JPH01173591A - Plane heating element - Google Patents
Plane heating elementInfo
- Publication number
- JPH01173591A JPH01173591A JP33164887A JP33164887A JPH01173591A JP H01173591 A JPH01173591 A JP H01173591A JP 33164887 A JP33164887 A JP 33164887A JP 33164887 A JP33164887 A JP 33164887A JP H01173591 A JPH01173591 A JP H01173591A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- adhesive
- polyimide
- insulating film
- planar heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims description 42
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 229920001721 polyimide Polymers 0.000 claims abstract description 28
- 239000000853 adhesive Substances 0.000 claims abstract description 27
- 239000004642 Polyimide Substances 0.000 claims abstract description 15
- 229920006259 thermoplastic polyimide Polymers 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000011888 foil Substances 0.000 claims description 20
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000000956 alloy Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 abstract description 4
- 239000012298 atmosphere Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 22
- 239000012790 adhesive layer Substances 0.000 description 8
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 5
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 description 1
- CJOSNRHNDUHUPU-UHFFFAOYSA-N 3,3-diphenyl-1,2-dihydroindene Chemical compound C12=CC=CC=C2CCC1(C=1C=CC=CC=1)C1=CC=CC=C1 CJOSNRHNDUHUPU-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000005251 gamma ray Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野］
本発明は合金箔から形成される発熱体回路をポリイミド
系のフィルムと接着剤で絶縁被覆してなる面状発熱体に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a planar heating element formed by insulatingly covering a heating element circuit formed from an alloy foil with a polyimide film and an adhesive.
発熱体回路の両面に絶縁フィルムを接着してなる面状発
熱体は厚さがせいぜい０．２１程度と非常に薄（シかも
可撓性に富むところから各種の用途に使用されているが
、その多（は絶縁フィルムとしてポリエチレン、ポリエ
チレンテレフタレートのような熱可塑性樹脂を使用し、
接着剤も変性ポリエチレンや変性ポリプロピレン、アイ
オノマ樹脂などが一般的で使用温度は通常１００℃以下
である。これらに比較して耐熱性の良好な面状発熱体と
してポリイミドフィルムを絶縁フィルムとし、四ふっ化
エチレン六ふっ化プロピレン共重合体を接着剤に使用し
たものがあるが、この種のものは高線量の放射線によっ
て接着剤が劣化し低分子のフッ素化合物を放出して分解
する欠点がある。Planar heating elements, which are made by bonding insulating films to both sides of the heating element circuit, are extremely thin, with a thickness of about 0.21 mm at most, and are used for a variety of purposes due to their high flexibility. Many of them use thermoplastic resins such as polyethylene and polyethylene terephthalate as insulation films,
Adhesives are also commonly made of modified polyethylene, modified polypropylene, ionomer resin, etc., and the operating temperature is usually 100° C. or lower. Compared to these, there is a planar heating element with better heat resistance that uses polyimide film as the insulation film and tetrafluoroethylene hexafluoropropylene copolymer as the adhesive, but this type of heating element has high heat resistance. The drawback is that the adhesive deteriorates due to a high dose of radiation, releasing low-molecular fluorine compounds and decomposing.
以上のように従来技術によって製造される面状発熱体は
耐熱性、耐放射線性においてその性能が十分でない。As described above, the planar heating elements manufactured by the conventional techniques do not have sufficient performance in terms of heat resistance and radiation resistance.
なお、ポリイミド樹脂としては、ピロメリト酸二無水物
とジアミノジフェニルエーテルを縮合して得られるもの
（デュポン社製カプトンなど）が最も一般的であり、こ
の種のものを接着剤として利用しようとするとポリイミ
ド化した後では熱圧しても全（接着性を示さず、またイ
ミド化前のポリアミック酸溶液で面状発熱体の接着貼合
せを行うと接着はするもののイミド化に伴って生ずる縮
合水によって接着層に多数のボイドを生ずる問題があっ
た。The most common polyimide resin is one obtained by condensing pyromellitic dianhydride and diaminodiphenyl ether (such as Kapton manufactured by DuPont), and if you try to use this type of resin as an adhesive, it will be difficult to convert it into polyimide. However, if the sheet heating element is bonded with a polyamic acid solution before imidization, it will adhere, but the adhesive layer will not show adhesive properties even if hot pressed. There was a problem that a large number of voids were generated.
本発明の目的は、２００℃以上の使用温度でも長期間使
用でき、しかも、放射線雰囲気でも安定した性能を有す
る面状発熱体を提供することにある。An object of the present invention is to provide a planar heating element that can be used for a long period of time even at operating temperatures of 200° C. or higher and has stable performance even in a radiation atmosphere.
〔問題点を解決するための手段及び作用〕本発明の上記
目的は合金箔で形成された発熱体回路に絶縁フィルムを
接着被覆してなる面状発熱体において、絶縁フィルムと
接着剤が共にポリイミド系材料からなり、さらに接着剤
が２５０℃以上４００℃以下の温度で熱圧することによ
り接着性を示す熱可塑性ポリイミドからなることを特徴
とする面状発熱体によって達成される。[Means and effects for solving the problems] The above-mentioned object of the present invention is to provide a planar heating element in which an insulating film is adhesively coated on a heating element circuit formed of an alloy foil, in which both the insulating film and the adhesive are made of polyimide. This is achieved by a planar heating element characterized in that the adhesive is made of a thermoplastic polyimide that exhibits adhesive properties when hot-pressed at a temperature of 250° C. or more and 400° C. or less.
本発明の面状発熱体において、使用される合金箔として
は体積抵抗率４０〜１３０Ｘ１０’Ω−Ｃ−を有するニ
ッケルクロム合金、ニッケルクロム鉄合金、ニッケル鋼
合金などの合金箔がある０合金箔の材質、厚さ、回路パ
ターンは面状発熱体に供給される電源の電圧、必要とさ
れる発熱量などによりて決定され、数μｍから１００ｔ
！ｍ程度までの厚さの合金箔が使用される。In the sheet heating element of the present invention, the alloy foil used includes alloy foils such as nickel chromium alloy, nickel chromium iron alloy, and nickel steel alloy having a volume resistivity of 40 to 130 x 10'Ω-C. The material, thickness, and circuit pattern are determined by the voltage of the power supply supplied to the planar heating element, the required amount of heat, etc.
! Alloy foils with a thickness of up to about 1000 m are used.
本発明の面状発熱体において、使用される絶縁フィルム
はポリイミド系フィルムである。絶縁フィルムはヒータ
回路を被覆するように基材及びカバーレイとなる２枚の
フィルムが使用される。ポリイミド系フィルムとしては
ピロメリト酸二無水物とジアミノジフェニルエーテルか
ら合成されるもの、ビフェニルテトラカルボン酸二無水
物とジアミノジフェニルエーテルから合成されるものが
量産市販されている代表的なものであるが、これらのほ
かにポリイミダゾピロロン、ポリベンズオキサゾールイ
ミド、ポリアミドイミドなどのフィルムも使用できる。In the planar heating element of the present invention, the insulating film used is a polyimide film. Two insulating films are used to cover the heater circuit: a base material and a coverlay. Typical polyimide films that are mass-produced and commercially available are those synthesized from pyromellitic dianhydride and diaminodiphenyl ether, and those synthesized from biphenyltetracarboxylic dianhydride and diaminodiphenyl ether. In addition, films made of polyimidazopyrrolone, polybenzoxazoleimide, polyamideimide, etc. can also be used.
これらの材料は２００℃以上になっても変性しない。These materials do not denature even at temperatures above 200°C.
本発明の面状発熱体において、使用される接着剤は２５
０℃以上４００ ”Ｃ以下の温度で熱圧することにより
接着性を示す熱可塑性ポリイミド系樹脂である。この種
の接着剤としては３．３’ −４゜４′ −ベンゾフ
ェノンテトラカルボン酸二無水物と３，３′ −ジア
ミノベンゾフェノンを縮合して得られるポリイミド樹脂
、ジフェニルインダンをベースとするポリイミド樹脂、
無水トリメリット酸、ビスフェノールＡ、ジアミノジフ
ェニルエーテル、ジアミノジフェニルスルホンを縮合し
て得られるポリエステルイミドスルホン樹脂などがある
。これらの熱可塑性ポリイミド系接着剤は原料モノマー
を溶剤中で反応させて得られるポリアミック酸溶液を合
金箔および／またはポリイミド絶縁フィルムに塗布、乾
燥、加熱して縮合を進め、貼合せ接着時に連発して接着
層中にボイドを生じなくなる段階まで十分にポリイミド
化して使用される。また、これらの熱可塑性ポリイミド
系接着剤は単独のフィルムに加工後面状発熱体の貼合せ
時に絶縁フィルムと合金箔の中間に介在させて熱圧接着
させる形態で使用しても良い。In the sheet heating element of the present invention, the adhesive used is 25
It is a thermoplastic polyimide resin that exhibits adhesive properties when hot-pressed at a temperature of 0°C or higher and 400"C or lower. Examples of this type of adhesive include 3.3'-4°4'-benzophenonetetracarboxylic dianhydride. polyimide resin obtained by condensing and 3,3′-diaminobenzophenone, polyimide resin based on diphenylindane,
Examples include polyesterimide sulfone resins obtained by condensing trimellitic anhydride, bisphenol A, diaminodiphenyl ether, and diaminodiphenylsulfone. These thermoplastic polyimide adhesives are made by reacting raw material monomers in a solvent, applying a polyamic acid solution to alloy foil and/or polyimide insulating film, drying, and heating to promote condensation, resulting in continuous condensation during bonding. It is used after being sufficiently polyimidized to the point where no voids are produced in the adhesive layer. Further, these thermoplastic polyimide adhesives may be used in a form in which a single film is processed and then interposed between an insulating film and an alloy foil and bonded by heat and pressure when a sheet heating element is bonded to the film.
本発明の面状発熱体に使用する熱可塑性ポリイミド系接
着剤は実質的にポリイミド化が完了した後でも２５０℃
以上４００℃以下の温度の下で加圧貼合せすることによ
り接着性を示すものであり、接着性を示す温度範囲を２
５０ ’Ｃ〜４００℃に限定した理由は面状発熱体の製
造時の加工性と使用時の耐熱性の点から設定したもので
ある。即ち、貼合せ接着に４００℃よりも高温を必要と
する場合には製造時に絶縁フィルムや合金箔が熱劣化し
たり酸化変色するような支障を生じ、２５０℃よりも低
温で接着性を示す場合面状発熱体の使用時の耐熱温度が
接着性を示す温度に応じて低下するからである。The thermoplastic polyimide adhesive used in the planar heating element of the present invention is heated to a temperature of 250°C even after the polyimidization is substantially completed.
It exhibits adhesive properties when laminated under pressure at temperatures above 400°C or below, and the temperature range in which it exhibits adhesive properties is 2.
The reason why the temperature was limited to 50'C to 400C was determined from the viewpoints of processability during production of the planar heating element and heat resistance during use. In other words, if a high temperature higher than 400°C is required for bonding, problems such as thermal deterioration or oxidation discoloration of the insulating film or alloy foil may occur during manufacturing, and if adhesiveness is exhibited at lower temperatures than 250°C. This is because the heat resistance temperature when the planar heating element is used decreases in accordance with the temperature at which adhesiveness is exhibited.
つぎに、本発明の面状発熱体を実施例と比較例により具
体的に説明するが、本発明はこれらに限定されるもので
はない。Next, the planar heating element of the present invention will be specifically explained using Examples and Comparative Examples, but the present invention is not limited thereto.
実施例−１
厚さ１５μｍのニッケルクロム合金箔と厚さ５０μｍの
ポリイミド絶縁フィルム、熱可塑性ポリイミド接着剤Ｌ
ＡＲＣ−ＴＰ■（三井東圧化学■製）を使用して第１図
に示す形状の面状発熱体を試作し、性能を評価した。第
１図において１は合金箔回路、２はポリイミド絶縁フィ
ルム、３は接着剤層である。第１図の面状発熱体はつぎ
のようにして製作した。まずＬＡＲＣ−ＴＰ Ｉ （
３０％ジメチルアセトアミド溶液）をカプトン２００Ｈ
（デュポン社製ポリイミドフィルムの商品名）に塗布、
乾燥、高温キエアして厚さ約１０ＩＩｍの接着剤層を付
けたポリイミドフィルムとし、つぎにニッケルクロム合
金箔と重ね合せ、ｔａプレスにより３４０ ′Ｃ，５０
ｋｇ／ｃｊ、 １０分間熱圧して接着させた。つぎに
、合金箔のうえに感光製ドライフィルムをラミネートし
、フォトマスクを介して紫外線に露光し、現像後塩化第
二鉄水溶液を化学エツチング剤に使用して合金箔をエツ
チングし、第１図の回路パターンを得た後ドライフィル
ムをアルカリ液で除去した。このようにして発熱体回路
の加工を行った後、前記した熱可塑性ポリイミド接着剤
層付きのポリイミド絶縁フィルムを回路を被覆するよう
に重ね合せ、電熱プレスにより３４０℃，５０ｋｇ／ｃ
シ、１０分熱圧してカバーレイフィルムを接着させ第１
図に示す面状発熱体を作製した６作製した面状発熱体に
ついて、回路部の合金箔とポリイミドフィルムの１８０
度剥離接着強さを２０℃と２００ ’Ｃで測定した。ま
た、第１図の面状発熱体に線量率ｌＸ１０’ｒａｄ／ｈ
で１００Ｘ１０’ｒａｄｙ＆ＩＩを照射した。γ線照射
後の面状発熱体について前記と同様に１８０度剥離接着
強さを測定した。評価結果をまとめて第１表に示す。Example-1 Nickel chromium alloy foil with a thickness of 15 μm, polyimide insulation film with a thickness of 50 μm, thermoplastic polyimide adhesive L
A planar heating element having the shape shown in FIG. 1 was prototyped using ARC-TP (manufactured by Mitsui Toatsu Chemical) and its performance was evaluated. In FIG. 1, 1 is an alloy foil circuit, 2 is a polyimide insulating film, and 3 is an adhesive layer. The planar heating element shown in FIG. 1 was manufactured as follows. First, LARC-TP I (
30% dimethylacetamide solution) with Kapton 200H
(trade name of polyimide film made by DuPont),
A polyimide film with an adhesive layer of about 10 IIm thick was formed by drying and high-temperature heating, and then it was layered with nickel-chromium alloy foil and heated to 340'C, 50cm using a TA press.
kg/cj, and was bonded by hot pressing for 10 minutes. Next, a photosensitive dry film is laminated onto the alloy foil, exposed to ultraviolet light through a photomask, and after development, the alloy foil is etched using a ferric chloride aqueous solution as a chemical etching agent. After obtaining the circuit pattern, the dry film was removed with alkaline solution. After processing the heating element circuit in this way, the above-mentioned polyimide insulating film with a thermoplastic polyimide adhesive layer was layered to cover the circuit, and an electric heat press was applied at 340°C and 50 kg/cm.
1. Apply heat pressure for 10 minutes to adhere the coverlay film.
The planar heating element shown in the figure was fabricated.6 Regarding the fabricated planar heating element, the alloy foil and polyimide film of the circuit part were
Peel adhesion strength was measured at 20°C and 200'C. In addition, the dose rate lX10'rad/h was applied to the planar heating element shown in Figure 1.
It was irradiated with 100×10'radi&II. The 180 degree peel adhesive strength of the planar heating element after γ-ray irradiation was measured in the same manner as described above. The evaluation results are summarized in Table 1.
比較例−１
接着剤として四ふっ化エチレン六ふっ化プロピレン樹脂
が厚さ１２．５μｍに塗布されているポリイミドフィル
ム（デュポン社製商品名カプトン２５０ＦＯ２９）を使
用する以外は実施例−１と全く同様にして第１図に示す
形状の面状発熱体を試作し、実施例−１と同様にして性
能を評価した。Comparative Example-1 Completely the same as Example-1 except that a polyimide film (product name: Kapton 250FO29 manufactured by DuPont) coated with tetrafluoroethylene hexafluoropropylene resin to a thickness of 12.5 μm was used as an adhesive. A planar heating element having the shape shown in FIG. 1 was manufactured as a prototype, and its performance was evaluated in the same manner as in Example-1.
評価結果をまとめて第１表に示す。The evaluation results are summarized in Table 1.
比較例−２
接着剤として熱硬化製ポリイミド接着剤（日産化学工業
■商品名サンエバーボンド４１０）を使用しカプトン２
００Ｈに塗布乾燥し１２０℃，１時間加熱して厚さ約１
０μｍの接着剤層を付けたポリイミドフィルムとし、つ
ぎに厚さ１５μｍのニッケルクロム合金箔と重合せ、電
熱プレスにより２５０℃，５０ｋｇ／ｃｄ、 ６０分
熱圧して接着させた。つぎに、実施例−１と同様にして
合金箔をエツチングして第１図の回路加工を行った後上
記の同様にして回路を被覆するようにカバーレイフィル
ムを貼合せ、第１図の面状発熱体を試作した。Comparative Example-2 Kapton 2 was used as an adhesive using a thermosetting polyimide adhesive (Nissan Chemical Industry ■Product name Sunever Bond 410).
Apply to 00H, dry and heat at 120℃ for 1 hour to a thickness of about 1.
A polyimide film was prepared with a 0 μm adhesive layer, and then superposed with a 15 μm thick nickel chromium alloy foil, and bonded by hot pressing at 250° C., 50 kg/cd, and 60 minutes using an electric heat press. Next, in the same manner as in Example 1, the alloy foil was etched and the circuit shown in FIG. We prototyped a shaped heating element.
評価結果をまとめて第１表に示す。The evaluation results are summarized in Table 1.
第 １ 表
比較例−２において面状発熱体を観察するとポリイミド
接着剤層中に多数のボイドが発生していた。なお、接着
剤層中のボイドの発生を防止するため接着剤をカプトン
２００Ｈに塗布乾燥後１８０’Ｃ，１時間加熱してイミ
ド化を進めてからポリイミドフィルムと合金箔の貼合せ
を電熱プレスを使用して行ったが、温度、圧力条件を種
々変えて熱圧しても接着する条件を見出せず全く接着し
なかワた。When the planar heating element was observed in Comparative Example 2 in Table 1, many voids were found in the polyimide adhesive layer. In order to prevent voids from forming in the adhesive layer, the adhesive was applied to Kapton 200H, dried, heated at 180'C for 1 hour to promote imidization, and then the polyimide film and alloy foil were laminated using an electric heat press. However, even though the temperature and pressure conditions were variously changed and hot pressing was performed, conditions for adhesion could not be found and no adhesion occurred at all.
（発明の効果）
第１表の評価結果に見られるように本発明の合金箔で形
成された発熱体回路に絶縁フィルムを接着被覆してなる
面状発熱体において、絶縁フィルムと接着剤が共にポリ
イミド系材料からなり、さらに接着剤が２５０℃以上４
００℃以下の温度で熱圧することにより接着性を示す熱
可塑性ポリイミドからなることを特徴とする面状発熱体
は２００℃においても絶縁フィルムと発熱体が良く接着
しており、また、γ線を１００ Ｍｒａｄ照射後も良好
な接着を維持している。(Effect of the invention) As seen in the evaluation results in Table 1, in the planar heating element formed by adhesively covering the heating element circuit formed of the alloy foil of the present invention with an insulating film, both the insulating film and the adhesive It is made of polyimide material, and the adhesive has a temperature of 250℃ or higher.
The sheet heating element is characterized by being made of thermoplastic polyimide that exhibits adhesive properties when hot-pressed at temperatures below 00°C.The insulating film and the heating element are well bonded even at 200°C, and it is also highly resistant to gamma rays. Good adhesion is maintained even after irradiation with 100 Mrad.
第１図は本発明の面状発熱体の１実施例の平面図（ａ）
と断面図（ｂ）である。
！・・・合金箔
２・・・ポリイミド絶縁フィルム
３・・・接着剤FIG. 1 is a plan view (a) of one embodiment of the sheet heating element of the present invention.
and a cross-sectional view (b). ! ... Alloy foil 2 ... Polyimide insulation film 3 ... Adhesive
Claims (1)
着被覆してなる面状発熱体において、絶縁フィルムと接
着剤が共にポリイミド系材料からなり、さらに接着剤が
２５０℃以上４００℃以下の温度で熱圧することにより
接着性を示す熱可塑性ポリイミドからなることを特徴と
する面状発熱体。1. In a sheet heating element formed by adhesively covering a heating element circuit formed of alloy foil with an insulating film, both the insulating film and the adhesive are made of a polyimide material, and the adhesive has a temperature of 250°C or more and 400°C or less. A planar heating element characterized by being made of thermoplastic polyimide that exhibits adhesive properties when hot-pressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62331648A JP2503557B2 (en) | 1987-12-25 | 1987-12-25 | Planar heating element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62331648A JP2503557B2 (en) | 1987-12-25 | 1987-12-25 | Planar heating element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01173591A true JPH01173591A (en) | 1989-07-10 |
| JP2503557B2 JP2503557B2 (en) | 1996-06-05 |
Family
ID=18246015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62331648A Expired - Lifetime JP2503557B2 (en) | 1987-12-25 | 1987-12-25 | Planar heating element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2503557B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06283261A (en) * | 1993-01-27 | 1994-10-07 | Mitsui Toatsu Chem Inc | Panel heater and manufacture thereof |
| JP2008123869A (en) * | 2006-11-13 | 2008-05-29 | Ube Ind Ltd | Flexible heater and manufacturing method therefor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62249383A (en) * | 1986-04-22 | 1987-10-30 | 日立電線株式会社 | Panel heating unit |
-
1987
- 1987-12-25 JP JP62331648A patent/JP2503557B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62249383A (en) * | 1986-04-22 | 1987-10-30 | 日立電線株式会社 | Panel heating unit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06283261A (en) * | 1993-01-27 | 1994-10-07 | Mitsui Toatsu Chem Inc | Panel heater and manufacture thereof |
| JP2008123869A (en) * | 2006-11-13 | 2008-05-29 | Ube Ind Ltd | Flexible heater and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2503557B2 (en) | 1996-06-05 |
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