JPH01249837A - Laminated board - Google Patents
Laminated boardInfo
- Publication number
- JPH01249837A JPH01249837A JP7774888A JP7774888A JPH01249837A JP H01249837 A JPH01249837 A JP H01249837A JP 7774888 A JP7774888 A JP 7774888A JP 7774888 A JP7774888 A JP 7774888A JP H01249837 A JPH01249837 A JP H01249837A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- melamine
- impregnated
- formaldehyde
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 32
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000004640 Melamine resin Substances 0.000 claims abstract description 21
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims abstract description 11
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000004014 plasticizer Substances 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 7
- 229920003043 Cellulose fiber Polymers 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003063 flame retardant Substances 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 4
- 239000000835 fiber Substances 0.000 abstract 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
- 238000006757 chemical reactions by type Methods 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- 229920002678 cellulose Polymers 0.000 description 5
- 239000001913 cellulose Substances 0.000 description 5
- 229920006337 unsaturated polyester resin Polymers 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000002655 kraft paper Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical class CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229940090898 Desensitizer Drugs 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009816 wet lamination Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、耐衝撃性に勝れた電気用積層板（積Ｎ絶縁板
、印刷回路用銅張積層板）に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an electrical laminate (N-laminated insulation board, copper-clad laminate for printed circuits) with excellent impact resistance.
積層板は、樹脂を含浸した基材を積層し樹脂を硬化させ
たものである。この樹脂としては、プリプレグ化が容易
でありかつ乾式積層によって大量生産が可能なフェノー
ル樹脂又はエポキシ樹脂が用いられ、湿式積層による場
合は、不飽和ポリエステル樹脂などが用いられる。A laminate is made by laminating base materials impregnated with resin and curing the resin. As this resin, a phenol resin or an epoxy resin is used, which is easy to prepare into a prepreg and can be mass-produced by dry lamination, and in the case of wet lamination, an unsaturated polyester resin or the like is used.
不飽和ポリエステル樹脂を用いる場合は、不飽和ポリエ
ステル樹脂の含浸に先立ち、セルロース系基材にメラミ
ン樹脂を含浸させ、積層板の電気特性、耐湿性を向上さ
せている。When using an unsaturated polyester resin, the cellulose base material is impregnated with a melamine resin prior to impregnation with the unsaturated polyester resin to improve the electrical properties and moisture resistance of the laminate.
従来メラミン樹脂は、貯蔵安定性を考慮して。Traditionally, melamine resin was used in consideration of storage stability.
メラミン１モルに対して、ホルムアルデヒド３モルを反
応せさせたものを使用していた。A product in which 1 mole of melamine was reacted with 3 moles of formaldehyde was used.
ところが、このようなメラミン樹脂をセルロース系基材
に含浸させると、積層板の電気特性、耐湿性は向上する
ものの、耐衝撃性等の機械強度が低下する。However, when such a melamine resin is impregnated into a cellulose base material, although the electrical properties and moisture resistance of the laminate are improved, mechanical strength such as impact resistance is reduced.
これを解決するために種々の方法が提案されているが、
未だに耐衝撃性並びに電気特性及び耐湿性のいずれもを
満足させるに至っていない。Various methods have been proposed to solve this problem, but
It has not yet been possible to satisfy all of impact resistance, electrical properties, and moisture resistance.
本発明は、耐衝撃性、電気特性及び耐湿性いずれも良好
な積層板を提供することを目的とするものである。An object of the present invention is to provide a laminate having good impact resistance, electrical properties, and moisture resistance.
本発明は、セルロース系基材に、メラミン１モルに対し
てホルムアルデヒド１〜２．５モル好ましくは１．２〜
２モルを加熱反応させて得られたメラミン樹脂を含浸処
理し、その後さらに不飽和結合を有する樹脂を含浸し、
該樹脂を硬化させた積層板である。In the present invention, formaldehyde is added to the cellulose base material in an amount of 1 to 2.5 mol, preferably 1.2 to 2.5 mol, per 1 mol of melamine.
The melamine resin obtained by heating and reacting 2 moles is impregnated, and then further impregnated with a resin having unsaturated bonds,
This is a laminate made of hardened resin.
本発明に係るメラミン樹脂は５通常の方法により製造す
る。しかしながら、ホルムアルデヒドのモル数が少なく
なるにしたがってメラミン樹脂の保存安定性が悪くなる
から、必要に応して炭素数５以下の低級アルコールを添
加するか、あるいは低級アルコールを用いてメラミン樹
脂のメチロール基の一部または全部をエーテル化する。The melamine resin according to the present invention is produced by a conventional method. However, as the number of moles of formaldehyde decreases, the storage stability of the melamine resin deteriorates, so if necessary, a lower alcohol having 5 or less carbon atoms may be added, or a lower alcohol may be used to remove the methylol groups in the melamine resin. to etherify part or all of it.
また、メラミン樹脂の可撓性を増すためには必要により
、可望剤としてパラトルエンスルホンアミドを添加する
。添加量はメラミン１モルに対して０．１モル以上が適
当である。Furthermore, in order to increase the flexibility of the melamine resin, para-toluenesulfonamide is added as a desensitizer, if necessary. The addition amount is suitably 0.1 mol or more per 1 mol of melamine.
本発明に用いる不飽和結合を有する樹脂としては、アク
リル酸アルキルエステル、メタクリル酸アルキルエステ
ルあるいはスチレン等により重合体を得、その側鎖に不
飽和二重結合を導入したもの、ビニルエステル樹脂等の
ように分子末端に不飽和二重結合を持つもの、或いは主
鎖中に不飽和二重結合を有する不飽和ポリエステル樹脂
など及びこれらの混合物がある。Examples of resins having unsaturated bonds used in the present invention include polymers obtained from acrylic acid alkyl esters, methacrylic acid alkyl esters, styrene, etc., and unsaturated double bonds introduced into the side chains, vinyl ester resins, etc. There are unsaturated polyester resins having an unsaturated double bond at the end of the molecule, unsaturated double bonds in the main chain, and mixtures thereof.
樹脂中に必要に応じてハロゲン系の添加型又は反応型の
難燃剤、りん系難燃剤、三酸化アンチモン、水酸化アル
ミニウム等の無機難燃剤を加えて使用する。Inorganic flame retardants such as halogen-based additive or reactive flame retardants, phosphorus-based flame retardants, antimony trioxide, and aluminum hydroxide are added to the resin as needed.
セルロース系基材としては、クラフト紙、リンター祇等
のセルロース系紙基材及びガラス繊維混抄紙がある。Examples of the cellulose base material include cellulose paper base materials such as kraft paper and linter paper, and glass fiber mixed paper.
本発明の作用は詳らかでないが、メラミンに反応させる
ホルムアルデヒドの量を少なくしたので。Although the effect of the present invention is not clear, the amount of formaldehyde reacted with melamine was reduced.
得られたメラミン樹脂が軟らかくなり、その結果耐！Ｊ
撃性が向上するものと思われる。The resulting melamine resin becomes soft and therefore durable! J
It is thought that the attack performance will be improved.
１０ メラミン樹脂の合成
１、メラミン樹脂■
３７％ホルマリン４０５重量部、メラミン４２０重量部
、水２５０重量部を８０℃で４０分間撹拌混合してメラ
ミンを溶解させ、さらにメタノール２６０重量部を添加
し冷却してメラミン樹脂Ｉを得た。10 Synthesis of melamine resin 1, melamine resin ■ 405 parts by weight of 37% formalin, 420 parts by weight of melamine, and 250 parts by weight of water were stirred and mixed at 80°C for 40 minutes to dissolve the melamine, and then 260 parts by weight of methanol was added and cooled. Melamine resin I was obtained.
この樹脂はメラミン１モルに対してホルムアルデヒド１
．５モルの結合比である。This resin contains 1 mole of melamine and 1 mole of formaldehyde.
．． The binding ratio is 5 moles.
ｉｉ、メラミン樹脂■
メラミン樹脂■の合成方法において、ホルマリンの量を
変えた他は同じにしてメラミン１モルに対してホルムア
ルデヒド３．０モルの結合比ヲ持つメラミン樹脂■を得
た。ii. Melamine resin (2) Melamine resin (2) was obtained using the same method for synthesizing melamine resin (2) except that the amount of formalin was changed, and having a binding ratio of 3.0 moles of formaldehyde to 1 mole of melamine.
（２） 不飽和樹脂の合成
ｉ、アクリル酸エチル１０！１ｆｆｉ部、アクリル酸ブ
チル７０重量部、アクリル酸メタグリシジル２０重量部
を３０％溶液中で溶液重合を行い、溶剤を除いて共重合
体を得た。さらに、この共重合体にアクリル酸１０重量
部を添加反応させて側鎖に二重結合を付与した。次いで
スチレンを加えて不揮発分６０％の不飽和樹脂を得た。(2) Synthesis of unsaturated resin i, 10!1 ffi parts of ethyl acrylate, 70 parts by weight of butyl acrylate, and 20 parts by weight of metaglycidyl acrylate were subjected to solution polymerization in a 30% solution, and the copolymer was obtained by removing the solvent. I got it. Furthermore, 10 parts by weight of acrylic acid was added to this copolymer to cause a reaction, thereby imparting double bonds to the side chains. Styrene was then added to obtain an unsaturated resin with a nonvolatile content of 60%.
１１、スチレン３０重量部、メタクリル酸−２ヒドロキ
シ工チル４０重量部、アクリル酸にブチル４０重量部を
３０％溶液中で溶液重合を行い、さらにこれに無水マレ
イン酸を付加反応させて側鎖に二重結合を付与し、スチ
レンを加えて不揮発分６０％の不飽和樹脂を得た。11. Solution polymerization was carried out in a 30% solution of 30 parts by weight of styrene, 40 parts by weight of 2-hydroxyl methacrylate, and 40 parts by weight of butyl in acrylic acid, and this was further subjected to an addition reaction with maleic anhydride to form side chains. Double bonds were added and styrene was added to obtain an unsaturated resin with a nonvolatile content of 60%.
ｉｉｉ 、テトラブロモビスフェノールＡプリンジルエ
ーテル（エポキシ当量３９５〜４１０） １００重量部
に対し、ダイマー酸３５．７ベンジルジメチルアミン１
．３、スチレン６２．ハイドロキノン０．０５各重量部
を配合し、酸価が６以下となるまで反応を続け、さらに
メタクリル酸９重量部を配合し、酸価２．３のダイマー
酸変性エポキシメタクリレート樹脂を得た。iii, 35.7 parts of dimer acid, 1 part of benzyldimethylamine per 100 parts by weight of tetrabromobisphenol A purindyl ether (epoxy equivalent: 395-410)
．． 3. Styrene 62. 0.05 parts by weight of each hydroquinone was blended and the reaction was continued until the acid value became 6 or less, and 9 parts by weight of methacrylic acid was further blended to obtain a dimer acid-modified epoxy methacrylate resin with an acid value of 2.3.
Ｉｖ、ジエチレングリコール８９重量部、無水マレイン
酸３７重量部、イソフタル酸６３重量部、ハイドロキノ
ン０．０２重量部を配合し、窒素ガスを吹込みながら１
９０〜２２０℃で酸価が１９となるまで加熱を続け、不
飽和ポリエステル樹脂を得た。IV, 89 parts by weight of diethylene glycol, 37 parts by weight of maleic anhydride, 63 parts by weight of isophthalic acid, and 0.02 parts by weight of hydroquinone, and 1
Heating was continued at 90 to 220°C until the acid value reached 19 to obtain an unsaturated polyester resin.
（３） 銅張積層板の製造
メラミン樹脂Ｉを１４０ｇのクラフト紙に含浸乾燥した
。クラフト紙の重量は１５．１％増加した。(3) Production of copper-clad laminate 140 g of kraft paper was impregnated with melamine resin I and dried. The weight of kraft paper increased by 15.1%.
次にこの含浸紙に、ヘンシルパーオキサイド１重量部を
配合した不飽和樹脂（（ｉ）（ｉｉ） （ｉｉｉ）（ｉ
ｖ）） ４種をそれぞれ含浸させ５各６枚を重ねた後、
それぞれにエポキシ系接着剤を塗布した厚さ３５μｍの
電解銅箔をラミネートして、１３０℃。Next, this impregnated paper was mixed with an unsaturated resin ((i) (ii) (iii) (i
v)) After impregnating each of the 4 types and stacking 5 each of 6 pieces,
Each layer was laminated with 35 μm thick electrolytic copper foil coated with epoxy adhesive and heated to 130°C.
１５ｋｇ／ａｄで２０分間加圧加熱して樹脂を硬化させ
厚さ１．６■論の銅張積層板を得た。The resin was cured by heating under pressure at 15 kg/ad for 20 minutes to obtain a copper-clad laminate having a thickness of 1.6 mm.
メラミン樹脂■を用い、実施例（３）と同様にして。 Using melamine resin ■, in the same manner as in Example (3).
銅張積層板を得た。A copper-clad laminate was obtained.
実施例及び比較例によって得た銅張積層板の衝撃強さ及
び煮沸絶縁抵抗を測定した。衝撃強さは。The impact strength and boiling insulation resistance of the copper-clad laminates obtained in Examples and Comparative Examples were measured. Impact strength.
落下衝撃試験機を用い１４０ ｇの重りを落下させ破壊
したときの高さで示す。煮沸絶縁抵抗はＪＩＳＣ６４８
１に依った。試験結果を第１表に示す。It is indicated by the height when a 140 g weight is dropped using a drop impact tester and the product breaks. Boiling insulation resistance is JISC648
It depended on 1. The test results are shown in Table 1.
第１表 （以下全ｂ） 〔発明の効果〕Table 1 (All b below) 〔Effect of the invention〕
Claims (1)
アルデヒド１〜２．５モルを反応させて得られたメラミ
ン樹脂を含浸乾燥した後、不飽和結合を有する樹脂を含
浸硬化してなる積層板。 ２、メラミン樹脂に可塑剤としてパラトルエンスルホン
アミドを加えてなる請求項１記載の積層板。 ３、不飽和結合を有する樹脂が、主鎖、側鎖又は主鎖の
末端に共重合可能な不飽和結合を有する請求項１記載の
積層板。[Claims] 1. A cellulose fiber base material is impregnated with a melamine resin obtained by reacting 1 mole of melamine with 1 to 2.5 moles of formaldehyde and dried, and then impregnated with a resin having unsaturated bonds and cured. Laminated board made of 2. The laminate according to claim 1, wherein para-toluenesulfonamide is added as a plasticizer to the melamine resin. 3. The laminate according to claim 1, wherein the unsaturated bond-containing resin has a copolymerizable unsaturated bond in the main chain, side chain, or end of the main chain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7774888A JPH01249837A (en) | 1988-03-30 | 1988-03-30 | Laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7774888A JPH01249837A (en) | 1988-03-30 | 1988-03-30 | Laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01249837A true JPH01249837A (en) | 1989-10-05 |
Family
ID=13642537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7774888A Pending JPH01249837A (en) | 1988-03-30 | 1988-03-30 | Laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01249837A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4029987A1 (en) * | 2021-01-13 | 2022-07-20 | Fritz Egger GmbH & Co. OG | Flame-retardant impregnate and laminate, panel with flame retardant impregnate, method for producing the impregnate and panel |
-
1988
- 1988-03-30 JP JP7774888A patent/JPH01249837A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4029987A1 (en) * | 2021-01-13 | 2022-07-20 | Fritz Egger GmbH & Co. OG | Flame-retardant impregnate and laminate, panel with flame retardant impregnate, method for producing the impregnate and panel |
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