JPH01172450U - - Google Patents
Info
- Publication number
- JPH01172450U JPH01172450U JP6455188U JP6455188U JPH01172450U JP H01172450 U JPH01172450 U JP H01172450U JP 6455188 U JP6455188 U JP 6455188U JP 6455188 U JP6455188 U JP 6455188U JP H01172450 U JPH01172450 U JP H01172450U
- Authority
- JP
- Japan
- Prior art keywords
- dip type
- support device
- leads
- preliminary soldering
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6455188U JPH01172450U (cs) | 1988-05-18 | 1988-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6455188U JPH01172450U (cs) | 1988-05-18 | 1988-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01172450U true JPH01172450U (cs) | 1989-12-06 |
Family
ID=31290017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6455188U Pending JPH01172450U (cs) | 1988-05-18 | 1988-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01172450U (cs) |
-
1988
- 1988-05-18 JP JP6455188U patent/JPH01172450U/ja active Pending