JPH01176970U - - Google Patents
Info
- Publication number
- JPH01176970U JPH01176970U JP7332288U JP7332288U JPH01176970U JP H01176970 U JPH01176970 U JP H01176970U JP 7332288 U JP7332288 U JP 7332288U JP 7332288 U JP7332288 U JP 7332288U JP H01176970 U JPH01176970 U JP H01176970U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- chip components
- solder
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7332288U JPH01176970U (de) | 1988-06-03 | 1988-06-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7332288U JPH01176970U (de) | 1988-06-03 | 1988-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176970U true JPH01176970U (de) | 1989-12-18 |
Family
ID=31298468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7332288U Pending JPH01176970U (de) | 1988-06-03 | 1988-06-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176970U (de) |
-
1988
- 1988-06-03 JP JP7332288U patent/JPH01176970U/ja active Pending