JPH01229068A - Polyester composition curing in high frequency electromagnetic field - Google Patents
Polyester composition curing in high frequency electromagnetic fieldInfo
- Publication number
- JPH01229068A JPH01229068A JP5545288A JP5545288A JPH01229068A JP H01229068 A JPH01229068 A JP H01229068A JP 5545288 A JP5545288 A JP 5545288A JP 5545288 A JP5545288 A JP 5545288A JP H01229068 A JPH01229068 A JP H01229068A
- Authority
- JP
- Japan
- Prior art keywords
- curing
- high frequency
- frequency electromagnetic
- polyester composition
- unsaturated polyester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 13
- 230000005672 electromagnetic field Effects 0.000 title claims abstract description 11
- 229920000728 polyester Polymers 0.000 title claims abstract description 10
- 239000003094 microcapsule Substances 0.000 claims abstract description 12
- 238000009835 boiling Methods 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 7
- 230000005291 magnetic effect Effects 0.000 claims abstract description 5
- 230000005684 electric field Effects 0.000 claims description 7
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract description 15
- 239000002253 acid Substances 0.000 abstract description 10
- 239000003795 chemical substances by application Substances 0.000 abstract description 6
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 5
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 abstract description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 abstract description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000001273 butane Substances 0.000 abstract description 4
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 abstract description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 abstract description 3
- 229910002113 barium titanate Inorganic materials 0.000 abstract description 3
- 230000005294 ferromagnetic effect Effects 0.000 abstract description 3
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 abstract description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 2
- 239000001294 propane Substances 0.000 abstract description 2
- 238000001723 curing Methods 0.000 description 17
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 235000010724 Wisteria floribunda Nutrition 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- -1 L-methylstyrene Chemical compound 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000002510 pyrogen Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- JMWGZSWSTCGVLX-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.CCC(CO)(CO)CO JMWGZSWSTCGVLX-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- LWMIDUUVMLBKQF-UHFFFAOYSA-N 4-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound CC1CC=CC2C(=O)OC(=O)C12 LWMIDUUVMLBKQF-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000012343 cottonseed oil Nutrition 0.000 description 1
- 239000002385 cottonseed oil Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- SGGOJYZMTYGPCH-UHFFFAOYSA-L manganese(2+);naphthalene-2-carboxylate Chemical compound [Mn+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 SGGOJYZMTYGPCH-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は高周波電磁界内硬化型ポリエステル組成物の改
良に関し、詳しくは、特定のマイクロカプセルを混入し
た不飽和ポリエステル樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an improvement in a polyester composition curable within a high frequency electromagnetic field, and more particularly to an unsaturated polyester resin composition mixed with specific microcapsules.
本発明のポリエステル組成物は、特に新らしいタイプの
接着剤、肉Ｎ−注型品、多層含浸積層体などの用途に適
用できる。The polyester compositions of the present invention are particularly applicable to applications such as new types of adhesives, meat N-casting products, multilayer impregnated laminates, etc.
高周波電磁界内でプラスチックを加熱する場合には、電
界場を利用する場合と、電界場を利用する場合が考えら
れる。When heating plastic in a high-frequency electromagnetic field, there are two possible methods: using an electric field or using an electric field.
電界場を利用する場合には、プラスチック自体が誘電体
でかつ、誘電損失係数が大きいことが必要とされ、軟質
塩化ビニル樹脂、ポリウレタンおよびナイロンなどがこ
れに該当し、それ以外のプラスチックは不適当である。When using an electric field, the plastic itself must be dielectric and have a large dielectric loss coefficient; soft vinyl chloride resin, polyurethane, and nylon fall under this category; other plastics are unsuitable. It is.
また、電界場を利用する場合には、プラスチック単独で
は利用できないため、通常プラスチック中に強磁性粒子
（特公昭５３−２１９０３号公報）、導電性金属粉、導
電性繊維（特開昭６０−１３０６６４号公報）あるいは
それらの組合せ（特開昭６２−１３２９８３号公報）な
どを混入することによる磁性体のヒステリシス損や導電
性物質のジュール熱を利用していた。In addition, when using an electric field field, since plastic cannot be used alone, plastics usually include ferromagnetic particles (Japanese Patent Publication No. 53-21903), conductive metal powder, and conductive fibers (Japanese Patent Publication No. 60-130664). The hysteresis loss of the magnetic material and the Joule heat of the conductive material were utilized by mixing the magnetic material (Japanese Patent Application Laid-open No. 132983/1983) or a combination thereof (Japanese Patent Application Laid-open No. 132983/1983).
不飽和ポリエステル樹脂では、電界場での硬化は利用で
きず、また（ｆｆ界場での硬化においては発熱物質を多
量に混入しないと実用上硬化しなく、強度などの物性低
下をまねく結果となる。一方不飽和ポリエステル樹脂組
成物は、不飽和ポリエステル樹脂、硬化剤および硬化促
進剤の組合せによって、長時間ポットライフ高温硬化型
や短時間ポットライフ低温硬化型等使用条件に合せた広
範囲の選択ができる。For unsaturated polyester resins, curing in an electric field cannot be used, and in curing in an ff field, practical curing will not occur unless a large amount of exothermic substance is mixed in, resulting in a decrease in physical properties such as strength. On the other hand, unsaturated polyester resin compositions can be selected from a wide range of options depending on the usage conditions, such as long pot life high temperature curing type and short pot life low temperature curing type, depending on the combination of unsaturated polyester resin, curing agent and curing accelerator. can.
本発明者らは、ポットライフが長くかつ低温硬化が可能
な高周波電磁界内硬化型ポリエステル組成物について鋭
意研究した結果、本発明に至ったものである。The present inventors have arrived at the present invention as a result of intensive research into a high-frequency electromagnetic field curable polyester composition that has a long pot life and can be cured at low temperatures.
本発明は、高周波電磁界内で硬化するポリで発熱する物
質、低沸点液体および硬化促進剤を包含するマイクロカ
プセルを？ｎ 人することを特徴とする。The present invention provides microcapsules containing a polypyrothermic material, a low-boiling liquid, and a curing accelerator that cure in a high-frequency electromagnetic field. It is characterized by doing n people.
以下に本発明における高周波電磁界内で硬化するポリエ
ステル組成物について、詳細に説明する。The polyester composition that cures in a high frequency electromagnetic field in the present invention will be explained in detail below.
ベースとなる不飽和ポリエステル樹脂は、−ｉに公知の
酸成分およびアルコール成分を原料とした不飽和ポリエ
ステル樹脂で特に限定されるものではないが、なかでも
酸価１０〜３０、水酸基価１０〜４０のものが好ましい
。酸成分としては、フマル酸、無水マレイン酸等の不飽
和二塩基酸、無水フタル酸、イソフタル酸、テレフタル
酸、アジピン酸、テトラヒドロ無水フタル酸、３−メチ
ルテトラヒドロ無水フタル酸等の飽和二塩基酸が挙げら
れ、それぞれ単独あるいは任意に混合して用いられる。The base unsaturated polyester resin is not particularly limited to unsaturated polyester resins made from known acid components and alcohol components, but especially those with an acid value of 10 to 30 and a hydroxyl value of 10 to 40. Preferably. As acid components, unsaturated dibasic acids such as fumaric acid and maleic anhydride; saturated dibasic acids such as phthalic anhydride, isophthalic acid, terephthalic acid, adipic acid, tetrahydrophthalic anhydride, and 3-methyltetrahydrophthalic anhydride; These can be used alone or in any combination.
不飽和二塩基酸と飽和二塩基酸の使用比率は等モルもし
くは不飽和二塩基酸が多いことが望ましいが、特に限定
されるものではない。また、アルコール成分としては、
エチレングリコール、プロピレングリコール、ジエチレ
ングリコール、ジプロピレングリコール、１．３−ブチ
レングリコール、ネオペンチルグリコール、１．６−ヘ
キサングリコール、グリセリン、トリメチロールプロパ
ン、ペンタエリスリトール、水添ビスフェノールＡ３ビ
スフエノールＡ・アルキレンオキシド付加物、ジシクロ
ペンタジェン等が挙げられるが、なかでもプロピレング
リコール単独もしくはプロピレングリコールと他のアル
コール成分との混合物が好ましい。不飽和ポリエステル
樹脂は、一般に重合性単量体と混合して使用される。The ratio of the unsaturated dibasic acid and the saturated dibasic acid used is preferably equimolar or a large amount of the unsaturated dibasic acid, but is not particularly limited. In addition, as an alcohol component,
Ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, 1.3-butylene glycol, neopentyl glycol, 1.6-hexane glycol, glycerin, trimethylolpropane, pentaerythritol, hydrogenated bisphenol A3 bisphenol A/alkylene oxide addition Among them, propylene glycol alone or a mixture of propylene glycol and other alcohol components is preferred. Unsaturated polyester resins are generally used in combination with polymerizable monomers.
重合性単量体としては、スチレン、ビニルトルエン、ク
ロロスチレン、Ｌ−メチルスチレン、ジビニルベンゼン
、（メタ）アクリル酸、エステル、グリシジルメタアク
リレート、酢酸ビニル、ジアリルフタレート、トリアリ
ルシアヌレート、トリメチロールプロパントリアクリレ
ート、トリメチロール、プロパントリメタクリレート、
桐油、アマニ油、大豆油、綿実油、やし油などが挙げら
れる。Polymerizable monomers include styrene, vinyltoluene, chlorostyrene, L-methylstyrene, divinylbenzene, (meth)acrylic acid, ester, glycidyl methacrylate, vinyl acetate, diallylphthalate, triallyl cyanurate, trimethylolpropane. triacrylate, trimethylol, propane trimethacrylate,
Examples include tung oil, linseed oil, soybean oil, cottonseed oil, and coconut oil.
硬化剤としては、メチルエチルケトンパーオキサイド、
シクロヘキサノンパーオキサイド、ベンゾイルパーオキ
サイド、ジクミル°パーオキサイド、ｔ−ブチルパーベ
ンゾエート等が挙げられる。As a curing agent, methyl ethyl ketone peroxide,
Examples include cyclohexanone peroxide, benzoyl peroxide, dicumyl peroxide, t-butyl perbenzoate, and the like.
マイクロカプセルに包含される硬化促進剤としては、ナ
フテン酸、コバルト、オクチル酸コバルト、ナフテン酸
マンガンなどが挙げられる。Examples of the curing accelerator included in the microcapsules include naphthenic acid, cobalt, cobalt octylate, manganese naphthenate, and the like.
高周波電界磁界内で、発熱する物質としては、チタン酸
バリウム粉末、ナイロン粉末などの強誘電性物質、含水
酸化鉄、７−ＦｅｚＯ，、、γ−ＦｅｚＯ３、Ｆｅ３Ｏ
４、ｌ’ＩＯ＝ Ｆｅ２Ｏ，（但し、Ｍは２価の金属）
などの強磁性粒子、鉄、ステンレス、銅などの金属粉末
もしくは繊維、ニッケル、銅などをメツキした繊維、カ
ーボン繊維などの導電性繊維等が挙げられる。Substances that generate heat in a high-frequency electric and magnetic field include ferroelectric substances such as barium titanate powder and nylon powder, hydrated iron oxide, 7-FezO, γ-FezO3, and Fe3O.
4, l'IO= Fe2O, (M is a divalent metal)
Examples include ferromagnetic particles such as, metal powders or fibers such as iron, stainless steel, and copper, fibers plated with nickel and copper, and conductive fibers such as carbon fibers.
また、低沸点液体としては、プロパン、ブタン、ペンタ
ン、プロピレン、ブチレンなどが挙げられる。Furthermore, examples of the low boiling point liquid include propane, butane, pentane, propylene, butylene, and the like.
マイクロカプセルの製造方法、混入方法および添加量は
、特に限定されるものではない。The method for producing microcapsules, the method for mixing them, and the amount added are not particularly limited.
なお、硬化剤および硬化促進剤の添加量は、不飽和ポリ
エステル樹脂１００重量部に対して通常０．５〜５重量
部の範囲である。発熱物質および低沸点液体の添加量は
特に限定されず、使用目的に応じて適宜選択される。The amount of the curing agent and curing accelerator added is usually in the range of 0.5 to 5 parts by weight per 100 parts by weight of the unsaturated polyester resin. The amounts of the pyrogen and the low-boiling liquid to be added are not particularly limited, and are appropriately selected depending on the purpose of use.
さらに、不飽和ポリエステル樹脂中に、添加剤として顔
料、充填剤、希釈剤、熱可塑性樹脂などを任意に添加し
てもよい。Furthermore, pigments, fillers, diluents, thermoplastic resins, and the like may be optionally added as additives to the unsaturated polyester resin.
（作用）
高周波電磁界の印加によってマイクロカプセル中の発熱
物質が発熱し、それにより低沸点液体の蒸気圧が上昇す
ることによりマイクロカプセルが破壊される。その破壊
により硬化促進剤が、不飽和ポリエステル樹脂組酸部中
に拡散し、硬化剤との作用により不飽和ポリエステル樹
脂を硬化する。硬化促進剤の拡散により、高周波電磁界
の印加を中止しても硬化反応が継続するために、本発明
のポリエステル組成物は短時間かつ低温で硬化を行なう
ことができる。(Function) Application of a high-frequency electromagnetic field causes the pyrogen in the microcapsules to generate heat, which increases the vapor pressure of the low-boiling liquid and destroys the microcapsules. As a result of the destruction, the curing accelerator diffuses into the acid part of the unsaturated polyester resin, and the unsaturated polyester resin is cured by the action with the curing agent. Due to the diffusion of the curing accelerator, the curing reaction continues even after the application of the high-frequency electromagnetic field is stopped, so that the polyester composition of the present invention can be cured in a short time and at low temperatures.
以下に実施例を示して本発明を説明する。The present invention will be explained below with reference to Examples.
実施例１
γ−Ｆｅｚ０３ 、ブタンおよびナフテン酸コバルトを
包含する平均粒子径１０μのマイクロカフ’ セル２０
重量部を、メチルエチルケトンパーオキサイド１．５重
量部（５５％濃度）を含む不飽和ポリエステル樹脂（昭
和高分子株式会社製、リボラック２１６３−１）１００
重量部に混入し、高周波発振機（富士電波工機株式会社
製、ＦＤＹ−６２０，６にＷ）の磁界内に置いて１分間
印加し、その後室温で３０分間放置したところ、完全に
硬化した。Example 1 Microcuff cell 20 with an average particle size of 10μ containing γ-Fez03, butane and cobalt naphthenate
Unsaturated polyester resin containing 1.5 parts by weight (55% concentration) of methyl ethyl ketone peroxide (Revolac 2163-1, manufactured by Showa Kobunshi Co., Ltd.) 100 parts by weight
It was mixed into the weight part, placed in the magnetic field of a high frequency oscillator (manufactured by Fuji Denpa Koki Co., Ltd., FDY-620, 6 W), and applied for 1 minute, and then left at room temperature for 30 minutes, and was completely cured. .
実施例２
チタン酸バリウム、ブタンおよびナフテン酸コバルトを
包含する平均粒子径１５μのマイクロカプセル２０重量
部を、メチルエチルケトンパーオキサイド１．５重量部
（５５％濃度）を含む不飽和ポリエステル樹脂（昭和高
分子株式会社製、リボラック２１６３−１）１００重量
部に混入し、高周波発振機（冨士電波工機株式会社製、
ＦＤＹ−６２０，６に讐）の電界内に置いて５分間印加
し、その後室温で３０分間放置したところ、完全に硬化
した。Example 2 20 parts by weight of microcapsules containing barium titanate, butane and cobalt naphthenate with an average particle diameter of 15 μm were mixed with unsaturated polyester resin (Showa Kobunshi) containing 1.5 parts by weight (55% concentration) of methyl ethyl ketone peroxide. Co., Ltd., Revolac 2163-1)) was mixed with 100 parts by weight of a high frequency oscillator (Fuji Denpa Koki Co., Ltd.,
FDY-620,6) was placed in an electric field and applied for 5 minutes, and then left at room temperature for 30 minutes, and was completely cured.
なお上記実施例１および２について、それぞれマイクロ
カプセルを混入しない場合には、全く硬化しなかった。Note that in Examples 1 and 2 above, no curing occurred when microcapsules were not mixed.
［発明の効果］
本発明のポリエステル組成物は、高周波電界・磁界内で
発熱する物質、低沸点液体および硬化促進剤を包含する
マイクロカプセルを混入することにより、ポットライフ
が長くかつ低温硬化が可能となり、新らしいタイプの接
着剤、肉厚注型品、多層含浸積層体などの用途にきわめ
て有用である。[Effects of the Invention] The polyester composition of the present invention has a long pot life and can be cured at low temperatures by incorporating microcapsules containing a substance that generates heat in a high-frequency electric/magnetic field, a low-boiling liquid, and a curing accelerator. Therefore, it is extremely useful for applications such as new types of adhesives, thick-walled cast products, and multilayer impregnated laminates.
特殊出願人 冨士高分子株式会社Special applicant: Fuji Polymer Co., Ltd.
Claims (1)
磁界内で発熱する物質、低沸点液体および硬化促進剤を
包含するマイクロカプセルを混入することを特徴とする
高周波電磁界内で硬化するポリエステル組成物。High frequency electric field and
A polyester composition that cures in a high-frequency electromagnetic field, characterized in that it incorporates microcapsules containing a substance that generates heat in a magnetic field, a low-boiling liquid, and a curing accelerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5545288A JPH01229068A (en) | 1988-03-09 | 1988-03-09 | Polyester composition curing in high frequency electromagnetic field |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5545288A JPH01229068A (en) | 1988-03-09 | 1988-03-09 | Polyester composition curing in high frequency electromagnetic field |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01229068A true JPH01229068A (en) | 1989-09-12 |
Family
ID=12998994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5545288A Pending JPH01229068A (en) | 1988-03-09 | 1988-03-09 | Polyester composition curing in high frequency electromagnetic field |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01229068A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008129749A1 (en) * | 2007-04-05 | 2008-10-30 | Kokuyo Co., Ltd. | Adhesive material, coating device for adhesive material and transfer sheet |
-
1988
- 1988-03-09 JP JP5545288A patent/JPH01229068A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008129749A1 (en) * | 2007-04-05 | 2008-10-30 | Kokuyo Co., Ltd. | Adhesive material, coating device for adhesive material and transfer sheet |
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