JPH01236205A - Thermosetting resin composition and cured product thereof - Google Patents

Thermosetting resin composition and cured product thereof

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Publication number
JPH01236205A
JPH01236205A JP6191788A JP6191788A JPH01236205A JP H01236205 A JPH01236205 A JP H01236205A JP 6191788 A JP6191788 A JP 6191788A JP 6191788 A JP6191788 A JP 6191788A JP H01236205 A JPH01236205 A JP H01236205A
Authority
JP
Japan
Prior art keywords
resin composition
thermosetting resin
cured product
ring
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6191788A
Other languages
Japanese (ja)
Other versions
JPH0796574B2 (en
Inventor
Akira Nagai
晃 永井
Toshio Sugawara
捷夫 菅原
Akio Takahashi
昭雄 高橋
Masahiro Ono
正博 小野
Shin Nishimura
伸 西村
Toshikazu Narahara
奈良原 俊和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP63061917A priority Critical patent/JPH0796574B2/en
Publication of JPH01236205A publication Critical patent/JPH01236205A/en
Publication of JPH0796574B2 publication Critical patent/JPH0796574B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To produce the title composition which is excellent in not only flame retardance, heat resistance and mechanical strength but also electrical properties such as low dielectric constant, and gives a cured product useful as insulating materials, by incorporating a specific fluorinated aromatic compound. CONSTITUTION:The title composition is obtained by incorporating a compound represented by formula X-R-X [wherein R is an aromatic ring having one or more F atoms., preferably, a perfluorophenylene ring or perfluorobiphenylene ring; and X is a reactive double bond containing a 2-4C substituent, preferably, a vinyl, an allyl, an isopropenyl, a vinyloxy, an allyloxy, an isopropenyloxy, a (meth)acryloyloxy, or a 3-butenoyloxy group]. A cured product is produced by adding, for example, 0.1%n5pts.wt. radical polymerization initiator to 100pts. wt. composition or by thermal polymerization of the composition.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は熱硬化性樹脂組成物に係り、符に難燃性、耐熱
性及び低誘′に率で電気特性に優れ几絶縁材料として好
適な使脂組底物及びその硬化物に関する。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a thermosetting resin composition, which has excellent flame retardancy, heat resistance, low dielectric constant, and electrical properties, and is suitable as an insulating material. The present invention relates to a fat-used composite sole and a cured product thereof.

〔従来の技術〕[Conventional technology]

従来、低誘電率の絶縁材料として、ポリ四フフ化エチレ
ンに代表されるフッ素系樹脂やポリエチレン、ポリブタ
ジェンに代表される炭化水素系樹脂が知られており、一
般的に広く用いられている。
Conventionally, fluororesins such as polytetrafluoroethylene, hydrocarbon resins such as polyethylene, and polybutadiene have been known as insulating materials with low dielectric constants, and are generally widely used.

しかし前者のフッ素系樹脂は耐熱性が高く、蟲燃注でろ
るが、これらはすべて熱可塑性樹脂であり、軟化温度が
低く軟化温度工り高@側では急激7c機械的強度の低下
や熱膨張率が大きくなり、使用される範囲に限足を受け
てしまう。ま7’C後者の炭化水素系樹脂はポリブタジ
ェンを始め熱硬化性樹脂が数多く開発されており、高温
での機械的Q 隻、寸法安定性等を必要とする分野にも
広く適用されている(特公昭5B−21926号)。し
かし、これら炭化水素系樹脂は可燃性樹脂でろるという
大きな問題点がめる0このため離燃化の検討が必要でお
るが、一般的に難燃剤の添7IOは電気特性に悪影響を
与える九め、低諌電率としての特性が十分に生かせない
ことが多い。
However, the former fluorine-based resin has high heat resistance and is resistant to mold injection, but these are all thermoplastic resins, and their softening temperature is low and when the softening temperature is high, the mechanical strength suddenly decreases by 7C and thermal expansion occurs. The ratio becomes large and the range in which it can be used is limited. Of the latter hydrocarbon resins, many thermosetting resins have been developed, including polybutadiene, and are widely applied in fields that require mechanical stability at high temperatures, dimensional stability, etc. Special Publication No. 5B-21926). However, these hydrocarbon resins have a major problem in that they are flammable resins.For this reason, it is necessary to consider flame retardation; In many cases, the characteristic of low electrical discharge rate cannot be fully utilized.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

本発明の目的は耐熱性t−損うことなく難撚性でかつ低
酵電率で電気特注に優れ之熱硬化性樹脂組成物及びその
硬化物全提供することにある。
The object of the present invention is to provide a thermosetting resin composition and a cured product thereof, which is difficult to twist without impairing heat resistance, has a low fermentation rate, and is excellent in electrical customization.

〔課題を解決するための手段〕[Means to solve the problem]

本発明を概説すれば、本発明の第1の発明は熱硬化性樹
脂組成物に関する発明でろって、下記−最大l: X−R−X          ・・・(1)(式中R
に、7ツ索を少なくとも1個含有する芳香環、Xは反応
注二亘結会を有するIt換基全示す)で表される化合物
を含有していることを特徴とする0 そして、本発明の第2の発明は硬化物に関する発明でろ
って、第1の発明の熱硬化性樹脂組成物を熱硬化させて
なることを特徴とする。
To summarize the present invention, the first invention of the present invention relates to a thermosetting resin composition.
The present invention is characterized in that it contains a compound represented by an aromatic ring containing at least one heptad, X is an It substituent having a reaction bond. The second invention relates to a cured product, and is characterized in that it is obtained by thermosetting the thermosetting resin composition of the first invention.

前記目的は、上記−最大lを過酸化物等のラジカル1合
開始剤あるいは熱1合等に工9硬化物を得ることに工す
達成される。
The above object is achieved by adding the above-mentioned maximum l to a radical initiator such as peroxide or heat to obtain a cured product.

本発明における一般式[−具体的に示すと例えば、 で表される。このとさXは反応性二重結合t−有する置
換基で、このIE置換基1分子中に2個あるため加熱重
合することにより三次元に架橋した耐熱性に優れた熱硬
化性樹脂組成物となる。三次元架橋し九熱硬化物は軟化
温度が尚くなり、高温での著しい機械的強度の低下や熱
膨張率の急激な上昇を抑えることができ、高温で寸法安
定性の優れた絶縁材料として使用することができる。ま
た分子骨格t)ユニしン環、ビフェニレン環にスルコト
にニジ、耐熱性、機械的強度が優れたものが得られる。
The general formula in the present invention is represented by [--Specifically, for example. This tosa X is a substituent having a reactive double bond t-, and since there are two of these IE substituents in one molecule, the thermosetting resin composition has excellent heat resistance and is three-dimensionally crosslinked by thermal polymerization. becomes. The three-dimensionally crosslinked nine-thermocured material has a lower softening temperature and can suppress a significant decrease in mechanical strength and a rapid increase in the coefficient of thermal expansion at high temperatures, making it an insulating material with excellent dimensional stability at high temperatures. can be used. In addition, a molecular skeleton (t) having a unicine ring and a biphenylene ring with a sulfuric acid structure and excellent heat resistance and mechanical strength can be obtained.

反応基を置換した以外のところをフッ素基に置換えるこ
とにニジ、耐熱性が更に向上し、難撚性の特注全有する
ことができる0反応注二重結合を有する置換基Xの例と
しては、ビニル(−CH=CHz ) b アリル(−
CH宜−CH=CHり、イソプロペニル(−C=CH,
) 、ビニルオキシ(−0−CH=CH,)、占H3 アリルオキシ(−0−CH,−C)l=cH,)、イソ
プロペニルオキシ(−0−C=CH,) 、アクリロイ
ルオキシ占H3 (−0−C−CH=CHり 、3−ブテノイルオキシ(
一〇−C−CH2−CH=CH2)、メグクリロイルオ
かシるいは熱重合可能な二重結合を有していれば特に限
定ちれるものではない。
By substituting fluorine groups in places other than the reactive groups, the heat resistance is further improved, and it is possible to have a custom-made structure with low twist resistance.As an example of the substituent X having a double bond, , vinyl (-CH=CHz) b allyl (-
CH-CH=CH, isopropenyl (-C=CH,
), vinyloxy(-0-CH=CH,), allyloxy(-0-CH,-C)l=cH,), isopropenyloxy(-0-C=CH,), acryloyloxy(- 0-C-CH=CH, 3-butenoyloxy (
There is no particular limitation as long as it has a double bond that can be thermally polymerized, such as 10-C-CH2-CH=CH2), megcrylyl, or silyl.

本発明における硬化反応について一般的な方法としでは
、ラジカル重合開始剤として退散化物を用いることが多
い。一般に使用されろ過は化物としてU 911えばベ
ンゾイルパーオキシド、シタミルパーオキシド、メチル
エチルケトンパーオキシド、2.5−ジメチルヘキサン
−2,5−シバ(l’ロバ−オキシド、t−ブチルパー
ベンゾエート、2.5−ジメチル−2,5−(t−ブチ
ルパーオキシ)ヘキシン−3、クメンハイドロパーオキ
シド、t−ブチルハツトロバ−オキシド、ジベンジルパ
ーオキシド、ジーt−ブチルパーオキシフタレート寺が
おる。重合開始剤の配合披としては街脂組成吻1001
1L量部に対して、一般にa1〜5重鼠部であるが、α
2〜c1.5重置部が杵に好ましい。ま之、必要に応じ
てラジカル重合の促進剤、遅延剤や谷a顔料、充てん剤
等を加えても良い。
In a general method for the curing reaction in the present invention, a retreated product is often used as a radical polymerization initiator. Commonly used filtration methods include U911 compounds such as benzoyl peroxide, cytamyl peroxide, methyl ethyl ketone peroxide, 2,5-dimethylhexane-2,5-shiba(l'roba-oxide), t-butyl perbenzoate, 2. 5-dimethyl-2,5-(t-butylperoxy)hexyne-3, cumene hydroperoxide, t-butyltrobar oxide, dibenzyl peroxide, di-t-butylperoxyphthalate.Polymerization initiators The combination is street fat composition 1001
For 1L part, it is generally a1 to 5 parts, but α
2 to c1.5 overlapping parts are preferred for the punch. However, if necessary, a radical polymerization accelerator, retarder, valley a pigment, filler, etc. may be added.

硬化反応としては有脂組成物VC開始剤を添フロし友だ
けの塊状重合を始め、有機溶媒を用いfc浴浴室1合、
乳化重合や懸濁重合等がおる。
For the curing reaction, a fatty composition was added with a VC initiator to start bulk polymerization, and an organic solvent was used to prepare the FC bath for 1 cup.
There are emulsion polymerization, suspension polymerization, etc.

〔実施例〕〔Example〕

以下、本発明七笑施例にエリ更に具体的に耽明するが、
本発明はこれら実施例に限定されない。
Hereinafter, seven examples of the present invention will be described in more detail,
The invention is not limited to these examples.

実施例1 ジビニルテトラフルオロベンゼンの合成脱水乾燥させた
ジエチルエーテル5〇−甲に1゜4−ジクロロ−2,3
,5,6−テトラフルオロベンゼン20tf静解し、そ
の中にマグネシウム片t−32、ヨウ素結晶を数片加え
る。還流条件下(35℃)で約2時間反応させる。50
−の水を刃口えて反応全終了式せ、更に希111iIE
咳を加え過剰のマグネシウムを硫酸塩として分離させる
。得られた1、4−シ(クロロマグネシウム) −2,
3,5,6−チトラフルオロベンゼンのジエチルエーテ
ル浴液に7セトアルデヒドを加えて1.4−ビス(1−
ヒドロキシエチル)−2,3,5,6−チトラフルオロ
ベンゼンを得る。史に五酸化リンを加えて還流条件下で
5時間脱水反応七行う。最後に得られ九生底物を大波の
メタノール中に投入し、沈殿物として得る〇ジエチルエ
ーテルーメタノール糸で再沈殿を行いn表し、真空乾燥
を行い、1,4−ジビニル−2,3゜5.6−チトラフ
ルオロベンゼン’k 得ft o 得’)れ九生成物の
IRスペクトルを第1図に示す。なお、第1図において
横@は彼数(ロー1ン、縦軸は透過率を示す。
Example 1 Synthesis of divinyltetrafluorobenzene Dehydrated and dried diethyl ether 5〇-A to 1゜4-dichloro-2,3
, 20tf of 5,6-tetrafluorobenzene is allowed to settle, and a magnesium piece T-32 and several pieces of iodine crystal are added thereto. The reaction is carried out under reflux conditions (35°C) for about 2 hours. 50
Add water to complete the reaction, and add diluted 111iIE.
Cough to separate excess magnesium as sulfate. The obtained 1,4-cy(chloromagnesium)-2,
7cetaldehyde was added to the diethyl ether bath solution of 3,5,6-titrafluorobenzene to form 1,4-bis(1-
hydroxyethyl)-2,3,5,6-titrafluorobenzene is obtained. Add phosphorus pentoxide to the mixture and carry out a dehydration reaction for 5 hours under reflux conditions. Finally, the obtained 90-year-old bottom material is poured into a large wave of methanol to obtain a precipitate. Re-precipitate with diethyl ether-methanol thread and vacuum dry to obtain 1,4-divinyl-2,3 The IR spectrum of the 5.6-titrafluorobenzene product is shown in FIG. In FIG. 1, the horizontal @ represents the number of electrons (row 1), and the vertical axis represents the transmittance.

ジビニルテトラフルオロベンゼンの重合得られたモノマ
ー101Fに過酸化物としてジクミルパーオキシドo、
o2tk刃口え、ろらかじめ離型処理し九釡型容器に厚
さ2簡になるように入れ、80℃/60分、100℃7
60分、120℃7180分、150℃/180分加熱
硬化反応を行い、硬化物を得友。得られた硬化物の耐熱
性を調べるtめ熱分解開始温度、電気特注として比誘電
率、雄燃注としてUL試験、高温で軟化性の目安として
曲げ強度比(室温と180℃との曲げ強度の比)を測定
して得られ友結果七後記表1に他の例と共に示す。
Polymerization of divinyltetrafluorobenzene Dicumyl peroxide o,
o2tk blade mouthpiece, Rorakaji, mold release treatment, put into a nine pot type container so that it is 2 pieces thick, 80℃ / 60 minutes, 100℃ 7
Heat curing reactions were performed for 60 minutes at 120°C, 7180 minutes at 150°C, and 180 minutes at 150°C to obtain a cured product. To check the heat resistance of the obtained cured product, check the thermal decomposition start temperature, the relative dielectric constant for electrical special orders, the UL test for male fuel injection, and the bending strength ratio (bending strength between room temperature and 180°C) as a measure of softening properties at high temperatures. The results obtained are shown in Table 1 below along with other examples.

実施例2 実施?IJ 1で1.4−ジクロロ−2,3,5,6−
チトラフルオロベンゼンの代9に4,4′−ジクロロオ
クタフルオロビフェニルを用いてグリニヤール化合物會
得、更にアセトアルデヒドの代υにア七トンを刃口えて
4.4′−イソプロペニルオクタフルオロビフェニルを
モノマーとして得た。得られた生成物のIRスペクトル
を第2図に示す。
Example 2 Implementation? IJ 1 in 1,4-dichloro-2,3,5,6-
A Grignard compound was obtained by using 4,4'-dichlorooctafluorobiphenyl as the substitute for titrafluorobenzene, and then adding a7tone to the substitute for acetaldehyde to form 4,4'-isopropenyl octafluorobiphenyl as a monomer. Obtained. The IR spectrum of the obtained product is shown in FIG.

得られ念モノマー10tに過酸化物としてベンゾイルパ
ーオキシドcLosr’l加え、実施例1と同様に金型
容器上用いて60℃/60分、80℃/60分、100
℃/180分、120℃7180分、150℃7180
分770熱硬化して南脂板金得几。得られた特性を表1
に示す。
Benzoyl peroxide cLosr'l was added as a peroxide to 10 tons of the obtained monomer, and the mixture was heated in the same manner as in Example 1 at 60°C/60 minutes, 80°C/60 minutes, 100°C.
℃/180 minutes, 120℃ 7180 minutes, 150℃ 7180
Heat cured for 770 minutes to obtain a sheet metal. Table 1 shows the obtained characteristics.
Shown below.

実施例3 1.4−ジアリルテトラフルオロベンゼンの合成1.4
−ジヒドロキシ−2,3,5,6−テトラフルオロベン
ゼン2oy2ジブチルエーテル100f!LtK浴解さ
せアリルクロライド10りを加え100℃で2時間反応
場ぜる。得られ友生成物を大波のメタノール中に投入し
、沈殿物として得る。更にジエチルエーテル−メタノー
ル系で再沈殿を行い稽表し、真空乾燥を行い1.4−ジ
アリル−2,3,5,6−チトラフルオロベンゼンを得
友。得られた生成物のIRスペクトルを第3図に示す。
Example 3 Synthesis of 1.4-diallyltetrafluorobenzene 1.4
-dihydroxy-2,3,5,6-tetrafluorobenzene 2oy2 dibutyl ether 100f! Dissolve the LtK bath, add 10 g of allyl chloride, and leave the reaction field at 100°C for 2 hours. The obtained product is poured into a large amount of methanol to obtain a precipitate. Further, reprecipitation was performed using a diethyl ether-methanol system, followed by vacuum drying to obtain 1,4-diallyl-2,3,5,6-titrafluorobenzene. The IR spectrum of the obtained product is shown in FIG.

得られ友モノマー10rVci!ig化物としてクメン
ハイドロパーオキシド(LO5f’(+−加え実施vJ
1と同様に金盟谷器を用いて硬化物全作成し九〇硬化温
度は100℃760分、150℃/180分、200℃
/180分とし友。得られfc特性を表1に示す。
Obtained friend monomer 10rVci! Cumene hydroperoxide (LO5f'(+-additional vJ
90 Curing temperature was 100°C for 760 minutes, 150°C/180 minutes, 200°C.
/180 minutes Toshitomo. The obtained fc characteristics are shown in Table 1.

実施ガ4 1.4−ジメタクリロイルオキシテトラフルオロベンゼ
ンの合成 1.4−ジヒドロキシ−2,3,5,6−テトラフルオ
ロベンゼン20ft−塩化メチレン200ゴに溶解させ
メタクリル酸クロライド101F’i含んだ塩化メチレ
ン浴fi1001Lt’i約30分かけて滴下する。
Example 4 Synthesis of 1.4-dimethacryloyloxytetrafluorobenzene 1.4-dihydroxy-2,3,5,6-tetrafluorobenzene 20 ft - chloride containing methacrylic acid chloride 101 F'i dissolved in 200 methylene chloride The methylene bath fi1001Lt'i is added dropwise over about 30 minutes.

この時反応液は5℃前後に冷却しながら行う。滴下後、
還流条件下(40℃)で5時間反応を行い得られた生成
物を大量のメタノール中に投入し沈殿物として得る。更
にジエチルエーテル−メタノール糸で再沈殿七行い精製
し、真空乾燥により、1.4−ジメタクリロイルオキシ
−2,3,5,6−チトラフルオロペンセンを得友。得
られた生成物の工Rスペクトル全第4図に示す。
At this time, the reaction solution is cooled to around 5°C. After dripping,
The reaction is carried out under reflux conditions (40° C.) for 5 hours, and the resulting product is poured into a large amount of methanol to obtain a precipitate. Further purification was carried out by seven reprecipitations using a diethyl ether-methanol thread, followed by vacuum drying to obtain 1,4-dimethacryloyloxy-2,3,5,6-titrafluoropencene. The complete R spectrum of the obtained product is shown in FIG.

得られたモノマー10fK過酸化物としてt−ブチルハ
イドロパーオキシド(Ll tf刀刃口、実施例3と同
じ硬化温度により硬化物を作成した。得られt杵注七表
1に示す0 比較ガ1 モノマーとしてペンタフルオロスチレン102にジクミ
ルパーオキシド0052加え実施例1と同峠の方法で熱
可塑性樹脂板を得た。得られた特注を表1に示す。
Obtained monomer 10 fK As peroxide, t-butyl hydroperoxide (Ll tf) A cured product was prepared at the same curing temperature as in Example 3. A thermoplastic resin plate was obtained by adding dicumyl peroxide 0052 to pentafluorostyrene 102 and using the same method as in Example 1. Table 1 shows the custom-made resin plate.

比較例2 プレポリマーとして1,2−ポリブタジエン102にジ
クミルパーオキシド111 を金加え実施列1と同様な
方法で硬化′@金得た。得られ7′t−特性を表1に示
す。
Comparative Example 2 Dicumyl peroxide 111 was added as a prepolymer to 1,2-polybutadiene 102 to obtain cured gold in the same manner as in Example 1. The obtained 7't-characteristics are shown in Table 1.

茨1に示″jLうに央厖声」に工って得らnた硬化物は
すべて比誘電率が2.5付近と低く、更に耐熱狂、難燃
任に潰れていることが分る。また、比較す」1のような
熱可塑性の樹脂板と異なり高温(180℃9でも機弧的
強度に十分保持している。
It can be seen that all of the cured products obtained by fabricating "JL Sea Urchins" shown in Ibara 1 have a low dielectric constant of around 2.5, and are also heat resistant and flame retardant. Also, unlike thermoplastic resin plates like Comparison 1, it maintains sufficient mechanical strength even at high temperatures (180°C9).

〔発明の効果〕〔Effect of the invention〕

本発明に工って得られ九含フッ索熱硬化性情脂組成物は
、射恐注、難燃法に潰れ、かつ比誘電率の低いt気%注
V?−稜れた絶縁材料として適用てれる〇ま九この時、
三次元架橋型硬化物であるため高温での機械的強度、寸
法安定性にも極めて優れており、多くの分野で使用てれ
る。
The fluorine-containing thermosetting resin composition obtained by the present invention is resistant to injection and flame retardant methods, and has a low dielectric constant. - At this time, it can be applied as a ridged insulating material.
Because it is a three-dimensionally crosslinked cured product, it has excellent mechanical strength and dimensional stability at high temperatures, and is used in many fields.

【図面の簡単な説明】[Brief explanation of the drawing]

第11〜第4図は本発明の熱硬1と狂矧脂組成物に添加
されるモノマーの1り(」の赤外吸収スペクトル図でろ
る。 特許出願人 体式会社 日立製作所
Figures 11 to 4 are infrared absorption spectra of the thermoset 1 of the present invention and one of the monomers added to the wax fat composition. Patent applicant: Hitachi, Ltd.

Claims (1)

【特許請求の範囲】 1、下記一般式1: X−R−X…〔1〕 (式中Rは、フッ素を少なくとも1個含有する芳香環、
Xは反応性二重結合を有する置換基を示す)で表される
化合物を含有していることを特徴とする熱硬化性樹脂組
成物。 2、該基Rが、パーフルオロフエニレン環又はパーフル
オロビフエニレン環である請求項1記載の熱硬化性樹脂
組成物。 3、該基Xの炭素数が、2〜4個である請求項1記載の
熱硬化性樹脂組成物。 4、該基Xが、ビニル、アリル、イソプロペニル、ビニ
ルオキシ、アリルオキシ、イソプロペニルオキシ、アク
リロイルオキシ、3−ブテノイルオキシ又はメタクリロ
イルオキシ基である請求項1記載の熱硬化性樹脂組成物
。 5、請求項1記載の熱硬化性樹脂組成物を熱硬化させて
なることを特徴とする硬化物。
[Claims] 1. The following general formula 1: X-R-X... [1] (In the formula, R is an aromatic ring containing at least one fluorine,
A thermosetting resin composition characterized by containing a compound represented by (X represents a substituent having a reactive double bond). 2. The thermosetting resin composition according to claim 1, wherein the group R is a perfluorophenylene ring or a perfluorobiphenylene ring. 3. The thermosetting resin composition according to claim 1, wherein the group X has 2 to 4 carbon atoms. 4. The thermosetting resin composition according to claim 1, wherein the group X is a vinyl, allyl, isopropenyl, vinyloxy, allyloxy, isopropenyloxy, acryloyloxy, 3-butenoyloxy or methacryloyloxy group. 5. A cured product obtained by thermosetting the thermosetting resin composition according to claim 1.
JP63061917A 1988-03-17 1988-03-17 Thermosetting resin composition and cured product thereof Expired - Lifetime JPH0796574B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63061917A JPH0796574B2 (en) 1988-03-17 1988-03-17 Thermosetting resin composition and cured product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63061917A JPH0796574B2 (en) 1988-03-17 1988-03-17 Thermosetting resin composition and cured product thereof

Publications (2)

Publication Number Publication Date
JPH01236205A true JPH01236205A (en) 1989-09-21
JPH0796574B2 JPH0796574B2 (en) 1995-10-18

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Country Link
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997003992A1 (en) * 1995-07-14 1997-02-06 Sumitomo Chemical Company, Limited Transition metal complex, process for the preparation thereof, polymerization catalyst for olefins containing the complex, and process for producing olefin polymers
JP2003073435A (en) * 2001-08-31 2003-03-12 Nof Corp Thermosetting resin composition, resin cured film and use
JP2003261511A (en) * 2001-12-27 2003-09-19 Merck Patent Gmbh Polymerizable monocyclic compound
JP2008262931A (en) * 2008-08-05 2008-10-30 Toray Ind Inc Paste for buffer layer formation of plasma display panel
JP2009139909A (en) * 2007-08-03 2009-06-25 Tokyo Ohka Kogyo Co Ltd Fluorine-containing compound, resist composition for immersion exposure, and method of forming resist pattern

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984910A (en) * 1982-11-02 1984-05-16 Koichi Hatada Novel copolymer and production thereof
JPS59164501A (en) * 1983-03-09 1984-09-17 Tokuyama Soda Co Ltd Organic optical glass
JPH01168630A (en) * 1987-12-24 1989-07-04 Central Glass Co Ltd Novel fluorine-containing aromatic unsaturated compound and production thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984910A (en) * 1982-11-02 1984-05-16 Koichi Hatada Novel copolymer and production thereof
JPS59164501A (en) * 1983-03-09 1984-09-17 Tokuyama Soda Co Ltd Organic optical glass
JPH01168630A (en) * 1987-12-24 1989-07-04 Central Glass Co Ltd Novel fluorine-containing aromatic unsaturated compound and production thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997003992A1 (en) * 1995-07-14 1997-02-06 Sumitomo Chemical Company, Limited Transition metal complex, process for the preparation thereof, polymerization catalyst for olefins containing the complex, and process for producing olefin polymers
US6329478B1 (en) 1995-07-14 2001-12-11 Sumitmo Chemical Company, Limited Transition metal complex, process for producing the same, olefin polymerization catalyst containing the transition metal complex and process for producing olefin polymers
EP1498178A3 (en) * 1995-07-14 2005-02-09 Sumitomo Chemical Company, Limited Transition metal complex, process for producing the same, olefin polymerization catalyst containing the transition metal complex and process for producing olefin polymers
JP2003073435A (en) * 2001-08-31 2003-03-12 Nof Corp Thermosetting resin composition, resin cured film and use
JP2003261511A (en) * 2001-12-27 2003-09-19 Merck Patent Gmbh Polymerizable monocyclic compound
US7465479B2 (en) * 2001-12-27 2008-12-16 Merck Patent Gesellschaft Mit Beschraenkter Haftung Polymerisable monocyclic compounds
JP4553550B2 (en) * 2001-12-27 2010-09-29 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング Polymerizable monocyclic compounds
JP2009139909A (en) * 2007-08-03 2009-06-25 Tokyo Ohka Kogyo Co Ltd Fluorine-containing compound, resist composition for immersion exposure, and method of forming resist pattern
JP2012255170A (en) * 2007-08-03 2012-12-27 Tokyo Ohka Kogyo Co Ltd Fluorine-containing compound
JP2008262931A (en) * 2008-08-05 2008-10-30 Toray Ind Inc Paste for buffer layer formation of plasma display panel

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