〜３００重量部である
ことが肝要であり、特に２５〜１００重量部であること
が好ましい。金属繊維の配合量が１５重量部未満の場合
には、導電性の付与効果が不充分である。一方、３００
重量部を趙える場合には流動性が低下し、射出成形法に
よる成形加工が極めて困難となる。It is important that the amount of metal fiber used in the present invention is 15 to 300 parts by weight, particularly preferably 25 to 100 parts by weight, based on 100 parts by weight of the polyamide resin. When the amount of metal fibers is less than 15 parts by weight, the effect of imparting conductivity is insufficient. On the other hand, 300
If the weight part is reduced, fluidity decreases, making molding by injection molding extremely difficult.
本発明に於いて使用するアクリル系改質剤（Ｃ）は、ア
クリル系エラストマー状重合体の相［１］とアミンと反
応性を有する官能基を含有する重合体の相［２］とから
なる多相アミン反応性部分含有重合体であり、例えば特
開昭４７−６２８４号公報に開示されるものが挙げられ
る。中でも、アクリル酸アルキル、ブタジェン、置換ブ
タジェン、他のエチレン性不飽和モノマー、多エチレン
性不飽和架橋性モノマー、及びグラフト結合モノマーか
らなるモノマーを重合して得られたアクリル系エラスト
マ−状重合体の相からなるものが好ましい（より好まし
くは８亥相が５０〜９０参寺＊４重■％を占めるもので
ある）。ここにアクリル系エラストマー状重合体のアク
リル酸アルキルモノマーとしては、アルキル基の炭素数
が１ないし１５個、好ましくは工ないし８個である。ま
た、他のエチレン性不飽和モノマーとしてはスチレン、
α−メチルスチレン、ハロノ１′ン化ビニル、アミド、
エステル等が挙げられる。The acrylic modifier (C) used in the present invention consists of an acrylic elastomeric polymer phase [1] and a polymer phase [2] containing a functional group reactive with amines. Polymers containing multiphase amine-reactive moieties include, for example, those disclosed in JP-A No. 47-6284. Among them, acrylic elastomeric polymers obtained by polymerizing monomers consisting of alkyl acrylates, butadiene, substituted butadiene, other ethylenically unsaturated monomers, polyethylenically unsaturated crosslinking monomers, and graft bonding monomers. Preferably, it consists of 50 to 90 sanji*4 layers of 8 yen (more preferably 50 to 90 sanji*4 %). The alkyl acrylate monomer of the acrylic elastomeric polymer has an alkyl group having 1 to 15 carbon atoms, preferably 1 to 8 carbon atoms. In addition, other ethylenically unsaturated monomers include styrene,
α-methylstyrene, vinyl halonide, amide,
Examples include esters.
多エチレン性不飽和架橋モノマーとは、複数の付加重合
しうる不飽和基を有しており、そのいずれもが互いに、
また第１のモノマーであるアクリル酸アルキルモノマー
類、他のアクリル系モノマー類、および反応性の他のモ
ノマー類とほぼ同様な速度で重合反応に関与するもので
ある。これには、ポリオールのポリアクリル酸エステル
、ポリメタクリル酸エステル、例えばブチレンジアクリ
レート、ブチレンジメタクリレート、ビニルアクリレー
ト、ビニルメタクリレート等が挙げられる。A polyethylenically unsaturated crosslinking monomer has a plurality of unsaturated groups capable of addition polymerization, all of which are mutually,
Further, it participates in the polymerization reaction at approximately the same rate as the first monomer, the alkyl acrylate monomer, other acrylic monomers, and other reactive monomers. These include polyacrylic esters and polymethacrylic esters of polyols, such as butylene diacrylate, butylene dimethacrylate, vinyl acrylate, vinyl methacrylate, and the like.
グラフト結合モノマーとは、実質的に異なる速度で重合
反応に関与する２個以上の付加重合可能な不飽和反応性
基を有する千ツマ−である。少なくとも１つの反応性基
が他のモノマーとほぼ同じ速度あるいは僅かに低目の速
度で重合し、残りの基が実質的に異なる速度、例えば比
較的遅い速度で重合するようなモノマーであることが好
ましい。Grafting monomers are monomers having two or more addition-polymerizable unsaturated reactive groups that participate in the polymerization reaction at substantially different rates. The monomer may be such that at least one reactive group polymerizes at about the same rate as the other monomers, or at a slightly lower rate, and the remaining groups polymerize at a substantially different rate, e.g., a relatively slower rate. preferable.
これには、アクリル酸、メタクリル酸、マレイン酸（モ
ノおよびジエステル）、メタクリル酸アリル、アクリル
酸アリルが挙げられる。置換ブタジェンとしては、イソ
プレン、クロロプレン、シアツブクジエン等が挙げられ
る。These include acrylic acid, methacrylic acid, maleic acid (mono and diesters), allyl methacrylate, allyl acrylate. Examples of the substituted butadiene include isoprene, chloroprene, and siatubucdiene.
一方、アミンと反応性を有する官能基を含有する重合体
とは、アミンと反応する官能基を有するモノマーを共重
合した重合体である。共重合が可能であり、アミンと反
応する官能基を有するモノマーとしては、例えばアクリ
ル酸、メタクリル酸。On the other hand, a polymer containing a functional group reactive with an amine is a polymer obtained by copolymerizing a monomer having a functional group reactive with an amine. Examples of monomers that can be copolymerized and have a functional group that reacts with amines include acrylic acid and methacrylic acid.
フマール酸、マレイン酸、α−ヒドロキンメチルアクリ
ル酸、アジピン酸等のカルボン酸が挙げられる。また、
他のモノマーとしては、メタクリル酸アルキル、スチレ
ン、α−メチルスチレン、メタクリル酸エステル等が挙
げられる。Examples include carboxylic acids such as fumaric acid, maleic acid, α-hydroquine methylacrylic acid, and adipic acid. Also,
Other monomers include alkyl methacrylates, styrene, α-methylstyrene, methacrylic esters, and the like.
エラストマー状重合体の相とアミンと反応性を有する官
能基を含有する重合体の相とは、化学的に結合している
必要がある。かかるアクリル系改質剤としては、例えば
ロームアンドハース社製の商品名［バラロイドＥ Ｘ
Ｌ−３３８６Ｊとして市販されているものが好ましい。The elastomeric polymer phase and the polymer phase containing functional groups reactive with amines must be chemically bonded. As such an acrylic modifier, for example, the product name [Balaroid EX] manufactured by Rohm and Haas Co., Ltd.
The one commercially available as L-3386J is preferred.
本発明において、アクリル系改質剤の配合量は、ポリア
ミド樹脂１００重量部に対して５〜８０重量部であるこ
とが肝要であり、特に１０〜６０重量部が好ましい。ア
クリル系改質剤の配合量が５重量部未満の場合には、耐
衝撃性が不充分である。In the present invention, it is important that the amount of the acrylic modifier is 5 to 80 parts by weight, particularly preferably 10 to 60 parts by weight, based on 100 parts by weight of the polyamide resin. If the amount of the acrylic modifier is less than 5 parts by weight, the impact resistance will be insufficient.
一方、８０重量部を超える場合には流動性が低下し、射
出成形法による成形加工が極めて困難となる。On the other hand, if it exceeds 80 parts by weight, fluidity decreases and molding by injection molding becomes extremely difficult.
本発明の組成物には、更に必要に応じて着色剤。The composition of the present invention further includes a coloring agent, if necessary.
熱安定剤、滑剤、結晶核剤等を添加することができる。A heat stabilizer, a lubricant, a crystal nucleating agent, etc. can be added.
本発明の組成物は、最終成形品となるまでに充分に混線
分数されていることが重要である。このための方法とし
ては、例えば異方向回転２軸混練押出機を用いてベレッ
ト状の樹脂を作り、成形工程に供する方法がある。It is important that the composition of the present invention has a sufficient crosstalk fraction before it becomes a final molded product. As a method for this purpose, for example, there is a method of making a pellet-shaped resin using a twin-screw kneading extruder rotating in opposite directions and subjecting it to a molding process.
（発明の効果）
本発明の導電性樹脂組成物は、機械物性及び導電性に優
れており、電気電子部品や電子機器筐体或いは自動車部
品に好適である。(Effects of the Invention) The conductive resin composition of the present invention has excellent mechanical properties and conductivity, and is suitable for electrical and electronic components, electronic device casings, and automobile parts.
（実施例） 以下実施例により本発明を具体的に説明する。(Example) The present invention will be specifically explained below using Examples.
尚、物性の評価は下記の方法に従った。The physical properties were evaluated according to the following method.
】、 引張強度：ＡＳＴＭ Ｉ）−６３８２、ｍｌげ
弾性率：ＡＳＴＭ Ｄ−７９０３、アイゾツト衝撃強
度（１／４インチ、ノツチ付き）：ＡＳＴＭ Ｄ−２
５６
４、熱変形温度（１８，６ｋｇ／ｃｍ” ）：ＡＳＴＭ
Ｄ−６４８
５、体積固有抵抗：ＡＳＴＭ Ｉ）−２５７実施例１
〜６．比較例１〜４
ナイロン６樹脂（鐘紡■製 ＭＣ−１Ｏ２）１００重量
部に対して、鋼繊維（■神戸鋳鉄新製ＥＸＬ−３３８６
）を表−１に示す組成で配合し、３０ｍｍ径の２軸異方
向回転混練押出機を用いてペレット化した。], Tensile strength: ASTM I)-6382, Modulus of elasticity: ASTM D-7903, Izot impact strength (1/4 inch, notched): ASTM D-2
56 4. Heat distortion temperature (18.6kg/cm”): ASTM
D-648 5, Volume resistivity: ASTM I)-257 Example 1
~6. Comparative Examples 1 to 4 Steel fiber (■Kobe Cast Iron Shinsei EXL-3386) was added to 100 parts by weight of nylon 6 resin (Kanebo ■MC-1O2).
) were blended with the composition shown in Table 1 and pelletized using a 30 mm diameter twin-shaft, counter-rotating kneading extruder.
得られたベレットを射出成形機を用いて試験片に成形し
、その試験片の物性評価を行った。結果を表−１に示す
。The obtained pellet was molded into a test piece using an injection molding machine, and the physical properties of the test piece were evaluated. The results are shown in Table-1.
実施例７．比較例５〜７
ナイロン６６樹脂（東し■製 アミラン３００１−Ｎ）
１００重量部に対して、黄銅繊維（ａ１１神戸鋳鉄所製
ＫＣ−メタルファイバーＣ−２６００）６０重量部及
び表−２に示す体積撃性改質剤４０重量部を配合し、３
０ｍｍ径の２軸異方向回転混練押出機を用いてバレン１
〜化した。次いで試験片に成形し、その試験片の物性評
価を行ＩＯ−
表−１及び表−２から判るように、本発明に係わる導電
性樹脂組成物は、いずれも機械物性及び導電性に優れた
導電性樹脂組成物である。Example 7. Comparative Examples 5 to 7 Nylon 66 resin (Amiran 3001-N manufactured by Toshi ■)
To 100 parts by weight, 60 parts by weight of brass fiber (KC-Metal Fiber C-2600 manufactured by A11 Kobe Cast Iron Works) and 40 parts by weight of the volume impact modifier shown in Table 2 were blended.
Ballen 1 was prepared using a 0 mm diameter two-axis, counter-rotating kneading extruder.
It became ~. Next, the conductive resin composition according to the present invention was molded into a test piece, and the physical properties of the test piece were evaluated in the row IO. It is a conductive resin composition.
手続補正書Procedural amendment
Claims (1)
系改質剤５〜８０重量部を配合してなり、 該アクリル系改質剤（Ｃ）がアクリル系エラストマー状
重合体の相［１］とアミンと反応性を有する官能基を含
有する重合体の相［２］とからなる多相アミン反応性部
分含有重合体であることを特徴とする導電性樹脂組成物
。[Scope of Claims] (B) 15 to 300 parts by weight of metal fibers and (C) 5 to 80 parts by weight of an acrylic modifier are blended with 100 parts by weight of (A) a polyamide resin, the acrylic A multiphase amine-reactive moiety-containing polymer in which the system modifier (C) is composed of an acrylic elastomeric polymer phase [1] and a polymer phase [2] containing a functional group that is reactive with amines. A conductive resin composition characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11384188A JPH01284553A (en) | 1988-05-10 | 1988-05-10 | Conductive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11384188A JPH01284553A (en) | 1988-05-10 | 1988-05-10 | Conductive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01284553A true JPH01284553A (en) | 1989-11-15 |
Family
ID=14622394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11384188A Pending JPH01284553A (en) | 1988-05-10 | 1988-05-10 | Conductive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01284553A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100729591B1 (en) * | 2000-03-31 | 2007-06-19 | 유니챰 가부시키가이샤 | Water dissoluble wiping sheet having a multi-structures |
| US7598308B2 (en) | 2005-03-30 | 2009-10-06 | The Gates Corporation | Metal—elastomer compound |
| CN105219073A (en) * | 2015-10-30 | 2016-01-06 | 无锡市长安曙光手套厂 | A kind of electroconductive nylon, preparation method and its usage |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6286053A (en) * | 1985-10-11 | 1987-04-20 | Kanebo Ltd | Electrically conductive resin composition |
-
1988
- 1988-05-10 JP JP11384188A patent/JPH01284553A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6286053A (en) * | 1985-10-11 | 1987-04-20 | Kanebo Ltd | Electrically conductive resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100729591B1 (en) * | 2000-03-31 | 2007-06-19 | 유니챰 가부시키가이샤 | Water dissoluble wiping sheet having a multi-structures |
| US7598308B2 (en) | 2005-03-30 | 2009-10-06 | The Gates Corporation | Metal—elastomer compound |
| CN105219073A (en) * | 2015-10-30 | 2016-01-06 | 无锡市长安曙光手套厂 | A kind of electroconductive nylon, preparation method and its usage |
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