JPH01173937U - - Google Patents
Info
- Publication number
- JPH01173937U JPH01173937U JP6986988U JP6986988U JPH01173937U JP H01173937 U JPH01173937 U JP H01173937U JP 6986988 U JP6986988 U JP 6986988U JP 6986988 U JP6986988 U JP 6986988U JP H01173937 U JPH01173937 U JP H01173937U
- Authority
- JP
- Japan
- Prior art keywords
- resin mold
- ultrasonic vibrator
- whose
- package
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6986988U JPH01173937U (cs) | 1988-05-26 | 1988-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6986988U JPH01173937U (cs) | 1988-05-26 | 1988-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01173937U true JPH01173937U (cs) | 1989-12-11 |
Family
ID=31295135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6986988U Pending JPH01173937U (cs) | 1988-05-26 | 1988-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01173937U (cs) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56118343A (en) * | 1980-02-22 | 1981-09-17 | Nec Corp | Preparation apparatus for semiconductor device |
| JPS61192496A (ja) * | 1985-02-19 | 1986-08-27 | 三菱電機株式会社 | プリント基板用打抜加工装置 |
| JPS61255030A (ja) * | 1985-05-07 | 1986-11-12 | Fuji Plant Kogyo Kk | 半導体樹脂モ−ルドのバリ除去方法および装置 |
-
1988
- 1988-05-26 JP JP6986988U patent/JPH01173937U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56118343A (en) * | 1980-02-22 | 1981-09-17 | Nec Corp | Preparation apparatus for semiconductor device |
| JPS61192496A (ja) * | 1985-02-19 | 1986-08-27 | 三菱電機株式会社 | プリント基板用打抜加工装置 |
| JPS61255030A (ja) * | 1985-05-07 | 1986-11-12 | Fuji Plant Kogyo Kk | 半導体樹脂モ−ルドのバリ除去方法および装置 |