JPH01174514A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPH01174514A JPH01174514A JP62334220A JP33422087A JPH01174514A JP H01174514 A JPH01174514 A JP H01174514A JP 62334220 A JP62334220 A JP 62334220A JP 33422087 A JP33422087 A JP 33422087A JP H01174514 A JPH01174514 A JP H01174514A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- monomer
- weight
- amount
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 15
- 229920001187 thermosetting polymer Polymers 0.000 title abstract description 4
- -1 methyl acrylate) Chemical compound 0.000 claims abstract description 25
- 239000000178 monomer Substances 0.000 claims abstract description 25
- 229920001577 copolymer Polymers 0.000 claims abstract description 16
- 238000004132 cross linking Methods 0.000 claims abstract description 9
- 150000008064 anhydrides Chemical class 0.000 claims abstract description 8
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 4
- 125000005250 alkyl acrylate group Chemical group 0.000 claims description 6
- 239000000376 reactant Substances 0.000 claims description 3
- 150000001735 carboxylic acids Chemical class 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 19
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 abstract description 12
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract description 7
- 238000002156 mixing Methods 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 5
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 abstract description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract description 2
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 abstract description 2
- 239000011976 maleic acid Substances 0.000 abstract description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 239000000047 product Substances 0.000 description 14
- 230000007423 decrease Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000003811 acetone extraction Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 1
- PAOHAQSLJSMLAT-UHFFFAOYSA-N 1-butylperoxybutane Chemical compound CCCCOOCCCC PAOHAQSLJSMLAT-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- YKXAYLPDMSGWEV-UHFFFAOYSA-N 4-hydroxybutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCO YKXAYLPDMSGWEV-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- 238000000944 Soxhlet extraction Methods 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 150000004820 halides Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000012690 ionic polymerization Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- DBSDMAPJGHBWAL-UHFFFAOYSA-N penta-1,4-dien-3-ylbenzene Chemical compound C=CC(C=C)C1=CC=CC=C1 DBSDMAPJGHBWAL-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、硬化性に優れ、その硬化物の特性(特に誘電
特性)が良好な熱硬化性樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a thermosetting resin composition that has excellent curability and good properties (particularly dielectric properties) of the cured product.
(従来の技術)
一般に、フェノール樹脂は、電気的性質9機械的性質、
耐熱性、耐薬品性等の諸特性のバランスがとれ、かつ、
安価なことから民生用を中心に電気・電子分野で広く利
用されている。(Prior art) Generally, phenolic resin has electrical properties, 9 mechanical properties,
Balanced properties such as heat resistance and chemical resistance, and
Because it is inexpensive, it is widely used in electrical and electronic fields, mainly for consumer use.
(発明が解決しようとする問題点)
フェノール樹脂は、その硬化反応が重縮合系あるいはイ
オン重合系であるために硬化に長時間を必要とする欠点
がある。この様な硬化性に優れるものに不飽和ポリエス
テル樹脂が挙げられる。この不飽和ポリエステル樹脂は
その硬化反応がラジカル重合系なので触媒系を選択すれ
ば常温硬化も可能であるが、樹脂骨格中に極性基(カル
ボニル基)が多く含まれているので硬化物は吸湿しやす
くなる。そのために、不飽和ポリエステル樹脂には吸湿
後の諸特性の低下が欠点として挙げられる。(Problems to be Solved by the Invention) Phenol resins have a disadvantage in that they require a long time for curing because their curing reaction is polycondensation-based or ionic polymerization-based. An example of such a resin having excellent curability is unsaturated polyester resin. The curing reaction of this unsaturated polyester resin is radical polymerization, so it can be cured at room temperature if a catalyst system is selected, but since the resin skeleton contains many polar groups (carbonyl groups), the cured product does not absorb moisture. It becomes easier. For this reason, a drawback of unsaturated polyester resins is a decrease in various properties after moisture absorption.
本発明は、これらの問題点を解決するものである。The present invention solves these problems.
(問題点を解決するための手段)
本発明は、アクリル酸アルキル又はメタアクリル酸アル
キルを0〜50モル係の範囲で、アクリル酸ヒドロキシ
アルキル又はメタアクリル酸ヒドロキシアルキルを10
〜50モル−の範囲で及びその他のエチレン性不飽和モ
ノマを0〜90モル係の範囲でこれらの総量が100モ
ル−となる量でこれらを共重合させて得られる共重合体
と不飽和カルボン酸又はその無水物との反応物(A)1
00重量部、この反応物と共重合可能な単量体(B)2
5重量部以上ならびに(A)および(8)100重量部
に対して四官能性以上の架橋モノマ0.5重量部以上を
□含有して壜る熱硬化性樹脂組成物に関する。(Means for Solving the Problems) The present invention provides for the use of alkyl acrylates or alkyl methacrylates in a range of 0 to 50 moles, and hydroxyalkyl acrylates or hydroxyalkyl methacrylates in a range of 10 to 50 moles.
A copolymer obtained by copolymerizing these in the range of ~50 mol and other ethylenically unsaturated monomers in the range of 0 to 90 mol for a total amount of 100 mol, and unsaturated carboxyl. Reactant with acid or its anhydride (A) 1
00 parts by weight, monomer (B) 2 copolymerizable with this reactant
The present invention relates to a thermosetting resin composition containing 5 parts by weight or more and 0.5 parts by weight or more of a tetrafunctional or higher crosslinking monomer per 100 parts by weight of (A) and (8).
本発明で用いるアクリル酸アルキル又はメタアクリル酸
アルキルは1例えば、アクリル酸メチル。The alkyl acrylate or alkyl methacrylate used in the present invention is, for example, methyl acrylate.
アクリル酸ブチル、アクリル酸2−エチルヘキシル等の
アクリル酸アルキルエステル類、メタクリル酸メチル、
メタクリル酸ブチル、メタクリル酸2−エチルヘキシル
等のメタクリル酸アルキルエステル類などがあげられる
。また、アクリル酸ヒドロキシアルキル又はメタアクリ
ル酸ヒドロキシアルキルとしては1例えば、アクリル酸
2−ヒドロキシエチル、アクリル酸2−ヒドロキシプロ
ピル、アクリル酸4−ヒドロキシブチル等のアクリル酸
ヒドロキシアルキルエステル類、メタクリル酸2−ヒド
ロキシエチル、メタクリル酸2−、ヒドロキシプロピル
、メタクリル酸4−ヒドロキシブチル等のメタクリル酸
ヒドロキシアルキルエステル類などがあげられる。その
他のエチレン性不飽和モノマとしては9例えば、スチレ
ン、α−メチルスチレン等のスチレン誘導体、アクリロ
ニトリル、メタクリロニトリル等の有機ニトリル類、酢
酸ビニル、プロピオン酸ビニル等の有機酸のビニルエス
テル類、アクリル酸、メタクリル酸、アクリル酸エステ
ル類、メタクリル酸エステル類、ジシクロペンタジェン
アクリレート類、これらの化合物から誘導される酸アミ
ド基又は酸ハライド基を有する化合物、N−メチロール
アクリルアミド酸のN−アクリレート誘導体、N−メチ
ロールメタアクリルアミド等のN−メタアクリレート誘
導体などがあげられる。不飽和カルボン酸としては。Acrylic acid alkyl esters such as butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate,
Examples include alkyl methacrylates such as butyl methacrylate and 2-ethylhexyl methacrylate. Examples of hydroxyalkyl acrylate or hydroxyalkyl methacrylate include hydroxyalkyl acrylate esters such as 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, and 4-hydroxybutyl acrylate, and 2-hydroxyalkyl acrylate. Examples include hydroxyalkyl methacrylates such as hydroxyethyl, 2-hydroxypropyl methacrylate, and 4-hydroxybutyl methacrylate. Examples of other ethylenically unsaturated monomers include styrene, styrene derivatives such as α-methylstyrene, organic nitriles such as acrylonitrile and methacrylonitrile, vinyl esters of organic acids such as vinyl acetate and vinyl propionate, and acrylic Acids, methacrylic acid, acrylic esters, methacrylic esters, dicyclopentadiene acrylates, compounds having an acid amide group or acid halide group derived from these compounds, N-acrylate derivatives of N-methylolacrylamide acid , N-methacrylate derivatives such as N-methylolmethacrylamide, and the like. As an unsaturated carboxylic acid.
N、t#f、フマール酸、マレイン酸、イタコン酸など
があげられ、その無水物としては無水マレイン酸、無水
イタコン酸などがあげられる。共重合可能な単量体とし
ては、上記のアクリル酸アルキル。N, t#f, fumaric acid, maleic acid, itaconic acid, etc., and anhydrides thereof include maleic anhydride, itaconic anhydride, etc. Examples of copolymerizable monomers include the above-mentioned alkyl acrylates.
メタアクリル酸アルキル、アクリル酸ヒドロキシアルキ
ル、メタアクリル酸ヒドロキシアルキル。Alkyl methacrylate, hydroxyalkyl acrylate, hydroxyalkyl methacrylate.
その他のエチレン性不飽和モノマなどが用いられる。Other ethylenically unsaturated monomers may be used.
アクリル酸アルキル又はメタアクリル酸アルキル、アク
リル酸ヒドロキシアルキル又はメタアクリル酸ヒドロキ
シアルキル及びエチレン性不飽和モノマの共重合体は9
通常の懸濁重合法、塊状重合法、溶液重合法等により製
造できるが、その後の不飽和カルボン酸又はその無水物
との反応および四官能性以上の架橋モノマがあるので、
塊状重合法又は溶液重合法を用いて製造することが好ま
しい。また、この共重合体の重合の際に用いられる重合
開始剤としては、一般のラジカル重合に用いられるアゾ
ビスイソブチロニトリル、アゾビスシクロヘキサンカル
ボニトリル等のアゾ系開始剤。Copolymer of alkyl acrylate or alkyl methacrylate, hydroxyalkyl acrylate or hydroxyalkyl methacrylate, and ethylenically unsaturated monomer is 9
Although it can be produced by ordinary suspension polymerization, bulk polymerization, solution polymerization, etc., it requires a subsequent reaction with an unsaturated carboxylic acid or its anhydride and a crosslinking monomer of tetrafunctionality or higher.
It is preferable to manufacture using a bulk polymerization method or a solution polymerization method. The polymerization initiator used in the polymerization of this copolymer is an azo initiator such as azobisisobutyronitrile and azobiscyclohexanecarbonitrile, which are used in general radical polymerization.
tert−ブチルヒドロペルオキシド、ジーtert−
ブチルペルオキシド等の過酸化物などがあげられ。tert-butyl hydroperoxide, di-tert-
Examples include peroxides such as butyl peroxide.
特に制限はない。重合禁止剤としては、一般のラジカル
重合に用いられるハイドロキノン、p−ベンゾキノン等
があげられ、特に制限はない。また。There are no particular restrictions. Examples of the polymerization inhibitor include hydroquinone, p-benzoquinone, etc., which are used in general radical polymerization, and are not particularly limited. Also.
場合によっては共重合体の分子量を調節するために、ド
デシルメルカプタン等のアルキルメルカプタン類の連鎖
移動剤を用いることができる。この共重合体のヒドロキ
シル基と不飽和カルボン酸又祉その無水物とのエステル
化反応は公知の方法で行われ、#に制限はない。In some cases, a chain transfer agent of alkyl mercaptans such as dodecyl mercaptan can be used to adjust the molecular weight of the copolymer. The esterification reaction between the hydroxyl group of this copolymer and the unsaturated carboxylic acid or its anhydride is carried out by a known method, and # is not limited.
本発明の樹脂組成物は、その使用目的および使用環境に
よって構成比を種々変化させることができるが、好まし
い範囲をあげると、アクリル酸アルキル又はメタアクリ
ル酸アルキルは、樹脂液の着色、樹脂硬化物の電気的性
質の点から0〜50モル−の範囲とされ、50モルチよ
りも多くなると樹脂液の黄色化が著しくなる九めに硬化
物の透明性が失なわれ、また硬化物の電気的性質(特に
誘電特性)の低下も示す。The composition ratio of the resin composition of the present invention can be varied depending on the purpose of use and environment of use, but the preferable range is that the alkyl acrylate or alkyl methacrylate is used for coloring the resin liquid, for coloring the resin cured product, etc. The amount is determined to be in the range of 0 to 50 mol from the viewpoint of electrical properties. It also shows a decrease in properties (particularly dielectric properties).
アクリル酸とドロΦシアルキルスはメタアクリル酸ヒド
ロキシアルキルは共重合体の反応性及び作業性の点から
10〜50七ルチの範囲とされ。The content of acrylic acid and hydroxyalkyl methacrylate is set in the range of 10 to 507% from the viewpoint of reactivity and workability of the copolymer.
10モルチよりも少ないと共重合体の反応性が著しく低
下するために硬化に長時間を費したり硬化物の諸特性の
低下を示し、50モルチよ抄多くなると共重合体の分子
量が高くなり粘稠な液体となるため作業性の低下や硬化
物の諸特性の低下を示す。If it is less than 10 moles, the reactivity of the copolymer will be significantly reduced, resulting in a long time for curing or a decrease in the properties of the cured product, and if it is more than 50 moles, the molecular weight of the copolymer will increase. Since it becomes a viscous liquid, it shows a decrease in workability and a decrease in various properties of the cured product.
エチレン性不飽和モノマは樹脂液の白濁、樹脂硬化物の
透明性の点から0〜90モルー〇範囲とされ、90モル
チよりも多くなると共重合体の溶解性が低下するために
樹脂液の白濁が著しくなり。The amount of ethylenically unsaturated monomer is set in the range of 0 to 90 mol from the viewpoint of clouding of the resin liquid and transparency of the cured resin. If it exceeds 90 mol, the solubility of the copolymer decreases, resulting in clouding of the resin liquid. becomes noticeable.
硬化物の透明性も失なわれてしまう。Transparency of the cured product is also lost.
共重合可能な単量体は樹脂液の反応性及び作業性の点か
ら共重合体と不飽和カルボン酸又はその無水物との反応
物100重量部に対して25重量部以上とされ、25重
量部よりも少ないと樹脂液の反応性が著しく低下するた
めに硬化に長時間を費したり硬化物の諸特性の低下を示
し、また樹脂液が粘稠となるために作業性の低下を招く
。この単量体は通常は400重量部以下とされる。四官
能性以上の架橋モノマとしては9例えば、ジビニルベン
ゼン、ジビニルトルエン等のビニルモノマ類、L3−ブ
チレングリコールジアクリレート。The amount of the copolymerizable monomer is 25 parts by weight or more based on 100 parts by weight of the reaction product of the copolymer and the unsaturated carboxylic acid or its anhydride, from the viewpoint of the reactivity and workability of the resin liquid. If the amount is less than 100%, the reactivity of the resin liquid will be significantly reduced, resulting in a long time for curing and deterioration of various properties of the cured product, and the resin liquid will become viscous, resulting in a decrease in workability. . The amount of this monomer is usually 400 parts by weight or less. Examples of the tetrafunctional or higher crosslinking monomer include vinyl monomers such as divinylbenzene and divinyltoluene, and L3-butylene glycol diacrylate.
ジエチレングリコールジアクリレート、トリメチロール
プロパントリアクリレート、ビスフェノールAジアクリ
レート、トリス(アクリロイルオキシエチル)イソシア
ヌレート等の多官能アクリレート類、1.3−ブチレン
グリコールジメタクリレート、エチレングリコールジメ
タクリレート、トリメチロールプロパントリメタクリレ
ート、ビスフェノールAジメタクリレート、トリス(メ
タクリロイルオキシエチル)イソシアヌレート等の多官
能メタクリレート類、ジアリルフタレート、トリアリル
シアヌレート、トリアリルインシアヌレート等の多官能
アリル化合物などがあげられる。Polyfunctional acrylates such as diethylene glycol diacrylate, trimethylolpropane triacrylate, bisphenol A diacrylate, tris (acryloyloxyethyl) isocyanurate, 1,3-butylene glycol dimethacrylate, ethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, Examples include polyfunctional methacrylates such as bisphenol A dimethacrylate and tris(methacryloyloxyethyl)isocyanurate, and polyfunctional allyl compounds such as diallyl phthalate, triallyl cyanurate, and triallyl in cyanurate.
四官能性以上の架橋モノマは樹脂硬化物の硬化性の点か
ら上記の(A)および(B)100重量部に対して、0
.5重量部以上とされる。0.5重量部よりも少ないと
樹脂硬化物の硬化が不十分となり9本来期待できる様な
諸特性が得られない。また、この量が10重量部よりも
多くなってもその樹脂硬化物の硬化性にはほとんど変化
がなく10重量部以下で用いることが好ましい。From the viewpoint of curability of the cured resin product, the amount of crosslinking monomer of tetrafunctionality or higher is 0 per 100 parts by weight of the above (A) and (B).
.. The amount is 5 parts by weight or more. If the amount is less than 0.5 part by weight, the cured resin product will not be sufficiently cured, and the properties expected in the first place will not be obtained. Further, even if the amount is more than 10 parts by weight, there is almost no change in the curability of the cured resin, and it is preferable to use 10 parts by weight or less.
本発明の樹脂組成物は比較的低粘度で短時間硬化が可能
なことから、工業材料用(電気絶縁用)。The resin composition of the present invention has a relatively low viscosity and can be cured in a short time, so it is suitable for industrial materials (electrical insulation).
土木建築用、スポーツ、レジャー用などの注型用樹脂と
して用いることができる。また、可撤剤。It can be used as a casting resin for civil engineering, construction, sports, leisure, etc. Also a removable agent.
安定剤、硬化剤(触媒)、増粘剤、充填剤、橋かけ剤、
補強材(強化材)9着色剤、滑材等を添加することによ
って、成形材料、塗料、接着剤、その他各種の用途に用
いることができる。Stabilizers, curing agents (catalysts), thickeners, fillers, crosslinking agents,
Reinforcing material (reinforcing material) 9 By adding colorants, lubricants, etc., it can be used as a molding material, paint, adhesive, and various other uses.
(実施例)
実施例により本発明を説明する。部とあるのは重量部で
ある。(Example) The present invention will be explained with reference to an example. Parts are by weight.
実施例1 攪拌装置、加熱装置、冷却管、窒素ガス吸込口。Example 1 Stirring device, heating device, cooling pipe, nitrogen gas inlet.
モノマ仕込口を取り付は九3I!のフラスコにメチルイ
ソブチルケトン(以下MIBKと略す)556部を入れ
、窒素置換を十分に行いながら100℃に昇温した。一
方、2I!のビー力にスチレン35&3部(30モルチ
)、アクリル酸ブチル587、6部(40モルチ)、メ
タクリル酸2−ヒドロキシエチル447.9部(30モ
ル係)、アゾビスイソブチロニトリル41.86部、ジ
ターシャリ−ブチルペルオキシド6.96部を入れて十
分に攪拌した混合液を、全量が3時間で無くなる様に加
温したMIBK中に滴下した。全量滴下後さらに3時間
反応させ、ハイドロキノン0.27部を添加混合して、
共重合体図を得た。さらに100℃のまま、無水マレイ
ン酸225部を添加して4時間反応後9重合率が981
であることを確認して冷却した。Installing the monomer inlet is 93I! 556 parts of methyl isobutyl ketone (hereinafter abbreviated as MIBK) was placed in a flask, and the temperature was raised to 100° C. while thoroughly purging with nitrogen. On the other hand, 2I! Styrene 35 & 3 parts (30 mol), butyl acrylate 587.6 parts (40 mol), 2-hydroxyethyl methacrylate 447.9 parts (30 mol), azobisisobutyronitrile 41.86 parts A mixed solution containing 6.96 parts of ditertiary-butyl peroxide and thoroughly stirred was added dropwise into the heated MIBK so that the entire amount disappeared in 3 hours. After dropping the entire amount, the reaction was continued for 3 hours, and 0.27 parts of hydroquinone was added and mixed.
A copolymer diagram was obtained. Furthermore, 225 parts of maleic anhydride was added at 100°C, and after 4 hours of reaction, the polymerization rate of 9 was 981.
After confirming that it was the same, it was cooled.
次いで、フラスコにコンデンサを取り付け、アスピレー
タで約50 mmHg ’Jで徐々に減圧しながら5o
Nioo℃に加温してMIBKを除去後、あらかじめハ
イドロキノン0.02部を溶解さセテおいたスチレン1
61118部を添加し、共重合体図が完全に溶解するま
で攪拌を続け、不溶物がないことを確認して冷却し、樹
脂組成物(B)を得た。この樹脂組成物(B)の加熱残
分(NV)は約52であった。Next, a condenser was attached to the flask, and the pressure was gradually reduced to about 50 mmHg'J using an aspirator.
After heating to 100°C and removing MIBK, styrene 1 in which 0.02 part of hydroquinone was dissolved in advance.
61,118 parts of the copolymer was added, and stirring was continued until the copolymer was completely dissolved. After confirming that there was no insoluble matter, the mixture was cooled to obtain a resin composition (B). The heating residue (NV) of this resin composition (B) was about 52.
この樹脂組成物(B) 100部に対してジビニルベン
ゼンを表1に示すように20部以下で添加し。Divinylbenzene was added in an amount of 20 parts or less as shown in Table 1 to 100 parts of this resin composition (B).
さらにパーへキサ3M(パーオ中シケタール類。In addition, Parhexa 3M (Pero-medium ciketals).
日本油脂株式会社製商品名)1部を添加して十分に攪拌
混合後、JIS K6901に準じて高温硬化特性(
測定温度130℃1表においてTgはゲル化時間、Tc
は最小硬化時間、 Trnaxは最高発熱温度を示す)
を測定した。さらに、そのまま加熱を続け、30分後に
急冷して樹脂硬化物を得た。After adding 1 part of Nippon Oil & Fats Co., Ltd. product name) and thoroughly stirring and mixing, the high temperature curing properties (produced by JIS K6901)
Measurement temperature: 130°C In Table 1, Tg is gelation time, Tc
is the minimum curing time and Trnax is the maximum exothermic temperature)
was measured. Furthermore, heating was continued as it was, and after 30 minutes, the resin was rapidly cooled to obtain a cured resin product.
この樹脂硬化物を細かく粉砕して約3gを取り。Finely crush this cured resin and take about 3 g.
あらかじめ乾燥により恒量(しておいた直径28薗、長
さ100mmの円筒ろaK入れて精秤後、溶媒としてア
セトン(ioog)を用いたソックスレイ抽出装置によ
り4時間還流抽出した。抽出後。After accurately weighing in a cylindrical filter AK with a diameter of 28 mm and a length of 100 mm, which had been previously dried to a constant weight, the mixture was extracted under reflux for 4 hours using a Soxhlet extraction apparatus using acetone (ioog) as a solvent. After extraction.
円筒ろ紙を減圧乾燥機中60℃、4時間乾燥し。The thimble was dried in a vacuum dryer at 60°C for 4 hours.
その前後の重量変化から、アセトン抽出率を算出した。The acetone extraction rate was calculated from the weight change before and after that.
また、ろ液をそのまま用いて、ガスクロマトグラフィ装
置(日立製、164型)により未反応スチレンモノマの
定量分析を行い、その結果から残存スチレン量を算出し
た。それらの結果について1表1にまとめて示しな。Further, using the filtrate as it was, quantitative analysis of unreacted styrene monomer was performed using a gas chromatography device (manufactured by Hitachi, model 164), and the amount of residual styrene was calculated from the results. The results are summarized in Table 1.
実施例2
実施例1で作製した樹脂組成物(81100部に対して
エチレングリコールジメタクリレートを表2に示すよう
に20部以下で添加し、さらにパーへキサ3M(パーオ
キシケタール類1日本油脂株式会社製商品名)1部を添
加して十分に攪拌混合後。Example 2 To the resin composition (81,100 parts) prepared in Example 1, 20 parts or less of ethylene glycol dimethacrylate was added as shown in Table 2, and Perhexa 3M (peroxyketals 1 NOF Co., Ltd.) was added. After adding 1 part of the company's product name) and thoroughly stirring and mixing.
実施例1と同様に高温硬化特性(130’C)、アセト
ン抽出率及び残存スチレン量を求めた。それらの結果を
表2Kまとめて示した。In the same manner as in Example 1, high temperature curing properties (130'C), acetone extraction rate, and residual styrene amount were determined. The results are summarized in Table 2K.
実施例3
実施例1で作製した樹脂組成物(B) 100部に対し
てトリアリルイソシアヌレートな表3に示したよう1c
20部以下で添加し、さらにパーへキサ3M(パーオキ
シケタール類9日本油脂株式会社製商品名)1部を添加
して十分に攪拌混合後、実施例1と同様に高温硬化特性
(130”C)、アセトン抽出率及び残存スチレン量を
検討した。それらの結果を表3Ktとめて示した。Example 3 1c of triallylisocyanurate as shown in Table 3 was added to 100 parts of the resin composition (B) prepared in Example 1.
After adding 20 parts or less and further adding 1 part of Perhexa 3M (Peroxyketals 9, trade name manufactured by NOF Corporation) and stirring and mixing thoroughly, the high temperature curing properties (130" C), the acetone extraction rate and the amount of residual styrene were investigated.The results are shown in Table 3Kt.
比較例
実施例1で作製した樹脂組成物(B) 100部にジビ
ニルベンゼン、エチレングリコールジメタクリレートお
よびトリアリルイソシアヌレートな添加することなくパ
ーへキサ3M(パーオキシケタール類9日本油脂株式会
社製商品名)1部を添加して十分に攪拌混合後、実施例
1と同様に高温硬化特性(130℃)、アセトン抽出率
、及び残存スチレン量を検討した。その結果を表1〜3
に示した。Comparative Example 100 parts of the resin composition (B) prepared in Example 1 was mixed with Perhexa 3M (peroxyketals 9, a product manufactured by NOF Corporation) without the addition of divinylbenzene, ethylene glycol dimethacrylate, and triallyl isocyanurate. After adding and thoroughly stirring and mixing, high temperature curing characteristics (130° C.), acetone extraction rate, and residual styrene amount were examined in the same manner as in Example 1. Tables 1 to 3 show the results.
It was shown to.
表2
表3
表1〜3に見られるように1本実施例で得られた樹脂組
成物は、優れた硬化特性を示す。特に。Table 2 Table 3 As seen in Tables 1 to 3, the resin composition obtained in this example exhibits excellent curing properties. especially.
ジビニルベンゼンを用いた場合では、最少硬化時間(T
c)が無添加系に比べて5〜20秒も速くなり、より短
時間で硬化が可能である。また硬化度の尺度となるアセ
トン抽出率及び残存スチレン量ともに四官能性以上の架
橋モノマの添加量に伴って急激に減少する。中でもジビ
ニルベンゼンを用いた場合、同一添加量で一番値が小さ
いことから。When divinylbenzene is used, the minimum curing time (T
c) is 5 to 20 seconds faster than the additive-free system, and curing is possible in a shorter time. Furthermore, both the acetone extraction rate and the amount of residual styrene, which are measures of the degree of hardening, decrease rapidly with the amount of the crosslinking monomer of tetrafunctionality or higher. Among them, when using divinylbenzene, the value is the smallest at the same amount added.
より硬化性が向上していることが示される。It is shown that the curability is further improved.
(発明の効果)
本発明になる樹脂組成物は、主鎖骨格中に極性基を有し
ないので耐湿性に優れ、吸湿後の緒特性低下も少なくな
る。さらに、樹脂硬化時に四官能性以上の架橋モノマな
添加するため、より短時間でより強固に硬化し大成形品
を得ることができる。(Effects of the Invention) The resin composition of the present invention has no polar group in the main chain skeleton, so it has excellent moisture resistance and less deterioration of properties after absorbing moisture. Furthermore, since a crosslinking monomer of tetrafunctionality or higher is added when the resin is cured, it is possible to cure the resin more strongly in a shorter time and to obtain large molded products.
代理人 弁理士 若 林 邦 彦。Agent: Patent attorney Kunihiko Wakabayashi.
\1.7・\1.7・
Claims (1)
0〜50モル%の範囲でアクリル酸ヒドロキシアルキル
又はメタアクリル酸ヒドロキシアルキルを10〜50モ
ル%の範囲で及びその他のエチレン性不飽和モノマを0
〜90モル%の範囲でこれらの総量が100モル%とな
る量でこれらを共重合させて得られる共重合体と不飽和
カルボン酸又はその無水物との反応物(A)100重量
部、この反応物と共重合可能な単量体(B)25重量部
以上ならびに(A)および(B)100重量部に対して
四官能性以上の架橋モノマ0.5重量部以上を含有して
なる熱硬化性樹脂組成物。1. Alkyl acrylate or alkyl methacrylate in a range of 0 to 50 mol%, hydroxyalkyl acrylate or hydroxyalkyl methacrylate in a range of 10 to 50 mol%, and other ethylenically unsaturated monomers in a range of 0
100 parts by weight of a reaction product (A) of a copolymer obtained by copolymerizing these with an unsaturated carboxylic acid or its anhydride in an amount such that the total amount is 100 mol% in the range of 90 mol%, A thermoplastic containing 25 parts by weight or more of a monomer (B) copolymerizable with the reactant and 0.5 parts by weight or more of a tetrafunctional or higher crosslinking monomer per 100 parts by weight of (A) and (B). Curable resin composition.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62334220A JPH01174514A (en) | 1987-12-29 | 1987-12-29 | Thermosetting resin composition |
EP19880304392 EP0293112A3 (en) | 1987-05-21 | 1988-05-16 | Resin composition and electrical laminate obtained therefrom |
US07/194,918 US5009949A (en) | 1987-05-21 | 1988-05-17 | Resin composition and electrical laminate obtained therefrom |
KR1019880006025A KR910005695B1 (en) | 1987-05-21 | 1988-05-21 | Resin composition and electric laminate obtained therefrom |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62334220A JPH01174514A (en) | 1987-12-29 | 1987-12-29 | Thermosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01174514A true JPH01174514A (en) | 1989-07-11 |
Family
ID=18274894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62334220A Pending JPH01174514A (en) | 1987-05-21 | 1987-12-29 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01174514A (en) |
-
1987
- 1987-12-29 JP JP62334220A patent/JPH01174514A/en active Pending
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