JPH01168645U - - Google Patents
Info
- Publication number
- JPH01168645U JPH01168645U JP6170188U JP6170188U JPH01168645U JP H01168645 U JPH01168645 U JP H01168645U JP 6170188 U JP6170188 U JP 6170188U JP 6170188 U JP6170188 U JP 6170188U JP H01168645 U JPH01168645 U JP H01168645U
- Authority
- JP
- Japan
- Prior art keywords
- heat insulating
- insulating board
- flange portion
- widthwise ends
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6170188U JPH01168645U (de) | 1988-05-11 | 1988-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6170188U JPH01168645U (de) | 1988-05-11 | 1988-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01168645U true JPH01168645U (de) | 1989-11-28 |
Family
ID=31287350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6170188U Pending JPH01168645U (de) | 1988-05-11 | 1988-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01168645U (de) |
-
1988
- 1988-05-11 JP JP6170188U patent/JPH01168645U/ja active Pending