JPH01171037U - - Google Patents

Info

Publication number
JPH01171037U
JPH01171037U JP6787588U JP6787588U JPH01171037U JP H01171037 U JPH01171037 U JP H01171037U JP 6787588 U JP6787588 U JP 6787588U JP 6787588 U JP6787588 U JP 6787588U JP H01171037 U JPH01171037 U JP H01171037U
Authority
JP
Japan
Prior art keywords
thick film
circuit boards
package
film circuit
features
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6787588U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6787588U priority Critical patent/JPH01171037U/ja
Publication of JPH01171037U publication Critical patent/JPH01171037U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP6787588U 1988-05-23 1988-05-23 Pending JPH01171037U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6787588U JPH01171037U (enrdf_load_stackoverflow) 1988-05-23 1988-05-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6787588U JPH01171037U (enrdf_load_stackoverflow) 1988-05-23 1988-05-23

Publications (1)

Publication Number Publication Date
JPH01171037U true JPH01171037U (enrdf_load_stackoverflow) 1989-12-04

Family

ID=31293218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6787588U Pending JPH01171037U (enrdf_load_stackoverflow) 1988-05-23 1988-05-23

Country Status (1)

Country Link
JP (1) JPH01171037U (enrdf_load_stackoverflow)

Similar Documents

Publication Publication Date Title
JPH01171037U (enrdf_load_stackoverflow)
JPH03126869U (enrdf_load_stackoverflow)
JPH0256168U (enrdf_load_stackoverflow)
JPH01130557U (enrdf_load_stackoverflow)
JPH0231141U (enrdf_load_stackoverflow)
JPH02106868U (enrdf_load_stackoverflow)
JPS642452U (enrdf_load_stackoverflow)
JPH0268451U (enrdf_load_stackoverflow)
JPH0353853U (enrdf_load_stackoverflow)
JPH01179445U (enrdf_load_stackoverflow)
JPH02125343U (enrdf_load_stackoverflow)
JPS62108277U (enrdf_load_stackoverflow)
JPS6236540U (enrdf_load_stackoverflow)
JPH01176937U (enrdf_load_stackoverflow)
JPH03112969U (enrdf_load_stackoverflow)
JPS61111160U (enrdf_load_stackoverflow)
JPH02129825U (enrdf_load_stackoverflow)
JPH0221745U (enrdf_load_stackoverflow)
JPH0170380U (enrdf_load_stackoverflow)
JPS62103259U (enrdf_load_stackoverflow)
JPH0463147U (enrdf_load_stackoverflow)
JPS6113943U (ja) 樹脂封止型半導体装置
JPS62197865U (enrdf_load_stackoverflow)
JPH0211342U (enrdf_load_stackoverflow)
JPH0316728U (enrdf_load_stackoverflow)