JPH01188546A - Vinyl chloride resin composition - Google Patents
Vinyl chloride resin compositionInfo
- Publication number
- JPH01188546A JPH01188546A JP1153888A JP1153888A JPH01188546A JP H01188546 A JPH01188546 A JP H01188546A JP 1153888 A JP1153888 A JP 1153888A JP 1153888 A JP1153888 A JP 1153888A JP H01188546 A JPH01188546 A JP H01188546A
- Authority
- JP
- Japan
- Prior art keywords
- vinyl chloride
- chloride resin
- weight
- resin
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 239000011342 resin composition Substances 0.000 title claims description 19
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 229920006026 co-polymeric resin Polymers 0.000 claims abstract description 15
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 13
- 239000000057 synthetic resin Substances 0.000 claims abstract description 13
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 9
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 9
- 239000004014 plasticizer Substances 0.000 claims abstract description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims abstract description 3
- 239000000945 filler Substances 0.000 claims abstract description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 3
- 239000003381 stabilizer Substances 0.000 claims abstract description 3
- -1 acrylic ester Chemical class 0.000 claims description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 15
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 6
- 238000002156 mixing Methods 0.000 abstract 2
- 238000006116 polymerization reaction Methods 0.000 description 20
- 239000004800 polyvinyl chloride Substances 0.000 description 9
- 229920000915 polyvinyl chloride Polymers 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000002605 large molecules Chemical class 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
【産業上の利用分野）
本発明は、電線等の被覆材として用いられる熱可塑性樹
脂組成物に係り、特に通電による自己発熱が主要因であ
る高温状態で当該電線等に外的加重（外的負荷、例えば
自重等）が加わった場合であっても、電線等の被覆材に
生じる熱変形量を小さく、すなわち、耐加熱変形性を向
上することのできる塩化ビニル樹脂組成物に関する。
［従来の技術］
近年、優れた合成樹脂が安価に作られるようになり、今
まで金属で外装をしていたものを合成樹脂で外装したも
のが多くなってきている。このような合成樹脂は、高熱
が加えられると原形を留めず溶解し出したり、溶解しな
いまでも熱変形をきたすという問題を有している。この
ような合成樹脂が、絶縁電線に用いられている。このよ
うな絶縁材の使用目的は、導体などから電気的に絶縁す
るだけでなく、構造材としての目的を兼ねている場合が
多い。したがって、絶縁材料としては、絶縁抵抗・絶縁
耐力・誘電率・誘電体力率などの電気的特性のほか、材
料力学的な強さや耐熱性、加工のし易さ、価格などが選
択の重要な基準となっている。このような電線の絶縁に
使用される合成樹脂は、コストが低く、施工時の端末処
理作業がやり易いところから、熱可塑性合成樹脂、主と
してポリ塩化ビニル樹脂電線が用いられている。このポ
リ塩化ビニル樹脂は、軟質ポリ塩化ビニル（可塑剤が５
０％以下のもの）が、機械的にもかなり強く難燃性で、
耐薬品性・電気特性が良く、着色も自由で機械加工も良
いところから用いられている。
このような従来より用いられている熱可塑性合成樹脂で
あるポリ塩化ビニル樹脂電線は、主に通電中の導体発熱
により被覆材の温度が上昇することにより軟化し、加圧
や自重などにより変形するものであり、この熱変形によ
って電線等の被覆材が破損し、絶縁破壊や甚だしいとき
には漏電を招くことが有るところから、その被覆材の耐
加熱変形性が高いことが要求される。この耐加熱変形性
の向上は、従来、通常の平均重合度（１０００〜１３０
０）に比してより高い平均重合度（１８００以上）のポ
リ塩化ビニル樹脂を用いることによってなされている。
一般に高分子化合物は、その基本となる分子が数多く結
合して巨大分子を作っているのであって、不飽和化合物
である単量体が基本分子となって結合する重合では、単
量体の不飽和帯が加圧、加熱あるいは光、酸、アルカリ
などの適当な触媒の下で開いて結鎖反応を起こし、鎖状
の巨大分子を形成することとなる。このように重合反応
によって結合する単重体の結合数によって重合度は示さ
れている。この平均重合度の高い（１８００以上）塩化
ビニル樹脂が耐加熱変形性を向上させるために用いられ
る。このように平均重合度の高い（１８００以上）塩化
ビニル樹脂を用いるのは、流動開始温度と分解開始温度
の間の流動温度域が狭いため、それだけ高温加熱状態で
外的ストレスが加わっても変形しにくく、原形を保持し
易いからである。
［発明が解決しようとする課題］
しかしながら、従来のように耐加熱変形性を向上させる
ために平均重合度の高い（１８００以上）塩化ビニル樹
脂を用いると、電線等の被覆材である塩化ビニル樹脂自
体の溶融温度が従来の平均重合度（１０００〜１３００
）の塩化ビニル樹脂よりも上昇し、押出し機で溶融押
出して製造加工する際、通常に比べ高い熱量（高い加工
温度）を塩化ビニル樹脂自体に加える必要がある。しか
し、塩化ビニル樹脂に高い熱量（高い加工温度）を加え
ると、塩化ビニル樹脂組成物が熱分解を起してしまい、
電線等に被覆する加工作業が難しいという問題点を有し
ている。
＝４−
また、従来のように耐加熱変形性を向上させるために平
均重合度の高い（１８００以上）塩化ビニル樹脂を用い
ると、電線等の被覆材である塩化ビニル樹脂自体の硬度
が増し、電線等に押出し機を用いて押出し被覆する場合
、押出し機内において粉砕、溶砕する際に用いるスクリ
ューに掛る負荷が従来の平均重合度（１０００〜１３０
０）の塩化ビニル樹脂よりも増大する。したがって、従
来のように耐加熱変形性を向上させるために平均重合度
の高い（１８００以上）塩化ビニル樹脂を用いると、押
出し機で粉砕、溶融押出して製造加工する際、通常に比
べ高いせん断力負荷をスクリューモータに加える必要が
ある。すなわち、押出し機内に設けられている塩化ビニ
ル樹脂の混線スクリューモータに高い電流負荷が掛って
しまうという問題点を有している。
【課題を解決するための手段】
本発明は、高温加熱状態で当該電線等に外的加重（外的
負荷、例えば自重等）が加わった場合であっても、高温
加熱状態から電線等が受ける熱によって電線等の被覆材
に生じる熱変形量を小さく、すなわち、耐加熱変形性を
向上することができるもので、熱可塑性合成樹脂１００
重量部当り塩化ビニル樹脂０〜１００重量部、塩化ビニ
ル共重合体樹脂５〜１００重量部で構成したものである
。
また、本発明は、前記塩化ビニル共重合体樹脂を、
なる式の基本構造によって構成したものである。
さらに、本発明は、前記塩化ビニル共重合体樹脂の式中
Ｒが、アクリル酸エステル類であり、ＣＨ２＝ ＣＨＣ
ＯＯＲ’ の構造をとるものである。
またさらに、本発明は、前記構造中Ｒ′を、メチル基、
エチル基、ブチル基、オクチル基などにしたものである
。
さらに、また、本発明は、熱可塑性合成樹脂１００重量
部当り塩化ビニル樹脂０〜１００重量部、塩化ビニル共
重合体樹脂５〜１００重量部に、可塑剤、安定剤、充填
剤の１又は２以上を含有させたものである。
（実施例］
以下、本発明の実施例について説明する。
第１表には、本発明の一実施例が示されている。
平均重合度の高い塩化ビニル樹脂を用いると、高温加工
をしなければならず、従来から多く用いられている平均
重合度のあまり高くない塩化ビニル樹脂を用いる場合よ
りも加工性が悪くなることは、周知のことである。また
、この塩化ビニル樹脂（通常は、塩化ビニルの単量体よ
り得られる重合体であるポリ塩化ビニル樹脂）の分子量
の高いものは機械的に丈夫で軟化点が高く、難溶性で形
造用に適しているが、重合体そのままでは強靭性、可撓
性、可塑性に乏しい。そこで、本実施例においては、熱
可塑性合成樹脂１００重量部を塩化ビニル樹脂０〜１０
０重量部、塩化ビニル共重合体樹脂５〜１００重量部の
組み合わせによって構成している。
すなわち、第１表において、本実施例は、耐加熱変形性
を向上させるために、塩化ビニル樹脂に＝７−
加えて、
なる構造を有する塩化ビニル共重合体樹脂を用いている
。この塩化ビニル共重合体樹脂はの部分で部分的に擬似
架橋構造を有している。
一般に、架橋構造は、高温（６０〜１６０℃）加熱時、
外力による変形を受けにくいという性質を有しており、
本実施例における塩化ビニル共重合体樹脂による組成物
も部分的に架橋構造を有しており、変形を受ける程度が
通常の塩化ビニル樹脂に比べ、少なくなっている。
第１表
一８＝
なお、本実施例において用いた塩化ビニル共重合体樹脂
は、信越化学工業（株）製造のｐｖｃレジン（ＧＲ−８
００，ＧＲ−１１００，ＧＲ−１３００、ＧＲ−２５０
０）である。
第１表から明確なように、通常の塩化ビニル樹脂組成物
の耐加熱変形性（第１表では、耐加熱変形率で表わして
いる）は、９〜３０％、また、従来より知られている平
均重合度の高い塩化ビニル樹脂組成物の耐加熱変形性（
率）は、５〜１６％である。これに対し本実施例の耐加
熱変形性（率）は、５〜１６％と公知の平均重合度の高
い塩化ビニル樹脂組成物の耐加熱変形性（率）と同一の
値を示している。すなわち、本実施例によれば、高温加
熱状態で当該電線等に外的加重（外的負荷、例えば自重
等）が加わった場合、従来の通常の塩化ビニル樹脂組成
物よりも熱変形性の少ない熱可塑性合成樹脂を得ること
ができる。
また、第１表から明確なように、従来より知られている
平均重合度の高い塩化ビニル樹脂組成物は、熱分解性が
Ｗ悪いｊで、加工作業性が［ｍｌｌｌｌｊで、加工機負
荷（押出し機内に設けられている塩化ビニル樹脂の混線
スクリューモータにかかる負荷）が「大工である。これ
に対し、第１表から明確なように、本実施例によれば、
熱分解性が、通常の塩化ビニル樹脂組成物同様「良いＪ
で、加工作業性が、通常の塩化ビニル樹脂組成物同様「
易」で、加工機負荷（押出し機内に設けられている塩化
ビニル樹脂の混線スクリューモータにかかる負荷）が、
通常の塩化ビニル樹脂組成物同様「小」である。すなわ
ち、本実施例によれば、第１表に掲げられている通常の
塩化ビニル組成物と同様の製造加工温度（公知の平均重
合度の高い塩化ビニル樹脂組成物の製造加工温度よりも
低い温度）で成形することができ、耐加熱変形性を向上
させるため平均重合度を高めた、公知の平均重合度の高
い塩化ビニル樹脂組成物の問題点である熱分解しやすい
点、加工作業が難しい点、加工機モータ（押出し機のス
クリューモータ）の高い電流負荷が増大する点等いずれ
も解消することが出来る。
【発明の効果１
以上説明したように、本発明によれば、高温加熱状態で
当該電線等に外的加重（外的負荷、例えば自重等）が加
わった場合であっても、高温加熱状態から電線等が受け
る熱によって電線等の被覆材に生じる熱変形量を小さく
、すなわち、耐加熱変形性を向上することができる。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermoplastic resin composition used as a coating material for electric wires, etc. In particular, the present invention relates to a thermoplastic resin composition used as a coating material for electric wires, etc. A vinyl chloride resin that can reduce the amount of thermal deformation that occurs in the covering material of electric wires, etc. even when external loads (external loads, such as own weight, etc.) are applied to the material, that is, improve heat deformation resistance. Regarding the composition. [Prior Art] In recent years, excellent synthetic resins have become available at low cost, and many products that were previously covered with metal are now covered with synthetic resin. Such synthetic resins have the problem that when high heat is applied, they do not retain their original shape and begin to melt, or even if they do not melt, they are thermally deformed. Such synthetic resins are used for insulated wires. Such insulating materials are often used not only to electrically insulate from conductors, but also as structural materials. Therefore, important criteria for selecting an insulating material include electrical properties such as insulation resistance, dielectric strength, permittivity, and dielectric power factor, as well as mechanical strength, heat resistance, ease of processing, and price. It becomes. Thermoplastic synthetic resins, mainly polyvinyl chloride resin wires, are used for the insulation of such electric wires because they are low in cost and easy to perform terminal treatment during construction. This polyvinyl chloride resin is made of soft polyvinyl chloride (with a plasticizer of 5
(less than 0%) is mechanically quite strong and flame retardant,
It is used because it has good chemical resistance and electrical properties, can be colored freely, and can be machined easily. These conventionally used polyvinyl chloride resin wires, which are thermoplastic synthetic resins, soften when the temperature of the sheathing material rises due to the heat generated by the conductor during current flow, and deform due to pressure or its own weight. This thermal deformation can damage the sheathing material of electric wires, etc., leading to dielectric breakdown and, in severe cases, electrical leakage, so the sheathing material is required to have high heat deformation resistance. This improvement in heat deformation resistance has conventionally been achieved with a normal average degree of polymerization (1000 to 130
This is accomplished by using a polyvinyl chloride resin with a higher average degree of polymerization (1800 or more) than in 0). In general, polymer compounds are made up of a large number of basic molecules that combine to form a large molecule, and in polymerization in which unsaturated monomers form the basic molecules and combine, The saturated zone opens under pressure, heat, or a suitable catalyst such as light, acid, or alkali, causing a chain reaction to form chain-like macromolecules. In this way, the degree of polymerization is indicated by the number of bonds of monopolymers bonded together through a polymerization reaction. This vinyl chloride resin having a high average degree of polymerization (1800 or more) is used to improve heat deformation resistance. The reason why vinyl chloride resin with a high average degree of polymerization (1800 or more) is used is that the flow temperature range between the flow start temperature and the decomposition start temperature is narrow, so it is difficult to deform even if external stress is applied under high temperature heating. This is because it is difficult to remove and maintains its original shape. [Problems to be Solved by the Invention] However, when a vinyl chloride resin with a high average degree of polymerization (1800 or more) is used to improve heat deformation resistance as in the past, the vinyl chloride resin used as a covering material for electric wires, etc. Its melting temperature is higher than the conventional average degree of polymerization (1000-1300
), and when manufacturing and processing by melt extrusion using an extruder, it is necessary to add a higher amount of heat (higher processing temperature) to the vinyl chloride resin itself than usual. However, if a high amount of heat (high processing temperature) is applied to vinyl chloride resin, the vinyl chloride resin composition will thermally decompose.
The problem is that it is difficult to process the coating onto electric wires, etc. = 4- Also, if a vinyl chloride resin with a high average degree of polymerization (1800 or more) is used to improve heat deformation resistance as in the past, the hardness of the vinyl chloride resin itself, which is the covering material for electric wires, etc. increases, When extrusion coating electric wires etc. using an extruder, the load applied to the screw used for crushing and melting in the extruder is higher than the conventional average degree of polymerization (1000 to 130
0) compared to vinyl chloride resin. Therefore, if a vinyl chloride resin with a high average degree of polymerization (1800 or more) is used to improve heat deformation resistance as in the past, when it is crushed in an extruder, melt extruded, and manufactured and processed, a higher shear force than usual is applied. It is necessary to apply a load to the screw motor. That is, there is a problem in that a high current load is applied to the vinyl chloride resin cross-wire screw motor provided in the extruder. [Means for Solving the Problems] The present invention provides a solution to the effects that the electric wire, etc. receives from the high-temperature heating state, even when an external load (external load, for example, own weight, etc.) is applied to the electric wire, etc. in the high-temperature heating state. It is a thermoplastic synthetic resin that can reduce the amount of thermal deformation that occurs in the covering material of electric wires, etc. due to heat, that is, improve the heat deformation resistance.
It is composed of 0 to 100 parts by weight of vinyl chloride resin and 5 to 100 parts by weight of vinyl chloride copolymer resin. Further, in the present invention, the vinyl chloride copolymer resin has a basic structure of the following formula. Furthermore, in the present invention, R in the formula of the vinyl chloride copolymer resin is an acrylic ester, and CH2=CHC
It has an OOR' structure. Furthermore, the present invention provides that R' in the structure is a methyl group,
These are ethyl, butyl, octyl, etc. Furthermore, the present invention provides that 0 to 100 parts by weight of vinyl chloride resin and 5 to 100 parts by weight of vinyl chloride copolymer resin are added to 1 or 2 parts of a plasticizer, a stabilizer, and a filler per 100 parts by weight of the thermoplastic synthetic resin. It contains the above. (Example) Examples of the present invention will be described below. Table 1 shows an example of the present invention. When a vinyl chloride resin with a high average degree of polymerization is used, high-temperature processing is required. It is well known that processability is worse than when using conventionally widely used vinyl chloride resins that do not have a very high average degree of polymerization. Polyvinyl chloride resin, a polymer obtained from vinyl chloride monomers, has a high molecular weight, is mechanically strong, has a high softening point, and is poorly soluble, making it suitable for molding. Poor toughness, flexibility, and plasticity. Therefore, in this example, 100 parts by weight of thermoplastic synthetic resin was mixed with 0 to 10 parts by weight of vinyl chloride resin.
0 parts by weight, and 5 to 100 parts by weight of vinyl chloride copolymer resin. That is, in Table 1, in this example, in addition to the vinyl chloride resin, a vinyl chloride copolymer resin having the following structure is used in order to improve heat deformation resistance. This vinyl chloride copolymer resin partially has a pseudo-crosslinked structure at the portion. Generally, when heated at a high temperature (60 to 160°C), the crosslinked structure
It has the property of being resistant to deformation due to external forces,
The composition of the vinyl chloride copolymer resin in this example also has a partially crosslinked structure, and is less susceptible to deformation than ordinary vinyl chloride resins. Table 1-8 = The vinyl chloride copolymer resin used in this example was PVC resin (GR-8) manufactured by Shin-Etsu Chemical Co., Ltd.
00, GR-1100, GR-1300, GR-250
0). As is clear from Table 1, the heat deformation resistance (expressed as heat deformation resistance in Table 1) of ordinary vinyl chloride resin compositions is 9 to 30%, and is Heat deformation resistance of vinyl chloride resin compositions with a high average degree of polymerization (
percentage) is 5-16%. On the other hand, the heat deformation resistance (rate) of this example is 5 to 16%, which is the same value as the heat deformation resistance (rate) of a known vinyl chloride resin composition having a high average degree of polymerization. That is, according to this example, when an external load (external load, for example, own weight, etc.) is applied to the electric wire etc. in a high temperature heating state, the wire has less thermal deformability than the conventional ordinary vinyl chloride resin composition. A thermoplastic synthetic resin can be obtained. In addition, as is clear from Table 1, conventionally known vinyl chloride resin compositions with a high average degree of polymerization have poor thermal decomposition property W, processing workability [mllllj], and processing machine load ( The load applied to the cross-wire screw motor for PVC resin installed in the extruder is ``carpenter''.On the other hand, as is clear from Table 1, according to this example,
The thermal decomposition property is similar to that of ordinary vinyl chloride resin compositions.
The processing workability is the same as that of ordinary vinyl chloride resin compositions.
"Easy", the processing machine load (load applied to the PVC resin cross-wire screw motor installed in the extruder) is
It is "small" like ordinary vinyl chloride resin compositions. That is, according to this example, the manufacturing and processing temperature is the same as that of the normal vinyl chloride composition listed in Table 1 (a temperature lower than the manufacturing and processing temperature of known vinyl chloride resin compositions having a high average degree of polymerization). ), and has a higher average degree of polymerization to improve heat deformation resistance.The problem with known vinyl chloride resin compositions with a high average degree of polymerization is that they are easily thermally decomposed and difficult to process. It is possible to eliminate both the problems such as the increase in the high current load of the processing machine motor (screw motor of the extruder), etc. Effects of the Invention 1 As explained above, according to the present invention, even if an external load (external load, for example, own weight, etc.) is applied to the electric wire etc. in a high temperature heating state, the electric wire can be easily removed from the high temperature heating state. It is possible to reduce the amount of thermal deformation that occurs in the covering material of the electric wire, etc. due to the heat received by the electric wire, etc., that is, to improve the heat deformation resistance.
Claims (5)
脂０〜１００重量部、塩化ビニル共重合体樹脂５〜１０
０重量部であることを特徴とする塩化ビニル樹脂組成物
。(1) 0 to 100 parts by weight of vinyl chloride resin, 5 to 10 parts by weight of vinyl chloride copolymer resin per 100 parts by weight of thermoplastic synthetic resin
A vinyl chloride resin composition characterized in that it contains 0 parts by weight.
塩化ビニル共重合体樹脂は、 ▲数式、化学式、表等があります▼ なる式の基本構造を有するものであることを特徴とする
塩化ビニル樹脂組成物。(2) In the product described in claim 1, the vinyl chloride copolymer resin has a basic structure of the following formula: ▲There are mathematical formulas, chemical formulas, tables, etc. Vinyl resin composition.
塩化ビニル共重合体樹脂の式中Ｒは、アクリル酸エステ
ル類であり、ＣＨ＿２＝ＣＨＣＯＯＲ′の構造をとるも
のであることを特徴とする塩化ビニル樹脂組成物。(3) In the product described in claim 2, R in the formula of the vinyl chloride copolymer resin is an acrylic ester and has a structure of CH_2=CHCOOR'. A vinyl chloride resin composition.
構造中Ｒ′は、メチル基、エチル基、ブチル基、オクチ
ル基などであることを特徴とする塩化ビニル樹脂組成物
。(4) The vinyl chloride resin composition according to claim 3, wherein R' in the above structure is a methyl group, ethyl group, butyl group, octyl group, or the like.
脂０〜１００重量部、塩化ビニル共重合体樹脂５〜１０
０重量部に、可塑剤、安定剤、充填剤の１又は２以上を
含有させたことを特徴とする塩化ビニル樹脂組成物。(5) 0 to 100 parts by weight of vinyl chloride resin, 5 to 10 parts by weight of vinyl chloride copolymer resin per 100 parts by weight of thermoplastic synthetic resin
1. A vinyl chloride resin composition comprising 0 parts by weight of one or more of a plasticizer, a stabilizer, and a filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1153888A JPH01188546A (en) | 1988-01-21 | 1988-01-21 | Vinyl chloride resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1153888A JPH01188546A (en) | 1988-01-21 | 1988-01-21 | Vinyl chloride resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01188546A true JPH01188546A (en) | 1989-07-27 |
Family
ID=11780739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1153888A Pending JPH01188546A (en) | 1988-01-21 | 1988-01-21 | Vinyl chloride resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01188546A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5936111A (en) * | 1996-12-19 | 1999-08-10 | Shin-Etsu Chemical Co., Ltd. | Fluorinated amide compounds with a phenyl-Si-unsaturated group |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57200435A (en) * | 1981-06-04 | 1982-12-08 | Nippon Zeon Co Ltd | Rigid vinyl chloride polymer composition |
| JPS5966440A (en) * | 1982-10-07 | 1984-04-14 | Mitsubishi Monsanto Chem Co | Vinyl chloride resin composition for powder molding |
| JPS6051736A (en) * | 1983-08-31 | 1985-03-23 | Toyo Soda Mfg Co Ltd | Thermoplastic elastomer compositon |
| JPS60173036A (en) * | 1984-02-17 | 1985-09-06 | Nippon Zeon Co Ltd | Production of vinyl chloride resin composition |
-
1988
- 1988-01-21 JP JP1153888A patent/JPH01188546A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57200435A (en) * | 1981-06-04 | 1982-12-08 | Nippon Zeon Co Ltd | Rigid vinyl chloride polymer composition |
| JPS5966440A (en) * | 1982-10-07 | 1984-04-14 | Mitsubishi Monsanto Chem Co | Vinyl chloride resin composition for powder molding |
| JPS6051736A (en) * | 1983-08-31 | 1985-03-23 | Toyo Soda Mfg Co Ltd | Thermoplastic elastomer compositon |
| JPS60173036A (en) * | 1984-02-17 | 1985-09-06 | Nippon Zeon Co Ltd | Production of vinyl chloride resin composition |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5936111A (en) * | 1996-12-19 | 1999-08-10 | Shin-Etsu Chemical Co., Ltd. | Fluorinated amide compounds with a phenyl-Si-unsaturated group |
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