JPH01173939U - - Google Patents

Info

Publication number
JPH01173939U
JPH01173939U JP1988070584U JP7058488U JPH01173939U JP H01173939 U JPH01173939 U JP H01173939U JP 1988070584 U JP1988070584 U JP 1988070584U JP 7058488 U JP7058488 U JP 7058488U JP H01173939 U JPH01173939 U JP H01173939U
Authority
JP
Japan
Prior art keywords
bonding
wire
bonding tool
point
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988070584U
Other languages
English (en)
Japanese (ja)
Other versions
JPH058679Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988070584U priority Critical patent/JPH058679Y2/ja
Publication of JPH01173939U publication Critical patent/JPH01173939U/ja
Application granted granted Critical
Publication of JPH058679Y2 publication Critical patent/JPH058679Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP1988070584U 1988-05-28 1988-05-28 Expired - Lifetime JPH058679Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988070584U JPH058679Y2 (https=) 1988-05-28 1988-05-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988070584U JPH058679Y2 (https=) 1988-05-28 1988-05-28

Publications (2)

Publication Number Publication Date
JPH01173939U true JPH01173939U (https=) 1989-12-11
JPH058679Y2 JPH058679Y2 (https=) 1993-03-04

Family

ID=31295818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988070584U Expired - Lifetime JPH058679Y2 (https=) 1988-05-28 1988-05-28

Country Status (1)

Country Link
JP (1) JPH058679Y2 (https=)

Also Published As

Publication number Publication date
JPH058679Y2 (https=) 1993-03-04

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