JPH01168721A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH01168721A JPH01168721A JP32770587A JP32770587A JPH01168721A JP H01168721 A JPH01168721 A JP H01168721A JP 32770587 A JP32770587 A JP 32770587A JP 32770587 A JP32770587 A JP 32770587A JP H01168721 A JPH01168721 A JP H01168721A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- epichlorohydrin
- bisphenol
- nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 32
- 239000000203 mixture Substances 0.000 title description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 12
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 7
- 229920000570 polyether Polymers 0.000 claims abstract description 7
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims abstract description 6
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 7
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- -1 Evolite 200P Chemical compound 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 description 1
- ZBOZDQZPUNULJG-UHFFFAOYSA-N 4-n-cyclohexylcyclohexane-1,1,4-triamine Chemical compound C1CC(N)(N)CCC1NC1CCCCC1 ZBOZDQZPUNULJG-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
- 102100035371 Chymotrypsin-like elastase family member 1 Human genes 0.000 description 1
- 101000737684 Homo sapiens Chymotrypsin-like elastase family member 1 Proteins 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000013441 quality evaluation Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明はエポキシ樹脂組成物に関し、詳しくは、ポツテ
ィング材（注型材）、被覆材等に用いられる、透明性と
耐衝撃性と耐熱性を有する低粘度なエポキシ樹脂組成物
に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an epoxy resin composition, and more specifically, it is used for potting materials, coating materials, etc., and has transparency, impact resistance, and heat resistance. The present invention relates to a low viscosity epoxy resin composition.
〈従来技術およびその問題点〉
エポキシ樹脂は作業性がよく、硬化物の機械特性に優れ
、多方面の分野で使用されている。<Prior art and its problems> Epoxy resins have good workability and excellent mechanical properties of cured products, and are used in many fields.
しかし、従来のエポキシ樹脂は硬くて脆いという欠点を
有し、その応用が限られている。However, conventional epoxy resins have the disadvantage of being hard and brittle, which limits their applications.
ボッティング材としては現在、エポキシ−脂肪族アミン
が使用されている。 しかしながら、この材料の耐熱
性は低く、また、耐衝撃性が低い。Epoxy-aliphatic amines are currently used as botting materials. However, this material has low heat resistance and low impact resistance.
これらの欠点の改良のため、従来、可撓性エポキシ樹脂
あるいは可撓性付与物を用いていたが、これらは粘度の
高いものが多く、従ってこれらを配合したものは、低粘
度性を要求されるポツティング材としては不向きである
。In order to improve these drawbacks, flexible epoxy resins or flexibility imparters have traditionally been used, but these often have high viscosity, so products containing them are required to have low viscosity. It is not suitable as a potting material.
〈発明の目的〉
本発明は上記事情に鑑みてなされたもので、耐衝撃性に
優れ、透明性と耐熱性を有する低粘度なエポキシ樹脂組
成物を提供することを目的とする。<Object of the Invention> The present invention was made in view of the above circumstances, and an object thereof is to provide a low-viscosity epoxy resin composition that has excellent impact resistance, transparency, and heat resistance.
〈発明の構成〉
本発明によれば、（ａ） ウレタン結合を有するエポ
キシ樹脂５〜７５重量％と、
（ｂ）ビスフェノールＡあるいはその誘導体に対し、エ
ピクロルヒドリンを重合させたエポキシ樹脂１０〜８５
重量％と、
（ｃ）含窒素芳香族エポキシ樹脂および／またはポリエ
ーテルジグリシジルエーテル１０〜７５重量％と、
（ｄ）脂肪族アミン２〜５０重量％とを含むことを特徴
とするエポキシ樹脂組成物が提供される。<Configuration of the Invention> According to the present invention, (a) 5 to 75% by weight of an epoxy resin having a urethane bond, and (b) 10 to 85% of an epoxy resin obtained by polymerizing epichlorohydrin to bisphenol A or a derivative thereof.
(c) 10-75% by weight of nitrogen-containing aromatic epoxy resin and/or polyether diglycidyl ether; (d) 2-50% by weight of aliphatic amine. things are provided.
以下に本発明について、詳述する。The present invention will be explained in detail below.
（ａ） ウレタン結合を有するエポキシ樹脂とは、例え
ば特開昭６０−２６０６１９号に示されるような、ポリ
オールの末端にウレタン結合とエポキシ基を有するもの
があげられ、柔軟性と弾性を有することが特徴で、本発
明においては耐衝撃性を向上させるために用いる。 具
体的には、例えばＦＥＸＯ１０１，０１０５，０１０６
，０１１１，０１１３，０１１６，０２０１，２４１３
、Ｇ１０５．５７００（以上いずれも横浜ゴム製）があ
る。(a) Epoxy resins having a urethane bond include those having a urethane bond and an epoxy group at the end of a polyol, such as those shown in JP-A No. 60-260619, and are said to have flexibility and elasticity. This feature is used in the present invention to improve impact resistance. Specifically, for example, FEXO101,0105,0106
,0111,0113,0116,0201,2413
, G105.5700 (all manufactured by Yokohama Rubber).
このウレタン結合を有するエポキシ樹脂は、５〜７５重
量％を用いるのがよい。 その理由は、５重量％未満で
は耐衝撃性を向上できないからであり、一方、７５重量
％を超えると粘度が高すぎ、注型用には不向きとなるか
らである。It is preferable to use 5 to 75% by weight of this epoxy resin having urethane bonds. The reason for this is that if it is less than 5% by weight, the impact resistance cannot be improved, whereas if it exceeds 75% by weight, the viscosity is too high, making it unsuitable for casting.
（ｂ）に用いられるビスフェノールＡの誘導体としては
、例えばビスフェノールＡＰ、ビスフェノールＦ等が含
まれる。 ビスフェノールＡあるいはその誘導体に対し
、エピクロルヒドリンを重合させたエポキシ樹脂として
は、例えばビスフェノールＡとエピクロルヒドリンの重
合物であるエピコート８０１．８０２．８０７．８０８
．８１５．８１９．８２７．８２８．８３４．８７１（
以上いずれもシェル化学製）、Ｄ、Ｅ、Ｒ，３１７，３
３ｏ１３３１．３３２．３３３．３３７．３８３．３２
４．３２５．３６１．３６５（以上いずれもダウケミカ
ル製） 、Ａｒａｌｄｉｔｅ ＧＹ ２５０゜２６０
、ＺａＯ，（以上いずれもチパガイギー製）、ＥＬＡ１
１５．１１７．１２１．１２７．１２８．１３４（以上
いずれも住友化学工業製）や、ビスフェノールＡの誘導
体であるビスフェノールＡＦとエピクロルヒドリンの重
合物であるＲ７１０、Ｒ７１１（いずれも三井石油化学
工業製）などがある。Examples of the bisphenol A derivative used in (b) include bisphenol AP, bisphenol F, and the like. Examples of epoxy resins made by polymerizing epichlorohydrin with bisphenol A or its derivatives include Epicote 801.802.807.808, which is a polymer of bisphenol A and epichlorohydrin.
．． 815.819.827.828.834.871(
All of the above are manufactured by Shell Chemical), D, E, R, 317, 3
3o1331.332.333.337.383.32
4.325.361.365 (all manufactured by Dow Chemical), Araldite GY 250°260
, ZaO, (all manufactured by Chipa Geigy), ELA1
15.117.121.127.128.134 (all manufactured by Sumitomo Chemical Industries), R710 and R711 (all manufactured by Mitsui Petrochemical Industries), which are polymers of bisphenol AF, which is a derivative of bisphenol A, and epichlorohydrin, etc. There is.
この（ｂ）のエポキシ樹脂は、（ａ）のウレタン結合を
有するエポキシ樹脂と相溶しゃすく、しかも低粘度のも
のが好ましい。 この（ｂ）のエポキシ樹脂は、透明度
を高め、粘度を下げ耐熱性を上げるために用いるもので
、１０〜８５重量％を用いるのがよい。 その理由は、
１０重量％未満では配合物の粘度が高く、透明性が悪い
からであり、一方、８５重量％を超えると、硬化物が脆
化しすぎるからである。The epoxy resin (b) is preferably one that is compatible with the urethane bond-containing epoxy resin (a) and has a low viscosity. This epoxy resin (b) is used to increase transparency, lower viscosity, and increase heat resistance, and is preferably used in an amount of 10 to 85% by weight. The reason is,
This is because if it is less than 10% by weight, the viscosity of the compound will be high and transparency will be poor, while if it exceeds 85% by weight, the cured product will become too brittle.
（ｃ）含窒素芳香族エポキシ樹脂および／またはポリエ
ーテルジグリシジルエーテルとしては、前記エポキシ樹
脂と相溶性に優れるものが好ましい。(c) As the nitrogen-containing aromatic epoxy resin and/or polyether diglycidyl ether, those having excellent compatibility with the epoxy resin are preferred.
含窒素芳香族エポキシ樹脂は、グリシジルアミンと呼ば
れるもので、例えばＮ、Ｎ’−ジグリシジルアニリン、
Ｎ、Ｎ’ −ジグリシジルトルイジン、トリグリシジル
−ｐ−アミノフェノール、テトラグリシジルジアミノジ
フェニルメタンなどがあり、具体的にはＧＯＴ、ＧＡＮ
（いずれも日本化薬製）、ＥＬＭ１２０、ＥＬＭ４３
４（いずれも住友化学製）などがある。The nitrogen-containing aromatic epoxy resin is called glycidylamine, such as N,N'-diglycidylaniline,
N,N'-diglycidyltoluidine, triglycidyl-p-aminophenol, tetraglycidyldiaminodiphenylmethane, etc., specifically GOT, GAN
(all manufactured by Nippon Kayaku), ELM120, ELM43
4 (all manufactured by Sumitomo Chemical).
ポリエーテルジグリシジルエーテルとしてはポリエーテ
ルとエピクロルヒドリンとを反応させて得られるもので
、例えばエボライト２００Ｐ、１５０ＯＮＰ、４００Ｐ
（以上いずれも共栄社油脂製）などがある。Polyether diglycidyl ether is obtained by reacting polyether with epichlorohydrin, such as Evolite 200P, 150ONP, 400P.
(All of the above are manufactured by Kyoeisha Yushi).
これら含窒素芳香族エポキシ樹脂および／またはポリエ
ーテルジグリシジルエーテルは、１０〜７５重量％を用
いるのがよい。 その理由は、１０重量％未満では粘度
が高すぎて注型できず、一方、７５重量％を超えると耐
衝撃性が向上しないからである。It is preferable to use 10 to 75% by weight of these nitrogen-containing aromatic epoxy resins and/or polyether diglycidyl ethers. The reason is that if it is less than 10% by weight, the viscosity is too high to be cast, while if it exceeds 75% by weight, the impact resistance will not improve.
（ｄ）脂肪族アミンは硬化剤として用いるもので、比較
的低温（８０℃程度）でエポキシ樹脂を硬化でき、しか
も混合物の粘度が低い。(d) Aliphatic amine is used as a curing agent, and can cure the epoxy resin at a relatively low temperature (about 80° C.), and the viscosity of the mixture is low.
本発明において使用できる脂肪族アミンとしては、例え
ばイソホロンジアミン、１．３−ビスアミノシクロヘキ
サン、メンセンジアミン、末端アミノポリプロピレンオ
キサイド（ジエファーミン；三井テキサコ製）、ビス（
４−アミノ−３−メチルシクロヘキシル）メタン（ラロ
ミンＣ−２８０、ＢＡＳＦ製）、ジアミノジシクロヘキ
シルアミン（ワンダミンＨＭ；新日本理化製）、芳香環
を含む脂肪族アミン（例えばメタキシリレンジアミン）
などがある。Examples of aliphatic amines that can be used in the present invention include isophorone diamine, 1,3-bisaminocyclohexane, menthene diamine, terminal amino polypropylene oxide (Diefamine; manufactured by Mitsui Texaco), bis(
4-amino-3-methylcyclohexyl)methane (Laromin C-280, manufactured by BASF), diaminodicyclohexylamine (Wandamine HM; manufactured by Shinnihon Rika), aliphatic amines containing aromatic rings (e.g. metaxylylene diamine)
and so on.
脂肪族アミンの量は２〜５０重量％用いるのがよい。
その理由は、上記範囲外の量を用いると硬化不良や耐水
劣化を引起すからである。The amount of aliphatic amine used is preferably 2 to 50% by weight.
The reason is that using an amount outside the above range will cause poor curing and deterioration of water resistance.
〈実施例〉 次に、本発明を実施例に基づいて更に詳細に説明する。<Example> Next, the present invention will be explained in more detail based on examples.
［実施例１〜４コ
第１表に示した配合により、実施例１〜４の樹脂を配合
し、その特性（粘度、硬化物特性）を同表に示した。[Examples 1 to 4] The resins of Examples 1 to 4 were blended according to the formulations shown in Table 1, and their properties (viscosity, cured product properties) are shown in the same table.
これら樹脂は室温で混合し、脱泡後、モールドに流し込
んで所定の時間反応させて硬化させ、第１表に示す品質
評価を行なった。These resins were mixed at room temperature, degassed, poured into a mold, reacted for a predetermined period of time, and cured.The quality evaluations shown in Table 1 were performed.
硬化物の耐衝撃性は、樹脂板にワッシャーリングを埋め
込み、０℃と＋８０℃の熱ショックを３０回かけた後の
割れの有無により評価した。The impact resistance of the cured product was evaluated by the presence or absence of cracks after embedding a washer ring in a resin plate and applying heat shock at 0°C and +80°C 30 times.
さらに、樹脂板の耐熱性を示すために粘弾性特性（ＤＭ
Ａスペクトルの剪断弾性率）を測定し、第１図にその結
果を示した。Furthermore, in order to show the heat resistance of the resin plate, we also added viscoelastic properties (DM
The shear modulus of the A spectrum was measured, and the results are shown in FIG.
［比較例１〜４］
第１表に示した配合により、比較例１〜４の樹脂を配合
し、実施例と同様の評価をした。[Comparative Examples 1 to 4] The resins of Comparative Examples 1 to 4 were blended according to the formulations shown in Table 1, and evaluated in the same manner as in the Examples.
さらに、比較例１については、粘弾性特性（ＤＭＡスペ
クトルの剪断弾性率）を測定した。Furthermore, for Comparative Example 1, the viscoelastic properties (shear modulus of DMA spectrum) were measured.
第１表および第１図から明らかなように、実施例１〜４
では低粘度で注型可能であり、硬化物は透明で、優れた
耐衝撃性と耐熱性を有することがわかる。As is clear from Table 1 and FIG. 1, Examples 1 to 4
It can be seen that it has a low viscosity and can be cast, and the cured product is transparent and has excellent impact resistance and heat resistance.
一方、実施例に比べ、比較例１では耐熱性が劣り、比較
例２〜４では硬化物が脆く、耐衝撃性が低かった。On the other hand, compared to Examples, Comparative Example 1 had inferior heat resistance, and Comparative Examples 2 to 4 had brittle cured products and low impact resistance.
〈発明の効果〉
以上詳述したように本発明によれば、低粘度で注型可能
であり、硬化物が透明であり、優れた耐衝撃性と耐熱性
を有するエポキシ樹脂組成物が容易に提供されるので、
ボッティング材、被覆材等に広く用いることができると
いう効果がある。<Effects of the Invention> As detailed above, according to the present invention, it is possible to easily produce an epoxy resin composition that has low viscosity, can be cast, has a transparent cured product, and has excellent impact resistance and heat resistance. Because it is provided,
It has the advantage that it can be widely used for botting materials, coating materials, etc.
第１図は、樹脂板の粘弾性特性を示すグラフである。 FIG. 1 is a graph showing the viscoelastic properties of a resin plate.
Claims (1)
５重量％と、 （ｂ）ビスフェノールＡあるいはその誘導体に対し、エ
ピクロルヒドリンを重合させたエポキシ樹脂１０〜８５
重量％と、 （ｃ）含窒素芳香族エポキシ樹脂および／またはポリエ
ーテルジグリシジルエーテル１０〜７５重量％と、 （ｄ）脂肪族アミン２〜５０重量％とを含むことを特徴
とするエポキシ樹脂組成物。(1) (a) Epoxy resins 5 to 7 with urethane bonds
5% by weight, and (b) epoxy resin 10-85 made by polymerizing epichlorohydrin with bisphenol A or its derivatives.
(c) 10-75% by weight of nitrogen-containing aromatic epoxy resin and/or polyether diglycidyl ether; (d) 2-50% by weight of aliphatic amine. thing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32770587A JPH01168721A (en) | 1987-12-24 | 1987-12-24 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32770587A JPH01168721A (en) | 1987-12-24 | 1987-12-24 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01168721A true JPH01168721A (en) | 1989-07-04 |
Family
ID=18202062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32770587A Pending JPH01168721A (en) | 1987-12-24 | 1987-12-24 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01168721A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018036506A1 (en) * | 2016-08-25 | 2018-03-01 | 惠柏新材料科技（上海）股份有限公司 | Epoxy resin composition with rapid curing and low linear shrinkage |
-
1987
- 1987-12-24 JP JP32770587A patent/JPH01168721A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018036506A1 (en) * | 2016-08-25 | 2018-03-01 | 惠柏新材料科技（上海）股份有限公司 | Epoxy resin composition with rapid curing and low linear shrinkage |
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