JPH01176928U - - Google Patents
Info
- Publication number
- JPH01176928U JPH01176928U JP7467388U JP7467388U JPH01176928U JP H01176928 U JPH01176928 U JP H01176928U JP 7467388 U JP7467388 U JP 7467388U JP 7467388 U JP7467388 U JP 7467388U JP H01176928 U JPH01176928 U JP H01176928U
- Authority
- JP
- Japan
- Prior art keywords
- cavities
- resin
- heater
- temperature sensor
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7467388U JPH01176928U (forum.php) | 1988-06-03 | 1988-06-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7467388U JPH01176928U (forum.php) | 1988-06-03 | 1988-06-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176928U true JPH01176928U (forum.php) | 1989-12-18 |
Family
ID=31299773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7467388U Pending JPH01176928U (forum.php) | 1988-06-03 | 1988-06-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176928U (forum.php) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020129728A1 (ja) * | 2018-12-21 | 2020-06-25 | 第一精工株式会社 | 樹脂成形金型及び樹脂成形方法 |
| JP2020100140A (ja) * | 2018-12-21 | 2020-07-02 | 第一精工株式会社 | 樹脂成形金型及び樹脂成形方法 |
-
1988
- 1988-06-03 JP JP7467388U patent/JPH01176928U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020129728A1 (ja) * | 2018-12-21 | 2020-06-25 | 第一精工株式会社 | 樹脂成形金型及び樹脂成形方法 |
| JP2020100140A (ja) * | 2018-12-21 | 2020-07-02 | 第一精工株式会社 | 樹脂成形金型及び樹脂成形方法 |