JPH01174938U - - Google Patents
Info
- Publication number
- JPH01174938U JPH01174938U JP7240288U JP7240288U JPH01174938U JP H01174938 U JPH01174938 U JP H01174938U JP 7240288 U JP7240288 U JP 7240288U JP 7240288 U JP7240288 U JP 7240288U JP H01174938 U JPH01174938 U JP H01174938U
- Authority
- JP
- Japan
- Prior art keywords
- view
- figures
- factory
- utility
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000005192 partition Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7240288U JPH01174938U (enrdf_load_stackoverflow) | 1988-05-31 | 1988-05-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7240288U JPH01174938U (enrdf_load_stackoverflow) | 1988-05-31 | 1988-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01174938U true JPH01174938U (enrdf_load_stackoverflow) | 1989-12-13 |
Family
ID=31297569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7240288U Pending JPH01174938U (enrdf_load_stackoverflow) | 1988-05-31 | 1988-05-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01174938U (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022038870A (ja) * | 2020-08-27 | 2022-03-10 | 株式会社東芝 | 半導体パッケージ及びマーキング方法 |
-
1988
- 1988-05-31 JP JP7240288U patent/JPH01174938U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022038870A (ja) * | 2020-08-27 | 2022-03-10 | 株式会社東芝 | 半導体パッケージ及びマーキング方法 |
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