JPH01174956U - - Google Patents
Info
- Publication number
- JPH01174956U JPH01174956U JP7186388U JP7186388U JPH01174956U JP H01174956 U JPH01174956 U JP H01174956U JP 7186388 U JP7186388 U JP 7186388U JP 7186388 U JP7186388 U JP 7186388U JP H01174956 U JPH01174956 U JP H01174956U
- Authority
- JP
- Japan
- Prior art keywords
- utility
- mold
- scope
- registration request
- photocoupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7186388U JPH01174956U (en, 2012) | 1988-05-30 | 1988-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7186388U JPH01174956U (en, 2012) | 1988-05-30 | 1988-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01174956U true JPH01174956U (en, 2012) | 1989-12-13 |
Family
ID=31297051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7186388U Pending JPH01174956U (en, 2012) | 1988-05-30 | 1988-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01174956U (en, 2012) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023100663A1 (ja) * | 2021-12-01 | 2023-06-08 | ローム株式会社 | 半導体装置 |
| JPWO2024177013A1 (en, 2012) * | 2023-02-20 | 2024-08-29 |
-
1988
- 1988-05-30 JP JP7186388U patent/JPH01174956U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023100663A1 (ja) * | 2021-12-01 | 2023-06-08 | ローム株式会社 | 半導体装置 |
| JPWO2024177013A1 (en, 2012) * | 2023-02-20 | 2024-08-29 |