JPH01200093A - Electronic equipment casing body - Google Patents
Electronic equipment casing bodyInfo
- Publication number
- JPH01200093A JPH01200093A JP2381888A JP2381888A JPH01200093A JP H01200093 A JPH01200093 A JP H01200093A JP 2381888 A JP2381888 A JP 2381888A JP 2381888 A JP2381888 A JP 2381888A JP H01200093 A JPH01200093 A JP H01200093A
- Authority
- JP
- Japan
- Prior art keywords
- fan
- diameter
- axial flow
- electronic device
- obstacle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
(産業上の利用分野)
本発明は、内部を効率良く冷却できる電子機器筐体に関
する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an electronic device housing whose interior can be efficiently cooled.
(従来の技術)
電子機器筐体の冷却用に小形軸流ファンを良く用いるが
、この小形軸流ファンは、取付ける位置で電子機器筐体
を設置する場所でファン性能が変化してくることが分っ
ている。従来これを定母的に示したものはほとんどない
が、第S図に本発明者等が実験を行なった小形軸流ファ
ン性能の吐出し口と吸込み口に障害物を置いた場合の性
能の一例を示す。ファンと障害物の距離りを小さくして
いくとファンの風mQLが小さくなっているのがわかる
。(Prior art) Small axial fans are often used to cool electronic equipment casings, but the fan performance of these small axial fans may change depending on the installation location of the electronic equipment casing. I understand. Although there is almost no standard representation of this in the past, Figure S shows the performance of a small axial fan in which the inventors conducted experiments when obstacles were placed at the outlet and suction ports. An example is shown. It can be seen that as the distance between the fan and the obstacle decreases, the fan wind mQL decreases.
このように、ファンを取付ける位置もしくは、流れを妨
げる位置に障害物がある場合、所定のファン性能が出せ
なくなる恐れがあった。そのためファンの大型化、騒音
の増大、冷却性能の悪化等の種々の問題があった。As described above, if there is an obstacle at the location where the fan is installed or the location where the flow is obstructed, there is a risk that the fan will not be able to achieve the desired performance. As a result, there have been various problems such as an increase in the size of the fan, an increase in noise, and a deterioration in cooling performance.
(発明が解決しようとする課題)
本発明の目的は、電子機器筐体の冷却に用いる小形軸流
ファンの性能を、必要以上に低下させないようにして冷
却性能が良好な電子機器筐体を提供することである。(Problems to be Solved by the Invention) An object of the present invention is to provide an electronic device casing with good cooling performance without unnecessarily reducing the performance of a small axial fan used for cooling the electronic device casing. It is to be.
(発明の構成〕
(課題を解決するための手段)
本発明においては、内部に電子部品を搭載し、この電子
部品を冷却するための軸流ファンを備えた電子機器筐体
において、軸流ファンの吐出口及び吸込口と軸流ファン
の空気の流れを妨げる障害物との隙間りが下記の式を満
足するように設定される。(Structure of the Invention) (Means for Solving the Problems) In the present invention, an axial flow fan is provided in an electronic device housing having an electronic component mounted therein and equipped with an axial flow fan for cooling the electronic component. The gaps between the discharge port and suction port of the axial fan and an obstacle that obstructs the air flow of the axial fan are set so as to satisfy the following formula.
L > 0.6x (D−d ) または 1 >’ 0.6X 2 H ただし、 D:ファン直径 d:ファンのモータ直径 H:ファン羽根長さ (作 用) 第4図は本発明者等が行なった種々の実験結果を示す。L > 0.6x (D-d) or 1>’0.6X 2H however, D: Fan diameter d: Fan motor diameter H: Fan blade length (for production) FIG. 4 shows the results of various experiments conducted by the inventors.
第4図は流量比A(小形軸流ファンと障害物との距離が
Lの時の流mQL/最大流ff1Q)と無次元数K(小
形軸流ファンと障害物の距離L/(〕〕7ン直径D−モ
ータ直径dはL/ (2x (ファンの羽根長ざI」)
)の関係を示す。第4図において、○、・、QSのは、
ファン直径りが116#で種々の性能(例えば回転数可
変)を持ったもの、Δ、ム、ムは、ファン直径りが86
inで種々の性能を持ったもの、口は、ファン直径りが
76履で1種類である。モータ直径dは、いずれも60
Mである。Figure 4 shows the flow rate ratio A (flow mQL/maximum flow ff1Q when the distance between the small axial fan and the obstacle is L) and the dimensionless number K (distance L/() between the small axial fan and the obstacle) 7 fan diameter D - motor diameter d is L/ (2x (fan blade length I)
). In Figure 4, ○,・,QS is
The fan diameter is 116# and has various performances (for example, variable rotation speed), Δ, Mu, and Mu are 86mm in fan diameter.
There is one type of inlet with various performances, and the fan diameter is 76 mm. The motor diameter d is 60 in both cases.
It is M.
第4図の結果から、無次元数Kが0.4〜0.6で、流
量比Aが急激に変化するのがわかる。逆に無次元数に=
0.6以上で小形軸流ファンを使用すれば、流量比が8
0%以上を常に確保出来るのがわかる。From the results in FIG. 4, it can be seen that the flow rate ratio A changes rapidly when the dimensionless number K is 0.4 to 0.6. Conversely, to a dimensionless number =
If you use a small axial fan with a flow rate of 0.6 or higher, the flow rate will be 8.
It can be seen that it is possible to always secure 0% or more.
よってこの実験結果から、本発明では、電子機器筐体を
設置あるいは設計する場合にファンの吐出口及び吸入口
と電子部品や壁等の障害物との隙間りを1 > 0.6
X (ファン直径D−モータ直径d)若しくはL >
0.6X (2x (ファン羽根長さ櫓))に設定して
おCプば流量比Aを80%以上とすることができる。Therefore, from this experimental result, in the present invention, when installing or designing an electronic device housing, the gap between the fan outlet and intake port and electronic components or obstacles such as walls should be set to 1 > 0.6.
X (fan diameter D - motor diameter d) or L >
By setting C to 0.6X (2x (fan blade length turret)), the flow rate ratio A can be increased to 80% or more.
このように電子機器筐体の冷却に小形軸流ファンを用い
た設計を行なう場合、無次元数にと流量比Aの関係を用
いれば、小形軸流ファンの取付は位置者えず、電子機器
筐体内の温度が高ければ、高価で大きなファンを用いる
など無駄なコスト、スペースがかかることなく小さなフ
ァンで効率のよい冷却ができるようになる。同様に、電
子機器筐体を壁につけて設置する際に、壁によって冷却
性能が低下することがなく信頼性の高い電子機器を提供
できるものである。In this way, when designing a small axial fan to cool an electronic device case, using the relationship between the dimensionless number and the flow rate ratio A, it is possible to install the small axial fan in the same position as the electronic device. If the temperature inside the housing is high, efficient cooling can be achieved with a small fan, without the need for unnecessary costs and space such as using large, expensive fans. Similarly, when an electronic device housing is installed against a wall, the cooling performance is not degraded by the wall, making it possible to provide a highly reliable electronic device.
(実施例)
第1図に電子機器筐体内に支持棒を設けた場合の実施例
を示す。図中1はファン、2は筐体、3は電子機器部品
、4は長さL > 0.6X (ファン直径D−モータ
直径d)又はL> 0.6x (2X (ファン羽根長
ざ1]))を持つ支持棒である。同じく、第2図には、
電子機器筐体の外に支持棒を設けた場合の実施例を示す
。図中1はファン、2は筐体、5は電子機器を設置する
場所の壁、4は長さし〉0.6x (ファン直径D−モ
ータ直径d)又はL〉0.6x (2X (ファン羽根
長ざ]」))を持つ支持棒である。この支持棒4はとく
に外壁に筐体を支持する際に有効でおる。このようにす
るとファン性能を80%以上にかならず確保することが
でき、小さなファンで効率良く設計でき、かつ、信頼性
の高い製品ができる。尚、言うまでもなく、支持棒4は
、ファンからの流れを妨げない構造であればどのような
形をしていてもかまわない。(Example) FIG. 1 shows an example in which a support rod is provided inside an electronic device housing. In the figure, 1 is a fan, 2 is a housing, 3 is an electronic device component, and 4 is a length L > 0.6X (fan diameter D - motor diameter d) or L > 0.6x (2X (fan blade length 1) )) is a supporting rod. Similarly, in Figure 2,
An example is shown in which a support rod is provided outside the electronic device housing. In the figure, 1 is the fan, 2 is the housing, 5 is the wall where electronic equipment is installed, and 4 is the length〉0.6x (fan diameter D - motor diameter d) or L〉0.6x (2X (fan diameter It is a support rod with a long blade length. This support rod 4 is particularly effective when supporting the housing on the outer wall. In this way, the fan performance can be guaranteed to be 80% or more, and a small fan can be efficiently designed and a highly reliable product can be produced. Needless to say, the support rod 4 may have any shape as long as it does not obstruct the flow from the fan.
また、第3図に示すように必ずしも支持棒を設ける必要
はなく、ファン1と電子機器部品3との隙間りを前述と
同様にL> 0.6X (2X (ファンの羽根長さl
−1))に設定すればファン性能を80%以上に保持す
ることができ前述と同様な作用効果を得ることができる
。Further, as shown in Fig. 3, it is not necessary to provide a support rod, and the gap between the fan 1 and the electronic device component 3 should be set as L > 0.6X (2X (fan blade length l) as described above.
-1)), the fan performance can be maintained at 80% or more and the same effects as described above can be obtained.
本発明によれば、電子機器筐体の冷却に軸流ファンを用
いた設計を行う場合、ファンと障害物との距離りを=
0.6X (ファン直径D−モータ直径d)以上保持し
て配置すれば、流量比A(長さしの時の流mQL/最大
ff1Q)が80%以上得ることができ、確実な冷却設
計ができるようになる。同様に、長ざL支持棒を用いれ
ば電子機器筐体を壁につけて設置する際に、壁によって
冷却性能が低下することがなく信頼性の高い電子機器を
提供できるものである。According to the present invention, when designing an axial fan to cool an electronic device case, the distance between the fan and an obstacle is
If the arrangement is maintained at 0.6X (fan diameter D - motor diameter d) or more, the flow rate ratio A (flow at length mQL/maximum ff1Q) can be obtained at 80% or more, and a reliable cooling design can be achieved. become able to. Similarly, if the length L support rod is used, when the electronic device housing is installed against a wall, the cooling performance will not be degraded by the wall, and a highly reliable electronic device can be provided.
第1図乃至第3図は、本発明の電子機器筐体の実施例を
示すための断面図、第4図は、本発明の原理を示すため
の流量比Aと無次元数にの関係図、第5図は、ファン性
能に対する障害壁の影響を示す関係図である。
1・・・軸流ファン
2・・・筐体
3・・・電子機器部品(障害物)
4・・・支持棒
5・・・壁(障害物)
代理人 弁理士 則 近 憲 佑
同 松山光速
月 2 区
〈−m−
第 3 ヌ1 to 3 are cross-sectional views showing embodiments of the electronic device casing of the present invention, and FIG. 4 is a relationship diagram between the flow rate ratio A and a dimensionless number to show the principle of the present invention. , FIG. 5 is a relationship diagram showing the influence of obstruction walls on fan performance. 1... Axial flow fan 2... Housing 3... Electronic device parts (obstacle) 4... Support rod 5... Wall (obstacle) Agent Patent attorney Noriyuki Ken Yudo Matsuyama Kosoku Month 2 ward〈-m- 3rd nu
Claims (1)
めの軸流ファンを備えた電子機器筐体において、前記軸
流ファンの吐出口及び吸込口と前記軸流ファンの空気の
流れを妨げる障害物との距離Lが下記式を満足するよう
に設定されることを特徴とする電子機器筐体。 L>0.6×(D−d) または L>0.6×2H ただし、 D:ファン直径 d:ファンのモータ直径 H:ファン羽根長さ[Scope of Claims] In an electronic device housing that has an electronic component mounted therein and is equipped with an axial fan for cooling the electronic component, the axial fan has a discharge port and a suction port, and the axial fan has a discharge port and a suction port. An electronic device housing characterized in that a distance L from an obstacle that obstructs air flow is set so as to satisfy the following formula. L>0.6×(D-d) or L>0.6×2H However, D: Fan diameter d: Fan motor diameter H: Fan blade length
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2381888A JPH01200093A (en) | 1988-02-05 | 1988-02-05 | Electronic equipment casing body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2381888A JPH01200093A (en) | 1988-02-05 | 1988-02-05 | Electronic equipment casing body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01200093A true JPH01200093A (en) | 1989-08-11 |
Family
ID=12120934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2381888A Pending JPH01200093A (en) | 1988-02-05 | 1988-02-05 | Electronic equipment casing body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01200093A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7633751B2 (en) | 2005-10-07 | 2009-12-15 | Fujitsu Limited | Electronic apparatus |
-
1988
- 1988-02-05 JP JP2381888A patent/JPH01200093A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7633751B2 (en) | 2005-10-07 | 2009-12-15 | Fujitsu Limited | Electronic apparatus |
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