JPH0124231B2 - - Google Patents
Info
- Publication number
- JPH0124231B2 JPH0124231B2 JP10493783A JP10493783A JPH0124231B2 JP H0124231 B2 JPH0124231 B2 JP H0124231B2 JP 10493783 A JP10493783 A JP 10493783A JP 10493783 A JP10493783 A JP 10493783A JP H0124231 B2 JPH0124231 B2 JP H0124231B2
- Authority
- JP
- Japan
- Prior art keywords
- silver
- speed
- plating
- plating solution
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10493783A JPS59232288A (ja) | 1983-06-14 | 1983-06-14 | 高速銀めつき液 |
US06/617,215 US4614568A (en) | 1983-06-14 | 1984-06-04 | High-speed silver plating and baths therefor |
KR1019840003181A KR890001106B1 (ko) | 1983-06-14 | 1984-06-07 | 고속 은도금 |
GB08414641A GB2141441B (en) | 1983-06-14 | 1984-06-08 | High-speed silver plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10493783A JPS59232288A (ja) | 1983-06-14 | 1983-06-14 | 高速銀めつき液 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59232288A JPS59232288A (ja) | 1984-12-27 |
JPH0124231B2 true JPH0124231B2 (en, 2012) | 1989-05-10 |
Family
ID=14394003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10493783A Granted JPS59232288A (ja) | 1983-06-14 | 1983-06-14 | 高速銀めつき液 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59232288A (en, 2012) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014112430A1 (ja) * | 2013-01-15 | 2014-07-24 | 三菱瓦斯化学株式会社 | シリコンエッチング液およびエッチング方法並びに微小電気機械素子 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4604167A (en) * | 1984-01-26 | 1986-08-05 | Shinko Electric Industries Co., Ltd. | Silver plating solution and silver plating process and pretreatment solution therefor |
JPS6223996A (ja) * | 1985-07-23 | 1987-01-31 | Nippon Mining Co Ltd | 銀めつき方法 |
JP6230778B2 (ja) * | 2012-05-31 | 2017-11-15 | 日亜化学工業株式会社 | 光半導体装置用電解銀めっき液 |
JP7611479B2 (ja) * | 2020-07-15 | 2025-01-10 | 日進化成株式会社 | ノンシアン系電解純銀めっき液 |
-
1983
- 1983-06-14 JP JP10493783A patent/JPS59232288A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014112430A1 (ja) * | 2013-01-15 | 2014-07-24 | 三菱瓦斯化学株式会社 | シリコンエッチング液およびエッチング方法並びに微小電気機械素子 |
JPWO2014112430A1 (ja) * | 2013-01-15 | 2017-01-19 | 三菱瓦斯化学株式会社 | シリコンエッチング液およびエッチング方法並びに微小電気機械素子 |
US9875904B2 (en) | 2013-01-15 | 2018-01-23 | Mitsubishi Gas Chemical Company, Inc. | Silicon etching liquid, silicon etching method, and microelectromechanical element |
Also Published As
Publication number | Publication date |
---|---|
JPS59232288A (ja) | 1984-12-27 |
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