JPH01172458U - - Google Patents
Info
- Publication number
- JPH01172458U JPH01172458U JP6579488U JP6579488U JPH01172458U JP H01172458 U JPH01172458 U JP H01172458U JP 6579488 U JP6579488 U JP 6579488U JP 6579488 U JP6579488 U JP 6579488U JP H01172458 U JPH01172458 U JP H01172458U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- chain
- rotates
- liquid level
- motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 2
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案実施例の平面図、第２図は第１
図Ａ―Ａ線断面図、第３図は第１図の要部拡大図
、第４図は第２図の要部拡大図である。
１……はんだ槽、２……スプロケツト、３……
チエーン、４……棒はんだ保持体、５……棒はん
だ、６……走行板、７……切欠き、８……液面セ
ンサー、９……モーター。
Fig. 1 is a plan view of an embodiment of the present invention, and Fig. 2 is a plan view of an embodiment of the present invention.
3 is an enlarged view of the main part of FIG. 1, and FIG. 4 is an enlarged view of the main part of FIG. 2. 1... Solder bath, 2... Sprocket, 3...
Chain, 4...Solder bar holder, 5...Solder bar, 6...Travel plate, 7...Notch, 8...Liquid level sensor, 9...Motor.
Claims (1)
はんだを立てて搬送する多数の保持体が取付けら
れているとともに、はんだ槽には前記チエーンを
回動させるモーターに電気的信号を送ることので
きる液面センサーが設置されていることを特徴と
するはんだ供給装置。 A chain that rotates between a pair of sprockets is equipped with a number of holders that hold and transport solder bars upright, and a liquid level in the solder bath that can send electrical signals to the motor that rotates the chain. A solder supply device characterized by being equipped with a sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6579488U JPH01172458U (en) | 1988-05-20 | 1988-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6579488U JPH01172458U (en) | 1988-05-20 | 1988-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01172458U true JPH01172458U (en) | 1989-12-06 |
Family
ID=31291221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6579488U Pending JPH01172458U (en) | 1988-05-20 | 1988-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01172458U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008155817A1 (en) * | 2007-06-19 | 2008-12-24 | Senju Metal Industry Co., Ltd. | Method of feeding lead-free stick solder to solder tank and solder tank |
-
1988
- 1988-05-20 JP JP6579488U patent/JPH01172458U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008155817A1 (en) * | 2007-06-19 | 2008-12-24 | Senju Metal Industry Co., Ltd. | Method of feeding lead-free stick solder to solder tank and solder tank |
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