JPH01166881A - Method for reflowing solder - Google Patents
Method for reflowing solderInfo
- Publication number
- JPH01166881A JPH01166881A JP32532887A JP32532887A JPH01166881A JP H01166881 A JPH01166881 A JP H01166881A JP 32532887 A JP32532887 A JP 32532887A JP 32532887 A JP32532887 A JP 32532887A JP H01166881 A JPH01166881 A JP H01166881A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- medium
- soldering
- soldered
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 14
- 229910000679 solder Inorganic materials 0.000 title abstract description 8
- 238000005476 soldering Methods 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 238000009835 boiling Methods 0.000 claims abstract description 8
- 238000009834 vaporization Methods 0.000 claims description 4
- 230000008016 vaporization Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052799 carbon Inorganic materials 0.000 abstract description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical class FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- QLOAVXSYZAJECW-UHFFFAOYSA-N methane;molecular fluorine Chemical compound C.FF QLOAVXSYZAJECW-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- DAFIBNSJXIGBQB-UHFFFAOYSA-N perfluoroisobutene Chemical group FC(F)=C(C(F)(F)F)C(F)(F)F DAFIBNSJXIGBQB-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
電子部品の製造に利用できるはんだリフロ一方法に関し
、
室温から３００℃付近まで連続的に変化する任意の温度
ではんだ付けすることを目的とし、はんだ付けすべき部
材を媒体の気体に接触させ、この媒体の蒸発潜熱を利用
するはんだリフロ一方法であって、密閉容器内で媒体を
加熱して、媒体この温度の媒体の気体にはんだ付けすべ
き部材を接触させてはんだ付けするように構成する。[Detailed Description of the Invention] [Summary] Regarding a soldering reflow method that can be used in the manufacture of electronic components, the purpose is to perform soldering at any temperature that continuously changes from room temperature to around 300°C. This is a soldering reflow method in which the components to be soldered are brought into contact with a medium gas and the latent heat of vaporization of this medium is utilized. The components are configured to be brought into contact and soldered.
本発明は、電子部品の製造に利用できる、はんだリフロ
一方法に関する。The present invention relates to a solder reflow method that can be used for manufacturing electronic components.
蒸発潜熱を利用するはんだリフロ一方法は、はんだ付け
すべき部材を非酸化性雰囲気中で高速かつ均一に加熱す
ることができる優れた方法である。A solder reflow method that utilizes latent heat of vaporization is an excellent method that can heat components to be soldered quickly and uniformly in a non-oxidizing atmosphere.
従来はこれを開放容器で行なっていた。加熱は、蒸気が
凝縮して放出する潜熱に依存するので、加熱温度を変え
るには各種の沸点を有する異なる液体を必要とした。こ
の方法に使用できる液体は、不燃性および非酸化性に加
えて、高温度における安定性が要求されるので、主とし
てフッ化炭素系化合物を使用するが、その沸点は段階的
にＣｂＦ＋ ａ５６℃、Ｃ７Ｆ１６８０℃などがあり、
常温で液体のものでも゛２５０℃程度である。１″気圧
で２００℃以上の高温にすると熱分解が始まり有害な化
合物も生じる。Conventionally, this was done in an open container. Heating depended on the latent heat released by the vapor as it condensed, so varying the heating temperature required different liquids with different boiling points. The liquid that can be used in this method is required to be stable at high temperatures in addition to being non-flammable and non-oxidizing, so fluorocarbon compounds are mainly used, but the boiling point of the liquid is CbF+ a56℃, There are C7F1680℃, etc.
Even if it is liquid at room temperature, the temperature is about 250°C. When heated to a high temperature of 200°C or higher at 1" atmospheric pressure, thermal decomposition begins and harmful compounds are also produced.
任意の沸点を有する液体を選択することができな。It is not possible to choose a liquid with an arbitrary boiling point.
かった。won.
本発明は、室温から３００℃付近まで連続的に変化する
任意の温度ではんだ付けすることを目的とする。The object of the present invention is to perform soldering at any temperature that continuously changes from room temperature to around 300°C.
上記問題点は、はんだ付けすべき部材を媒体の気体に接
触させ、この媒体の蒸発潜熱を利用するはんだリフロ一
方法であって、密閉容器内で媒体だ付けすべき部材を接
触させてはんだ付けすることを特徴とするはんだリフロ
一方法によって解決することができる。The above problem is a soldering reflow method in which the components to be soldered are brought into contact with a medium gas and the latent heat of vaporization of this medium is utilized. This problem can be solved by a solder reflow method characterized by:
加熱媒体として、たとえばフン化炭素画品名ＦＣ−４３
（３Ｍ社）を使用すれば、１気圧であれば沸点が１５５
℃であるが、密閉容器内でさらに加熱すれば、容器内の
圧力が上昇して１８０℃で２気圧を示し、この間に温度
は連続的に上昇する。さらに、これより分子量の大きい
フン化炭素系化合物を使用すれば、３００℃付近まで連
続的に変化するはんだ付は温度を得ることができる。As a heating medium, for example, fluorinated carbon product name FC-43
(3M Company), the boiling point is 155 at 1 atm.
℃, but if the container is heated further within the closed container, the pressure inside the container will rise to 2 atm at 180°C, and the temperature will rise continuously during this time. Furthermore, if a fluorinated carbon compound having a larger molecular weight than this is used, it is possible to obtain a soldering temperature that continuously changes up to around 300°C.
直径３００ ｍｍ、深さ６００鶴の円筒形リフロー装置
本体１は、その内部の下方にヒータ３を設け。内部の中
程にシールリング付き支持体４によって吊下げられた作
業台５を設け、支持体４より下方の空間を外界から遮断
する。作業台５は温度センサ６を設け、はんだ付けすべ
き部材７を載せる。なお本体ｌの上方に連通ずる直径４
５０ｍのトラップ室２には冷却パイプ８を設けた。A cylindrical reflow apparatus main body 1 with a diameter of 300 mm and a depth of 600 mm is provided with a heater 3 in the lower part of its interior. A workbench 5 suspended by a support 4 with a seal ring is provided in the middle of the interior, and the space below the support 4 is isolated from the outside world. A workbench 5 is provided with a temperature sensor 6 and on which members 7 to be soldered are placed. In addition, the diameter 4 that communicates with the upper part of the main body l
A cooling pipe 8 was provided in the 50 m long trap chamber 2.
まず、はんだリフロー装置ｌに、作業媒体９として、フ
ッ化炭素、商品名ＦＣ−４３（３Ｍ社）５１を充填し、
ヒータ３により加熱して、１気圧における沸点１５５℃
に保った。First, a solder reflow device 1 is filled with fluorocarbon, trade name FC-43 (3M Company) 51 as a working medium 9,
Heated with heater 3 to a boiling point of 155°C at 1 atm.
I kept it.
次に、はんだペーストを塗布した電子部品を基板上に位
置合わせした試料７を作業台５に取付けて、リフロー装
置１内に降下させた。作業台５は支持体４によって外界
と遮断させた。作業台５上の温度センサ６で温度を検知
しながら、はんだ付は温度１８０℃に達するまで、加熱
した。この温度に５分保った後にヒータ３の加熱を止め
、作業台５をトラップ室２まで上昇させると、大気圧に
減圧されて、試料７上で凝縮して付着した媒体が蒸発し
て除去された。トラップ室２内の冷却水パイプ８に９０
℃の熱水を循環させて、蒸発した媒体の気体１０を凝縮
させて回収した。Next, the sample 7 in which the electronic component coated with the solder paste was aligned on the board was attached to the workbench 5 and lowered into the reflow apparatus 1. The workbench 5 was isolated from the outside world by the support 4. While detecting the temperature with a temperature sensor 6 on the workbench 5, the soldering process was heated until the temperature reached 180°C. After maintaining this temperature for 5 minutes, heating of the heater 3 is stopped and the workbench 5 is raised to the trap chamber 2, the pressure is reduced to atmospheric pressure and the medium that has condensed and adhered on the sample 7 is evaporated and removed. Ta. 90 to the cooling water pipe 8 in the trap chamber 2
℃ hot water was circulated to condense and recover the evaporated medium gas 10.
本発明の方法により、室温から３００℃までの任意のは
んだ付は温度を選択することが可能になり、低粘度の低
沸点液体を使用して、高温度のはんだ付けができるので
、はんだ付けした部材の液切れが良好となり、媒体の損
失を防止してコストの低下を実現することができた。な
お、一般に媒体であるぶつ化炭素は、１気圧、２００℃
以上において熱分解量が多くなり、ＰＰｂオーダーの有
毒なパーフルオロイソブチレンＣａＦｓを発生するが、
高圧に保つためこれを防止することができた。By the method of the present invention, it is possible to select any soldering temperature from room temperature to 300℃, and high temperature soldering can be performed using a low viscosity, low boiling point liquid. The liquid draining of the member was improved, and it was possible to prevent loss of the medium and reduce costs. In addition, carbon buttomide, which is a medium, is generally used at 1 atm and 200°C.
In the above case, the amount of thermal decomposition increases and toxic perfluoroisobutylene CaFs on the order of PPb is generated.
This could be prevented by keeping the pressure high.
第１図は本発明の方法を実施するはんだリフロー装置の
説明図である。
１・・・リフロー装置本体、２・・・トラップ室、３・
・・ヒータ、
４・・・シールリング付き支持体、
５・・・作業台、 ６・・・温度センサ、７
・・・はんだ付けすべき部材、
８・・・冷却パイプ、 ９・・・作業液体、１０・
・・加熱蒸気。FIG. 1 is an explanatory diagram of a solder reflow apparatus that implements the method of the present invention. 1... Reflow apparatus main body, 2... Trap chamber, 3...
...Heater, 4...Support with seal ring, 5...Work table, 6...Temperature sensor, 7
... Components to be soldered, 8. Cooling pipe, 9. Working liquid, 10.
・Heating steam.
Claims (1)
の媒体の蒸発潜熱を利用するはんだリフロー方法であっ
て、密閉容器内で媒体を加熱して、媒体の液体と気体と
が共存する範囲で１気圧の沸点より高い温度とし、この
温度の媒体の気体にはんだ付けすべき部材を接触させて
はんだ付けすることを特徴とするはんだリフロー方法。1. A soldering reflow method in which the components to be soldered are brought into contact with a gaseous medium and the latent heat of vaporization of this medium is utilized, and the medium is heated in a closed container to the extent that the liquid medium and gas coexist. A soldering reflow method characterized in that the temperature is higher than the boiling point of 1 atm, and the components to be soldered are brought into contact with a medium gas at this temperature and soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62325328A JP2509266B2 (en) | 1987-12-24 | 1987-12-24 | Solder reflow method and reflow device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62325328A JP2509266B2 (en) | 1987-12-24 | 1987-12-24 | Solder reflow method and reflow device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01166881A true JPH01166881A (en) | 1989-06-30 |
| JP2509266B2 JP2509266B2 (en) | 1996-06-19 |
Family
ID=18175585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62325328A Expired - Fee Related JP2509266B2 (en) | 1987-12-24 | 1987-12-24 | Solder reflow method and reflow device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2509266B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH049271A (en) * | 1990-04-27 | 1992-01-14 | Seiko Instr Inc | Vapor soldering device |
| JP2010153656A (en) * | 2008-12-25 | 2010-07-08 | Tdk-Lambda Corp | Soldering device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52152847A (en) * | 1976-06-14 | 1977-12-19 | Ibm | Steam bonding method |
| JPS5619973A (en) * | 1979-05-18 | 1981-02-25 | Atomic Energy Authority Uk | Soldering device |
| JPS5992164A (en) * | 1982-10-12 | 1984-05-28 | ジ・エイチテイシ−・コ−ポレ−シヨン | Soldering device |
-
1987
- 1987-12-24 JP JP62325328A patent/JP2509266B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52152847A (en) * | 1976-06-14 | 1977-12-19 | Ibm | Steam bonding method |
| JPS5619973A (en) * | 1979-05-18 | 1981-02-25 | Atomic Energy Authority Uk | Soldering device |
| JPS5992164A (en) * | 1982-10-12 | 1984-05-28 | ジ・エイチテイシ−・コ−ポレ−シヨン | Soldering device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH049271A (en) * | 1990-04-27 | 1992-01-14 | Seiko Instr Inc | Vapor soldering device |
| JP2010153656A (en) * | 2008-12-25 | 2010-07-08 | Tdk-Lambda Corp | Soldering device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2509266B2 (en) | 1996-06-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |