JPH01171037U - - Google Patents
Info
- Publication number
- JPH01171037U JPH01171037U JP6787588U JP6787588U JPH01171037U JP H01171037 U JPH01171037 U JP H01171037U JP 6787588 U JP6787588 U JP 6787588U JP 6787588 U JP6787588 U JP 6787588U JP H01171037 U JPH01171037 U JP H01171037U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- circuit boards
- package
- film circuit
- features
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6787588U JPH01171037U (enExample) | 1988-05-23 | 1988-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6787588U JPH01171037U (enExample) | 1988-05-23 | 1988-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171037U true JPH01171037U (enExample) | 1989-12-04 |
Family
ID=31293218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6787588U Pending JPH01171037U (enExample) | 1988-05-23 | 1988-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171037U (enExample) |
-
1988
- 1988-05-23 JP JP6787588U patent/JPH01171037U/ja active Pending