JPH01171045U - - Google Patents
Info
- Publication number
- JPH01171045U JPH01171045U JP6750388U JP6750388U JPH01171045U JP H01171045 U JPH01171045 U JP H01171045U JP 6750388 U JP6750388 U JP 6750388U JP 6750388 U JP6750388 U JP 6750388U JP H01171045 U JPH01171045 U JP H01171045U
- Authority
- JP
- Japan
- Prior art keywords
- package
- resin
- sealed
- leads
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6750388U JPH01171045U (nl) | 1988-05-24 | 1988-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6750388U JPH01171045U (nl) | 1988-05-24 | 1988-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171045U true JPH01171045U (nl) | 1989-12-04 |
Family
ID=31292875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6750388U Pending JPH01171045U (nl) | 1988-05-24 | 1988-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171045U (nl) |
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1988
- 1988-05-24 JP JP6750388U patent/JPH01171045U/ja active Pending