JPH01173970U - - Google Patents

Info

Publication number
JPH01173970U
JPH01173970U JP7119988U JP7119988U JPH01173970U JP H01173970 U JPH01173970 U JP H01173970U JP 7119988 U JP7119988 U JP 7119988U JP 7119988 U JP7119988 U JP 7119988U JP H01173970 U JPH01173970 U JP H01173970U
Authority
JP
Japan
Prior art keywords
metal
conductive circuit
wiring board
multilayer wiring
circuit layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7119988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7119988U priority Critical patent/JPH01173970U/ja
Publication of JPH01173970U publication Critical patent/JPH01173970U/ja
Pending legal-status Critical Current

Links

JP7119988U 1988-05-30 1988-05-30 Pending JPH01173970U (US06534493-20030318-C00166.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7119988U JPH01173970U (US06534493-20030318-C00166.png) 1988-05-30 1988-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7119988U JPH01173970U (US06534493-20030318-C00166.png) 1988-05-30 1988-05-30

Publications (1)

Publication Number Publication Date
JPH01173970U true JPH01173970U (US06534493-20030318-C00166.png) 1989-12-11

Family

ID=31296409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7119988U Pending JPH01173970U (US06534493-20030318-C00166.png) 1988-05-30 1988-05-30

Country Status (1)

Country Link
JP (1) JPH01173970U (US06534493-20030318-C00166.png)

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