JPH01225195A - Reflowing method for printed board - Google Patents
Reflowing method for printed boardInfo
- Publication number
- JPH01225195A JPH01225195A JP4959088A JP4959088A JPH01225195A JP H01225195 A JPH01225195 A JP H01225195A JP 4959088 A JP4959088 A JP 4959088A JP 4959088 A JP4959088 A JP 4959088A JP H01225195 A JPH01225195 A JP H01225195A
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- printed circuit
- circuit board
- reflow
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 18
- 229910000679 solder Inorganic materials 0.000 claims abstract description 46
- 239000006071 cream Substances 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 8
- 238000007639 printing Methods 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000002904 solvent Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 230000035939 shock Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
本発明はプリント基板に塗布したクリームはんだを加熱
溶融してはんだ付けするリフロー方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a reflow method for soldering by heating and melting cream solder applied to a printed circuit board.
クリームはんだを印刷塗布したプリント基板の加熱装置
としては、トンネル内に赤外線ヒータや熱風吹出装置を
備えたりフロー炉、レーザや赤外線を集光して照射する
熱線照射装置、高沸点溶剤を気化させた蒸気槽等である
が、リフロー炉以外の加熱装置は急加熱となるため、プ
リント基板や電子部品にヒートショックを与え、プリン
ト基板を熱損傷させたり電子部品の機能を劣化させるば
かりでなく、クリームはんだ中のフラックスを突沸させ
てクリームはんだを不必要な箇所に飛散させたり、或い
は電子部品が立ち上るマンハッタン現象を起こさせてし
まうものである。しかるにリフロー炉は予備加熱と本加
熱が連続して行えることから他の加熱装置のような問題
を起こすことが少なく、クリームはんだを塗布したプリ
ント基板のりフローには最適なものと言える。Heating devices for printed circuit boards printed with cream solder include infrared heaters and hot air blowing devices installed in tunnels, flow furnaces, heat irradiation devices that converge and irradiate lasers or infrared rays, and devices that vaporize high-boiling point solvents. Heating equipment other than reflow ovens, such as steam tanks, heats up rapidly, which can cause heat shock to printed circuit boards and electronic components, causing thermal damage to printed circuit boards and deteriorating the functionality of electronic components. This causes the flux in the solder to boil, causing the cream solder to scatter to unnecessary locations, or causing the Manhattan phenomenon in which electronic components stand up. However, since reflow ovens can perform preheating and main heating in succession, they are less likely to cause the problems that other heating devices do, and can be said to be optimal for bond flow of printed circuit boards coated with cream solder.
従来のリフロー方法はプリント基板をリフロー炉内に挿
入後、直ぐにプリント基板のはんだ付け部を１５０℃位
の温度に昇温させ、該温度で一定時間予備加熱後、クリ
ームはんだの溶融する温度（クリームはんだ中の粉末は
んだが６３Ｓ’ｎ−Ｐｂであれば約２００℃）まで昇温
さ仕る本加熱を行い、その後、冷風で冷却していたもの
である。つまり、従来のリフロー方法に用いられていた
りフロー炉の温度プロファイル（プリント基板のはんだ
付け部における温度変化）は第２図に示すように平行状
態の予備加熱（約１５０℃）に続いて山形の本加熱（約
２００℃）となっていた。In the conventional reflow method, after inserting a printed circuit board into a reflow oven, the soldered parts of the printed circuit board are immediately heated to a temperature of about 150°C, and after preheating at that temperature for a certain period of time, the temperature at which cream solder melts (cream solder melts) is increased. If the solder powder in the solder was 63S'n-Pb, main heating was performed to raise the temperature to approximately 200° C.), and then cooling was performed with cold air. In other words, the temperature profile (temperature change at the soldering part of a printed circuit board) of a flow furnace used in the conventional reflow method is as shown in Fig. Main heating (approximately 200°C) was performed.
ところで第２図に示すようなプロファイルを有するリフ
ロー炉で加熱する従来のリフロー方法ではプリント基板
に印刷塗布したクリームはんだの形状が崩れ、クリーム
はんだが所定のはんだ付け部以外に広がってしまうとい
う′”ダレ”を起こすことがあった。クリームはんだが
ダレを起こすと隣接したはんだ付け部に塗布したクリー
ムはんだ同志が合流し、そのまま溶融・凝固してブリッ
ヂを形成することがある。電子機器では一箇所でもブリ
ッヂを形成すると電子機器としての機能が全く損なわれ
てしまうものである。By the way, in the conventional reflow method, which involves heating in a reflow oven with the profile shown in Figure 2, the shape of the cream solder printed and applied on the printed circuit board collapses, and the cream solder spreads beyond the designated soldering areas. Sometimes it caused "sagging". When the cream solder sag, the cream solder applied to adjacent soldering parts may join together and melt and solidify to form a bridge. If a bridge is formed at even one place in an electronic device, the function of the electronic device will be completely impaired.
本発明はプリント基板に塗布したクリームはんだのりフ
ロー時、クリームはんだがダレを起こさないリフロ一方
法を提供することにある。An object of the present invention is to provide a reflow method that does not cause dripping of cream solder applied to a printed circuit board during flow.
本発明者らが従来のリフロー方法におけるクリームはん
だのダレの状態について観察したところ、予報加熱の段
階でダレの起こることが分かった。つまり、クリームは
んだのフラックスは松脂のような非晶質の材料を溶剤で
溶解したものであるため、クリームはんだは常温では成
る程度の粘度があり、印刷塗布形状を保っていられるが
、予備加熱で加熱が行われるとフラックスの粘度が下が
って流動してしまうものである。従って、初めからフラ
ックス中の液体成分である溶剤が少なければ予備加熱時
点で粘度が下がらずクリームはんだのダレも起こりにく
くなるが、溶剤が少ないと粘度が高くなるため、印刷塗
布性が極めて悪くなってしまう。When the present inventors observed the state of cream solder sag in the conventional reflow method, it was found that sag occurs during the preliminary heating stage. In other words, the flux of cream solder is made by dissolving an amorphous material such as pine resin in a solvent, so cream solder has a certain viscosity at room temperature and can maintain its printed and applied shape, but it cannot be heated without preheating. When heated, the viscosity of the flux decreases and it becomes fluid. Therefore, if the amount of solvent, which is a liquid component in the flux, is small from the beginning, the viscosity will not decrease during preheating and the cream solder will not sag, but if the amount of solvent is small, the viscosity will increase, resulting in extremely poor printing applicability. It ends up.
それ故、クリームはんだとしては印刷塗布時に所定の粘
度があり、予備加熱で適当に溶剤が蒸発してダレを起こ
さないものが良く、本発明出願人は斯様なりリームはん
だを既に提案してきたく特願昭６３− 号）。該ク
リームはんだは蒸気圧の高い溶剤と低い溶剤を二種以上
混合したもので、予備加熱の段階で蒸気圧の高い溶剤を
蒸発させることによりダレを防ごうとするものである。Therefore, it is preferable that the cream solder has a predetermined viscosity when applied by printing, and that the solvent does not evaporate properly during preheating and does not cause sag.The applicant of the present invention has already proposed such a cream solder. Gansho 63- No.). The cream solder is a mixture of two or more solvents, one with a high vapor pressure and one with a low vapor pressure, and is intended to prevent sag by evaporating the solvent with a high vapor pressure during the preheating stage.
しかるに、本発明者らは更にクリームはんだのダレ防止
をリフロ一方法でも解決しようと試みた次第である。However, the inventors of the present invention have further attempted to solve the problem of preventing cream solder from dripping using a reflow method.
従来のリフロー方法およびリフロー炉では、プリント基
板をリフロー炉に挿入後、プリント基板のはんだ付け部
の温度が直ぐに１５０℃位になるように予備加熱を行っ
ていたものであるが、この様な加熱ではクリームはんだ
中の溶剤が蒸発する前にクリームはんだが軟化してダし
てしまう。In conventional reflow methods and reflow ovens, after inserting a printed circuit board into the reflow oven, preheating is performed so that the temperature of the soldered portion of the printed circuit board reaches approximately 150°C. Then, the cream solder softens and dries before the solvent in the cream evaporates.
本発明者らは低い温度で予備加熱するとクリームはんだ
がダレを起こさず溶剤が蒸発しやすくなることを見い出
し本発明を完成させた。The present inventors have completed the present invention by discovering that when preheated at a low temperature, cream solder does not sag and the solvent evaporates easily.
本発明は、クリームはんだが塗布されたプリント基板を
リフロー炉で加熱してはんだ付けを行うプリント基板の
リフロー方法において、クリームはんだが塗布されたプ
リント基板のはんだ付け部を７０〜１００℃で一定時間
一次予備加熱を行い、さらに１２０〜１６０℃で一定時
間二次予備加熱を行った後、クリームはんだを溶融させ
る本加熱を行うことを特徴とするプリント基板のリフロ
ー方法である。The present invention is a printed circuit board reflow method in which a printed circuit board coated with cream solder is heated in a reflow oven for soldering, and the soldering portion of a printed circuit board coated with cream solder is heated at 70 to 100°C for a certain period of time. This is a printed circuit board reflow method characterized by performing primary preheating, further performing secondary preheating at 120 to 160° C. for a certain period of time, and then performing main heating to melt cream solder.
本発明プリント基板のリフロー方法では、−次子偏加熱
が７０℃よりも低いとクリームはんだ中の溶剤の蒸発が
遅く、しかるに１００℃を越えると該溶剤の蒸発よりも
クリームはんだの軟化が早くなってクリームはんだがダ
してしまう。In the reflow method for printed circuit boards of the present invention, when the uneven heating is lower than 70°C, the solvent in the cream solder evaporates slowly, but when it exceeds 100°C, the cream solder softens faster than the evaporation of the solvent. The cream solder will come off.
一次予備加熱よりも高い温度の二次子倫加熱は、プリン
ト基板をはんだ付け温度に近づけて、クリームはんだの
はんだ付け性を良好にするとともに、プリント基板や電
子部品を高い温度の本加熱からのヒートショックを和ら
げるために行うもので、これが１２０℃よりも低いとは
んだ付け性に寄与しないばかりかヒートショックを和ら
げる効果も少ない。Secondary heating, which is at a higher temperature than primary preheating, brings the printed circuit board closer to the soldering temperature and improves the solderability of cream solder. This is done to relieve heat shock, and if it is lower than 120°C, not only will it not contribute to solderability, but it will also have little effect in alleviating heat shock.
また二次予備加熱が１６０℃よりも高いと、プリント基
板や電子部品の高温にさらされる時間（本加熱時間＋高
温予備加熱時間）が長くなって好ましくない。Further, if the secondary preheating is higher than 160° C., the time during which the printed circuit board or electronic component is exposed to high temperature (main heating time + high temperature preheating time) becomes long, which is not preferable.
下記のりフロー炉、プリント基板、印刷冶具、クリーム
はんだを用い、実施例、比較例におけるリフロ一方法の
実験を行った。Experiments were conducted on a reflow method in Examples and Comparative Examples using the following glue flow furnace, printed circuit board, printing jig, and cream solder.
○リフロー炉：トンネルの上下に多数の赤外線ヒータが
設置されていて、それぞれの赤外線ヒータは温度調整が
可能となフている。○Reflow oven: There are many infrared heaters installed above and below the tunnel, and the temperature of each infrared heater can be adjusted.
Ｏプリント基板：ピッチ間隔が０．６ｍｍとなっている
１００ビンのＱＦＰを搭載するためのランドが設置され
たセラミック製基板Ｏ印刷治具：前記１００ビンのＱＦ
Ｐのランドと同位置に０．３ Ｘ １ （ｍｎ＋）の矩
形の孔が穿設された０、２ ｍｍ厚のメタルマスク。O Printed circuit board: Ceramic substrate equipped with a land for mounting 100 bins of QFP with a pitch interval of 0.6 mm O Printing jig: Said 100 bins of QF
A 0.2 mm thick metal mask with a 0.3 x 1 (mn+) rectangular hole drilled at the same position as the P land.
○クリームはんだニ一般に市販のクリームはんだ（千住
金属工業株式会社製５ＰＴ−６０−６３、Ｆ−１０％）
実施例
リフロー炉を第１図に示すようなプロファイルが得られ
るように調整してクリームはんだのりフローを行った。○Cream solder - Commercially available cream solder (5PT-60-63, F-10% manufactured by Senju Metal Industry Co., Ltd.) Example: Adjust the reflow oven to obtain the profile shown in Figure 1 and use the cream solder. I did Nori Flow.
比較例
リフローを第２図に示すような従来のりフロ一方法に用
いられていたプロファイルに調整してクリームはんだの
りフローを行った。Comparative Example Cream solder paste flow was performed by adjusting the reflow profile to the profile used in the conventional solder flow method as shown in FIG.
実験結果
実施例ではブリッヂの形成は皆無であったが比較例では
ブリッヂが多数発生していた。As a result of the experiment, no bridges were formed in the example, but many bridges were formed in the comparative example.
本発明によればプリント基板に印刷塗布したクリームは
んだがダレないため、リフロー後のプリント基板にはブ
リッヂの発生も無くなり、信頼あるはんだ付け部が得ら
れる。According to the present invention, since the cream solder printed and applied to the printed circuit board does not sag, there is no occurrence of bridges on the printed circuit board after reflow, and reliable soldered parts can be obtained.
第１図は本発明のリフロー方法におけるリフロー炉の温
度プロファイル、第２図は従来のリフロー方法における
リフロー炉の温度プロファイルである。FIG. 1 shows a temperature profile of a reflow oven in the reflow method of the present invention, and FIG. 2 shows a temperature profile of a reflow oven in a conventional reflow method.
Claims (1)
炉で加熱してはんだ付けを行うプリント基板のリフロー
方法において、クリームはんだが塗布されたプリント基
板のはんだ付け部を７０〜１００℃で一定時間一次予備
加熱を行い、さらに１２０〜１６０℃で一定時間二次予
備加熱を行った後、クリームはんだを溶融させる本加熱
を行うことを特徴とするプリント基板のリフロー方法。In the printed circuit board reflow method, in which a printed circuit board coated with cream solder is soldered by heating it in a reflow oven, the soldering portion of the printed circuit board coated with cream solder is first preheated at 70 to 100°C for a certain period of time. A reflow method for a printed circuit board, which comprises performing secondary preheating at 120 to 160° C. for a certain period of time, and then performing main heating to melt the cream solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63049590A JP2665926B2 (en) | 1988-03-04 | 1988-03-04 | Printed circuit board reflow method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63049590A JP2665926B2 (en) | 1988-03-04 | 1988-03-04 | Printed circuit board reflow method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01225195A true JPH01225195A (en) | 1989-09-08 |
| JP2665926B2 JP2665926B2 (en) | 1997-10-22 |
Family
ID=12835445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63049590A Expired - Lifetime JP2665926B2 (en) | 1988-03-04 | 1988-03-04 | Printed circuit board reflow method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2665926B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04253564A (en) * | 1991-02-04 | 1992-09-09 | Matsushita Electric Ind Co Ltd | Local soldering method by light beam or the like |
| JPH0621636A (en) * | 1992-07-03 | 1994-01-28 | Fujitsu Ltd | Soldering of electronic circuit part to board |
| JPH0697644A (en) * | 1992-09-14 | 1994-04-08 | Melco:Kk | Reflow furnace for cream solder fusion bonding and solder fusion bonding method using cream solder |
| US5413164A (en) * | 1990-08-30 | 1995-05-09 | Fujitsu Limited | Heating furnace in combination with electronic circuit modules |
| GB2401338A (en) * | 2003-05-07 | 2004-11-10 | Visteon Global Tech Inc | Solder reflow system and method with at least two preheating levels |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56167395A (en) * | 1980-05-27 | 1981-12-23 | Mitsubishi Electric Corp | Method of mounting part on circuit board |
| JPS5730398A (en) * | 1980-07-30 | 1982-02-18 | Hitachi Ltd | Soldering device |
-
1988
- 1988-03-04 JP JP63049590A patent/JP2665926B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56167395A (en) * | 1980-05-27 | 1981-12-23 | Mitsubishi Electric Corp | Method of mounting part on circuit board |
| JPS5730398A (en) * | 1980-07-30 | 1982-02-18 | Hitachi Ltd | Soldering device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5413164A (en) * | 1990-08-30 | 1995-05-09 | Fujitsu Limited | Heating furnace in combination with electronic circuit modules |
| JPH04253564A (en) * | 1991-02-04 | 1992-09-09 | Matsushita Electric Ind Co Ltd | Local soldering method by light beam or the like |
| JPH0621636A (en) * | 1992-07-03 | 1994-01-28 | Fujitsu Ltd | Soldering of electronic circuit part to board |
| JPH0697644A (en) * | 1992-09-14 | 1994-04-08 | Melco:Kk | Reflow furnace for cream solder fusion bonding and solder fusion bonding method using cream solder |
| GB2401338A (en) * | 2003-05-07 | 2004-11-10 | Visteon Global Tech Inc | Solder reflow system and method with at least two preheating levels |
| GB2401338B (en) * | 2003-05-07 | 2005-07-20 | Visteon Global Tech Inc | Vector transient reflow of solder for controlling substrate warpage |
| US7026582B2 (en) | 2003-05-07 | 2006-04-11 | Visteon Global Technologies, Inc. | Vector transient reflow of lead free solder for controlling substrate warpage |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2665926B2 (en) | 1997-10-22 |
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