JPH01174944U - - Google Patents

Info

Publication number
JPH01174944U
JPH01174944U JP1988072362U JP7236288U JPH01174944U JP H01174944 U JPH01174944 U JP H01174944U JP 1988072362 U JP1988072362 U JP 1988072362U JP 7236288 U JP7236288 U JP 7236288U JP H01174944 U JPH01174944 U JP H01174944U
Authority
JP
Japan
Prior art keywords
bonding wire
sloped
semiconductor device
utility
peripheral edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988072362U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988072362U priority Critical patent/JPH01174944U/ja
Publication of JPH01174944U publication Critical patent/JPH01174944U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5473—
    • H10W72/5475—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1988072362U 1988-05-31 1988-05-31 Pending JPH01174944U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988072362U JPH01174944U (cg-RX-API-DMAC10.html) 1988-05-31 1988-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988072362U JPH01174944U (cg-RX-API-DMAC10.html) 1988-05-31 1988-05-31

Publications (1)

Publication Number Publication Date
JPH01174944U true JPH01174944U (cg-RX-API-DMAC10.html) 1989-12-13

Family

ID=31297531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988072362U Pending JPH01174944U (cg-RX-API-DMAC10.html) 1988-05-31 1988-05-31

Country Status (1)

Country Link
JP (1) JPH01174944U (cg-RX-API-DMAC10.html)

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