JPH01174945U - - Google Patents
Info
- Publication number
- JPH01174945U JPH01174945U JP7240888U JP7240888U JPH01174945U JP H01174945 U JPH01174945 U JP H01174945U JP 7240888 U JP7240888 U JP 7240888U JP 7240888 U JP7240888 U JP 7240888U JP H01174945 U JPH01174945 U JP H01174945U
- Authority
- JP
- Japan
- Prior art keywords
- view
- center
- utility
- semiconductor device
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7240888U JPH01174945U (pt-PT) | 1988-05-31 | 1988-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7240888U JPH01174945U (pt-PT) | 1988-05-31 | 1988-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01174945U true JPH01174945U (pt-PT) | 1989-12-13 |
Family
ID=31297575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7240888U Pending JPH01174945U (pt-PT) | 1988-05-31 | 1988-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01174945U (pt-PT) |
-
1988
- 1988-05-31 JP JP7240888U patent/JPH01174945U/ja active Pending