Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/181—Encapsulation
  • H01L2924/1815—Shape

Landscapes

• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Priority Applications (1)

Applications Claiming Priority (1)

Publications (1)

Family

ID=31294275

Family Applications (1)

Country Status (1)

• 1988
  • 1988-05-25 JP JP6898388U patent/JPH01173967U/ja active Pending

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