JPH01179101U - - Google Patents
Info
- Publication number
- JPH01179101U JPH01179101U JP7687888U JP7687888U JPH01179101U JP H01179101 U JPH01179101 U JP H01179101U JP 7687888 U JP7687888 U JP 7687888U JP 7687888 U JP7687888 U JP 7687888U JP H01179101 U JPH01179101 U JP H01179101U
- Authority
- JP
- Japan
- Prior art keywords
- sintered alloy
- lower chip
- chip made
- tapepet
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Valve-Gear Or Valve Arrangements (AREA)
- Powder Metallurgy (AREA)
Description
第１図は本考案の一実施例を示す縦断面図、第
２図は第１図の変形例を示す同じく縦断面図であ
る。第３図は公知のタペツトを示す縦断面図であ
る。
１…外筒、２…上層チツプ、３…下層チツプ、
３―１…内側下層チツプ、３―２…外側下層チツ
プ。
FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing a modification of FIG. 1. FIG. 3 is a longitudinal sectional view of a known tapepet. 1...Outer cylinder, 2...Upper layer chip, 3...Lower layer chip,
3-1...Inner lower layer chip, 3-2...Outer lower layer chip.
Claims (1)
下層チツプに接合され上面にプツシユロツドに対
する当接面が形成された焼結合金製上層チツプと
、上記両チツプ上に鋳込まれたアルミニウム筒体
とよりなることを特徴とする複層チツプ型タペツ
ト。 A lower chip made of sintered alloy that slides into contact with the cam, an upper chip made of sintered alloy that is joined to the lower chip and has an abutment surface for the push rod on its upper surface, and an aluminum cylindrical body cast on both of the chips. A multi-layered tip-type tapepet characterized by
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988076878U JP2530700Y2 (en) | 1988-06-10 | 1988-06-10 | Multilayer chip type tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988076878U JP2530700Y2 (en) | 1988-06-10 | 1988-06-10 | Multilayer chip type tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01179101U true JPH01179101U (en) | 1989-12-22 |
| JP2530700Y2 JP2530700Y2 (en) | 1997-03-26 |
Family
ID=31301886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988076878U Expired - Lifetime JP2530700Y2 (en) | 1988-06-10 | 1988-06-10 | Multilayer chip type tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2530700Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01162003U (en) * | 1988-05-02 | 1989-11-10 |
-
1988
- 1988-06-10 JP JP1988076878U patent/JP2530700Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01162003U (en) * | 1988-05-02 | 1989-11-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2530700Y2 (en) | 1997-03-26 |