JPH01179449U - - Google Patents
Info
- Publication number
- JPH01179449U JPH01179449U JP1988075322U JP7532288U JPH01179449U JP H01179449 U JPH01179449 U JP H01179449U JP 1988075322 U JP1988075322 U JP 1988075322U JP 7532288 U JP7532288 U JP 7532288U JP H01179449 U JPH01179449 U JP H01179449U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- cold plate
- cooling
- melting point
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000013013 elastic material Substances 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988075322U JPH01179449U (sl) | 1988-06-08 | 1988-06-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988075322U JPH01179449U (sl) | 1988-06-08 | 1988-06-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01179449U true JPH01179449U (sl) | 1989-12-22 |
Family
ID=31300392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988075322U Pending JPH01179449U (sl) | 1988-06-08 | 1988-06-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01179449U (sl) |
-
1988
- 1988-06-08 JP JP1988075322U patent/JPH01179449U/ja active Pending
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