JPH01177815U - - Google Patents
Info
- Publication number
- JPH01177815U JPH01177815U JP7423288U JP7423288U JPH01177815U JP H01177815 U JPH01177815 U JP H01177815U JP 7423288 U JP7423288 U JP 7423288U JP 7423288 U JP7423288 U JP 7423288U JP H01177815 U JPH01177815 U JP H01177815U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- utility
- wire soldering
- finishing device
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
Landscapes
- Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7423288U JPH01177815U (da) | 1988-06-06 | 1988-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7423288U JPH01177815U (da) | 1988-06-06 | 1988-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01177815U true JPH01177815U (da) | 1989-12-19 |
Family
ID=31299349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7423288U Pending JPH01177815U (da) | 1988-06-06 | 1988-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01177815U (da) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5175957A (ja) * | 1974-12-26 | 1976-06-30 | Matsushita Electric Ind Co Ltd | Riidosentanmatsushoriho |
| JPS54163366A (en) * | 1978-06-14 | 1979-12-25 | Fujitsu Ltd | Solder removing mechanism for apparatus for removing components mounted on board |
| JPS5752264B2 (da) * | 1975-05-06 | 1982-11-06 | ||
| JPS584274B2 (ja) * | 1974-07-29 | 1983-01-25 | オオイ シゲオ | ネツバイジヨウキハツセイソウチ |
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1988
- 1988-06-06 JP JP7423288U patent/JPH01177815U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS584274B2 (ja) * | 1974-07-29 | 1983-01-25 | オオイ シゲオ | ネツバイジヨウキハツセイソウチ |
| JPS5175957A (ja) * | 1974-12-26 | 1976-06-30 | Matsushita Electric Ind Co Ltd | Riidosentanmatsushoriho |
| JPS5752264B2 (da) * | 1975-05-06 | 1982-11-06 | ||
| JPS54163366A (en) * | 1978-06-14 | 1979-12-25 | Fujitsu Ltd | Solder removing mechanism for apparatus for removing components mounted on board |