JPH01278991A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH01278991A
JPH01278991A JP63105488A JP10548888A JPH01278991A JP H01278991 A JPH01278991 A JP H01278991A JP 63105488 A JP63105488 A JP 63105488A JP 10548888 A JP10548888 A JP 10548888A JP H01278991 A JPH01278991 A JP H01278991A
Authority
JP
Japan
Prior art keywords
clamp
work
workpiece
work head
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63105488A
Other languages
Japanese (ja)
Inventor
Kanehito Matsushita
松下 兼人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP63105488A priority Critical patent/JPH01278991A/en
Publication of JPH01278991A publication Critical patent/JPH01278991A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To obtain a laser beam machine damaging neither work head nor clamp by providing the XY table which stops by the movement to an operation limit, the change-over switch reactuating a laser oscillator and the signal lamp lit by the change-over of the change-over switch. CONSTITUTION:When a limit value 5 exceeds a work head 1 in case of working a work part 6, a work table 3 and laser oscillator become in a field holding state, a display lamp 10 is lit and the damage of a work head, etc. is prevented. When the positions of the work part 6 and a clamp 4 are confirmed and it is judged all right to continue working as it is, a change-over switch 8 is shifted, an operation reopening switch 11 is turned on and the working is executed with confirming that the work head 1 and clamp 4 are not interfering. Even when a work part 7 is worked, the display lamp 10 is lit when the limit line 5 exceeds the work head 1, so working is executed with confirming the lamp 4 and work head 1 not interfering.

Description

【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明はレーザ加工装置に係り、とくにXYテーブル上
のワークを加工するレーザ加工装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing device, and particularly to a laser processing device for processing a workpiece on an XY table.

(従来の技術) XYテーブル上のワークを加工する従来のレーザ加工装
置の一例を示す第3図において、門形の架台10に取付
られた加工ヘッド1の下方には、加工テーブル3の上面
にクランプ4でワーク2が固定され、このワーク2はテ
ーブル3の矢印X方向とY方向の移動に従って移動する
(Prior Art) In FIG. 3, which shows an example of a conventional laser processing device for processing a workpiece on an XY table, a processing head 1 attached to a gate-shaped pedestal 10 has an upper surface attached to the processing table 3 below. A workpiece 2 is fixed by a clamp 4, and the workpiece 2 moves according to the movement of the table 3 in the X and Y directions of the arrows.

そして、加工ヘッド1の下端からレーザ光をワーク2上
に照射するとともに、あらかじめつくられたNCテープ
に従って加工テーブル3を図示しないNC制御装置で動
かして例えば加工部品6を切断する。
Then, a laser beam is irradiated onto the workpiece 2 from the lower end of the processing head 1, and the processing table 3 is moved by an NC control device (not shown) according to an NC tape prepared in advance to cut, for example, a processing part 6.

(発明が解決しようとする課題) このようなレーザ加工装置では、例えばクランプ4に近
い位置の加工部品7を加工するときには、NCテープの
つくり方によっては、加工ヘッド1の下端がクランプ4
の上部に当たってワーク2をずらしたり、加工ヘッド1
を損傷したりするおそれがある。
(Problem to be Solved by the Invention) In such a laser processing device, when processing a workpiece 7 at a position close to the clamp 4, for example, depending on how the NC tape is made, the lower end of the processing head 1 may be placed close to the clamp 4.
Hitting the top of the head may cause the workpiece 2 to shift, or the machining head 1
There is a risk of damage.

そのため、あらかじめ加工テーブル3のY方向の動作を
第3図の限定線5までに限定して動かす方法がとられて
いるが、ワーク2の歩留りが落ちる。又、加工部品6の
切断形状をNCテープに入れるときに、クランプ4から
逃がせばよいが、多種少量生産では煩わしい。
Therefore, a method is used in which the movement of the processing table 3 in the Y direction is limited in advance to the limit line 5 in FIG. 3, but the yield of the workpiece 2 is reduced. Furthermore, when inserting the cut shape of the processed part 6 into the NC tape, it is sufficient to release it from the clamp 4, but this is troublesome in high-mix, low-volume production.

そこで本発明の目的は、ワークを有効に利用でき、加工
へラドやクランプなどを損傷することのないレーザ加工
装置を得ることである。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a laser processing apparatus that can effectively utilize a workpiece and that does not damage the machining pad, clamp, etc.

(課題を解決するための手段と作用) 本発明は、NCテーブルが限定線を越えても動作させる
切替スイッチと、この切替スイッチの切替えで点灯する
ランプを門形の架台に設けて、クランプに近い加工部品
を加工するときだけ、切替スイッチをONにし、ランプ
を点灯させて加工ヘッドがクランプに接触しないことを
オペレータが確認しながら加工するレーザ加工装置であ
る。
(Means and effects for solving the problem) The present invention provides a gate-shaped pedestal with a changeover switch that operates even when the NC table exceeds the limit line, and a lamp that lights up when the changeover switch is switched. In this laser processing device, only when processing a nearby workpiece, the changeover switch is turned on, the lamp is turned on, and the operator performs processing while confirming that the processing head does not come into contact with the clamp.

(実施例) 以下、本発明のレーザ加工装置の一実施例を第1〜2図
で説明する。なあ、第3図と同じ部分の説明は省く。
(Example) Hereinafter, an example of the laser processing apparatus of the present invention will be described with reference to FIGS. 1 and 2. By the way, explanation of the same parts as in Figure 3 will be omitted.

第1図において、門形の架台10の一側には、XYテー
ブルのY方向の移動で限定線5が加工ヘッド1よりも第
1図右側に越えてもXYテーブルを動作させる切替スイ
ッチ8が取付られ、架台10の上部には、その方向に切
替スイッチ8が切替えられたときに点灯する赤ランプ9
が取付られている。
In FIG. 1, on one side of the gate-shaped pedestal 10, there is a changeover switch 8 that operates the XY table even if the limiting line 5 crosses the processing head 1 to the right side in FIG. 1 when the XY table moves in the Y direction. A red lamp 9 is attached to the top of the pedestal 10 and lights up when the changeover switch 8 is switched in that direction.
is installed.

そして操作卓を示す第2図には、限定線5が加工ヘッド
1より右側に越えたとぎに、NCテーブルと図示しない
レーザ発掘器の出力停止を示すフィードホールド表示灯
10と、この停止を解除する動作再開スイッチ11が取
付られている。
In FIG. 2 showing the operation console, there is a feed hold indicator light 10 indicating that the output of the NC table and the laser excavator (not shown) will stop when the limit line 5 crosses to the right side of the processing head 1, and a feed hold indicator light 10 that indicates that the output of the NC table and the laser excavator (not shown) will be stopped. An operation restart switch 11 is attached.

今、このレーザ加工装置で加工部品6を加工するとき、
もし限定値5が加工ヘッド1を過ぎると、NCテーブル
とレーザ発掘器はフィールドホールド状態となり、表示
灯10がつき、未然に加工ヘッド等の損傷を防ぐ。そし
て、オペレータが加工部品6とクランプ4との位置を確
認し、そのまま加工を続りてよいと判断すると、切替ス
イッチ8を切替え、動作再開スイッチ11をONして加
工ヘッド1とクランプ4とが干渉しないことを確認しな
がら加工する。
Now, when processing the workpiece 6 with this laser processing device,
If the limit value 5 passes the processing head 1, the NC table and the laser excavator are placed in a field hold state, and the indicator light 10 is turned on to prevent damage to the processing head and the like. Then, when the operator confirms the positions of the workpiece 6 and the clamp 4 and determines that it is OK to continue machining, the operator switches the changeover switch 8 and turns on the operation restart switch 11, so that the workpiece head 1 and the clamp 4 are connected to each other. Machining while making sure that there is no interference.

又、加工部品7を加工するときにも、限定線5が加工ヘ
ッド1を越えて表示灯10がつくので、クランプ4と加
工ヘッド1とが干渉しないことを確認しながら加工する
Also, when machining the workpiece 7, the limiting line 5 crosses the workhead 1 and the indicator light 10 is lit, so work is carried out while confirming that the clamp 4 and workhead 1 do not interfere.

なお、本実施例では限定線5はワーク2上に引いた点線
で表しているので、この線の検出には例えば光学的方法
等を採る必要があるが、クランプ4の先端に板ばねを立
てて加工ヘッド1との接触で検出してもよい。
In this embodiment, the limiting line 5 is represented by a dotted line drawn on the workpiece 2, so it is necessary to use, for example, an optical method to detect this line. It may also be detected by contact with the processing head 1.

(発明の効果) 以上、本発明のレーザ加工装置によれば、NCテーブル
が限定線を越えても加工機が動作する切替スイッチと信
号ランプを架台に設けて、加工部品を押えるクランプに
近いワークで加工部品を加工するときだけオペレータが
注意しながら加工を進めるようにしたので、ワークにむ
だがなく、加工へラドやクランプを損傷しないレーザ加
工装置を得ることができる。
(Effects of the Invention) As described above, according to the laser processing apparatus of the present invention, a changeover switch and a signal lamp that operate the processing machine even if the NC table exceeds the limit line are provided on the mount, and the workpiece is close to the clamp that holds the processed part. Since the operator is careful to proceed with the machining only when machining the machined parts, it is possible to obtain a laser machining device that does not waste the workpiece and does not damage the machining rad or clamp.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のレーザ加工装置の一実施例を示す要部
斜視図、第2図は本発明のレーザ加工装置の一実施例を
示す部分斜視図、第3図は従来のレーザ加工装置の要部
を示す要部斜視図でおる。 1・・・加工ヘッド 2・・・ワーク 3・・・加工テーブル 4・・・クランプ 5・・・限定線 8・・・切替スイッチ 9・・・ランプ 12・・・操作卓 (8733)  代理人 弁理士 猪 股 祥 晃(ほ
か1名) 第1図 第2z 第3図
FIG. 1 is a perspective view of a main part showing an embodiment of a laser processing device of the present invention, FIG. 2 is a partial perspective view of an embodiment of a laser processing device of the present invention, and FIG. 3 is a conventional laser processing device. FIG. 1... Processing head 2... Workpiece 3... Processing table 4... Clamp 5... Limiting line 8... Selector switch 9... Lamp 12... Operation console (8733) Agent Patent Attorney Yoshiaki Inomata (and 1 other person) Figure 1 Figure 2z Figure 3

Claims (1)

【特許請求の範囲】 NC制御で動く、XYテーブル上のワークを前記XYテ
ーブルに固定するクランプと、前記XYテーブル上の架
台に取付られレーザ発振器から伝送されたレーザ光を前
記ワークに照射する加工ヘッドと、前記クランプの前端
に設けられ前記XYテーブルの動作限度を検出する手段
とよりなるレーザ加工装置において、 前記XYテーブルの前記動作限度への移動で停止する前
記XYテーブルと前記レーザ発振器を再起動へ切換える
切替スイッチと、この切替スイッチの前記再起動への切
替えで点灯する信号灯を備えたことを特徴とするレーザ
加工装置。
[Claims] A clamp that moves under NC control and fixes a workpiece on an XY table to the XY table; and a process that irradiates the workpiece with laser light transmitted from a laser oscillator attached to a pedestal on the XY table. In a laser processing device comprising a head and a means provided at the front end of the clamp for detecting the operating limit of the XY table, the XY table and the laser oscillator are restarted when the XY table is moved to the operating limit. A laser processing device comprising: a changeover switch for switching to startup; and a signal lamp that lights up when the changeover switch is switched to restart.
JP63105488A 1988-04-30 1988-04-30 Laser beam machine Pending JPH01278991A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63105488A JPH01278991A (en) 1988-04-30 1988-04-30 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63105488A JPH01278991A (en) 1988-04-30 1988-04-30 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH01278991A true JPH01278991A (en) 1989-11-09

Family

ID=14408979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63105488A Pending JPH01278991A (en) 1988-04-30 1988-04-30 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH01278991A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011050992A (en) * 2009-09-02 2011-03-17 Nippon Sharyo Seizo Kaisha Ltd Laser beam machining apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011050992A (en) * 2009-09-02 2011-03-17 Nippon Sharyo Seizo Kaisha Ltd Laser beam machining apparatus

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