JPH01166410A - Multicore parallel adhesive wire - Google Patents

Abstract

PURPOSE:To enhance adhesive force between core wires as well as facilitate the separation therebetween by incorporating a specified amount of either one or more of higher fatty acid, terminal reactive silicone oil or terminal reactive fluorine oil into an adhesive resin composition. CONSTITUTION:As an adhesive resin composition is used either alone or in combination of two or more of polyamide, polyvinyl butyral, epoxy resin or the like, or a composition incorporating either alone or two or more of amino resin, stabilized isocyanate, triazine resin, phenol resin or the like into the above mentioned resin. Into 100 pts.wt. of this composition is incorporated 0.1-20 pts.wt. of either alone or two or more of higher fatty acid, terminal reactive silicone oil, terminal reactive fluorine oil so as to obtain the adhesive resin composition. Therefore, besides sufficient adhesive force between core wires, the separation of the core wires at the terminal of a multicore parallel adhesive wire can be easily performed, thereby, upon the separation, eliminating any breakage in the insulating layers of the core wires. Furthermore, the surfaces of adhesive layers have surface lubrication property so as to be hard to generate machining flaw upon winding the wire.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field)
This relates to a multi-core parallel adhesive wire used as l1l.

(Prior Art) FIG. 1 shows an example of such a multicore parallel bonded wire, and the reference numeral 1 in the figure is an insulated core wire. This insulated core wire 1 is formed by applying an insulating paint made of polyurethane, polyvinyl formal, polyester, polyester imide, polyhydanthone, polyamide imide, polyester amide imide, polyhydantoin ester, polyester amide, etc. onto the conductor 2 and baking it to form an insulating layer 3. This is what happens.

A plurality of insulated core wires 1 (here, five wires) are bundled in parallel in a line, and bonded and integrated with adhesive WIJ4 to form a multicore parallel bonded wire. The adhesive resin composition constituting the adhesive layer 4 is a resin such as polyvinyl butyral, epoxy resin, polyester, polyhydroxy ether, polyvinyl formal, polyamide, or an amino resin, isocyanate, trihydroxyethyl isocyanate, triazine resin, or phenol resin. A resin composition containing phenol formaldehyde resin or the like is used.

[Problem that the invention seeks to solve]

In such a multicore parallel bonded wire, it is necessary to separate the insulated core wires 1 when processing the terminals, but since the adhesive layer 4 is firmly bonded to the core wire 1, the core wires 1 are separated. Separation is difficult, and sometimes the insulation F43 is taken by the adhesive layer 4, as shown in FIG. 2, and the insulation layer 3 is damaged and the conductor 2 is exposed.

For this reason, conventionally, a release agent such as wax, wax, or WJ'Wi oil is applied to the surface of the insulated core wire 1 in advance, and then an adhesive resin composition is applied to bond and integrate the insulated core wires 1... A method is being taken to do so.

However, this application of a mold release agent has disadvantages in that the adhesive strength between the insulated core wires 1 is reduced or varies, and also causes a defect in the appearance of the multi-filamentary parallel bonded wire.

[Means for solving problems]

In this invention, the above-mentioned problems are solved by using an adhesive resin composition containing a higher fatty acid, a terminally reactive silicone oil, and a terminally reactive fluorine oil as the adhesive layer.

The multicore parallel adhesive wire of the present invention uses polyamide, polyvinyl butyral, polyvinyl butyral, polyamide, polyvinyl butyral,
Epoxy resin, polyester, polyhydroxy ether, or a combination of two or more of them, amino resin, stabilized isocyanate, triazine resin,
Composition 10 containing one or more of phenol resin and phenol formaldehyde resin
A product containing 0.1 to 20 parts by weight of one or more of higher fatty acids, terminally reactive silicone oils, and terminally reactive fluorine oils per 0 parts by weight is used. It is characterized by the fact that it uses an adhesive resin composition that is used in combination with a higher fatty acid, a terminally reactive silicone oil, and a terminally reactive fluorine oil.

The base polymer of the adhesive resin composition in this invention may be one or more blended polymers of polyamide (nylon), polyvinyl butyral, epoxy resin, polyester, and polyhydroxy ether, or a blend polymer of two or more thereof, or a blend polymer of two or more of polyamide (nylon), polyvinyl butyral, epoxy resin, polyester, and polyhydroxy ether, or a blend polymer of two or more of polyamide (nylon), polyvinyl butyral, epoxy resin, polyester, and polyhydroxy ether, or One or a mixture of two or more of thermosetting resins such as amino resin, stabilized isocyanate, triazine resin, phenol resin, and phenol formaldehyde resin is used. When the thermosetting resin is blended, the blending ratio in the base polymer is about 1 to 80% by weight.

The higher fatty acids added to this base polymer include:
Fatty acids having about 4 to 34 carbon atoms and their derivatives are used. Examples of saturated fatty acids include caproic acid, caprylic acid, capric acid, lauric acid, palmitic acid, stearic acid, arachidic acid, and behenic acid. These esters and acid halides are used, and examples of the unsaturated fatty acids include oleic acid and linoleic acid, and as the derivatives, these esters and acid halides are used.

In addition, the terminal-reactive silicone oil added to the base polymer has the general formula (I) (where He represents a methyl group and X represents -(CHz
) l 0H1-(C1lz) l NlI2, -I
f, -CIl=CI+2, -C3If 60C2H40
il, -C2HB O-Cl1z, -Ctl-CH゛. 'OC1+.

m and n are integers of 1 or more.

), or a compound having a reactive group at both ends, or a compound represented by the general formula (II) (where He, X, III, n
is the same as formula (I). ), is a compound having a reactive group at one end.

Typical specific examples of this terminal-reactive silicone oil include those having reactive groups at both ends: Silablane FM1111, 1121, 1125, 223L, 2241, 2242, manufactured by Chisso Corporation; Same 33
11, 3321, 3325, 441L 4421
, 4425, 5511, 552L 5525, Silicone oil X-22-16 manufactured by Shin-Etsu Chemical Co., Ltd.
0AS, X-22-160A, jiJX-22-1
608, X-22-160G, X-22-161
AS, X-22-161A1
O411, 0421, 0511, 0521, 0
525, 0711, 0721, 0725, etc., and these may be used alone or in combination of two or more.

Furthermore, as the terminal-reactive fluorine oil, general formula (III
) 1100c (C112) JCs Ha '7-
It is a fluorine-containing compound represented by a + * (III) (J is an integer of 2 to 15, a is an integer of 0 to 6), and specifically, HF-IC manufactured by Domura Oil Co., Ltd. used.

These higher fatty acids, terminally reactive silicone oils, and terminally reactive fluorine oils are used alone or as a mixture of two or more of them and are added to the above base polymer.The blending amount of these base polymers is based on 100 parts by weight of the base polymer. If the fit is less than 0.11 fit, the terminal segments of the multifilamentary parallel bonded wire will not have good properties and surface lubricity, and if it exceeds 20 fit, the line between the core wires will This causes inconveniences such as insufficient adhesive strength and poor appearance of multi-core parallel adhesive lines.

The method for manufacturing the multi-filamentary parallel adhesive wire of the present invention is as follows: 1. An adhesive resin composition prepared by blending a predetermined amount of higher fatty acid, terminal-reactive silicone oil, or terminal-reactive fluorine oil with base polymer E. The material is dissolved in a mixture of solvent and thinner such as cresol, cyclohexanone, pyrrolidone, phenol, xylene, and solvent naphtha to make an adhesive varnish, and this adhesive varnish is applied onto the core wire and baked to obtain a B stage (semi-hardened state). Thereafter, a method of arranging a plurality of these core wires in parallel and adhering them to each other and integrating them by means such as heating or solvent activation, or arranging a plurality of core wires in parallel, applying the above-mentioned adhesive varnish to this and baking it, There are methods such as gluing and integrating.

In such multicore parallel adhesive wires, the adhesive resin composition forming the adhesive layer contains specific amounts of higher fatty acids, terminally reactive silicone oil, and terminally reactive fluorine oil, so that the bond between the core wires is Although the adhesive force is sufficient, the core wires can be easily separated at the ends of the multi-core parallel bonded wire, and the insulating layer of the core wires will not be damaged during separation.

Furthermore, the surface of the contact layer also has surface lubricity, making it difficult for processing scratches to occur during winding.

〔Example〕

(Example 1) To 100 parts by weight of polyvinyl butyral resin, 5 parts of silicone
0 parts by weight and 50 parts by weight of xylene were added and mixed at 60°C for 2 hours, followed by stirring at 90°C for 3.5 hours to obtain a transparent adhesive varnish.

(Example 2) To 100 parts by weight of polyamide resin, 5 parts of silicone FMO521 manufactured by Chisso@J and 400 parts of m-cresol were added.
After adding parts by weight and stirring at 120°C for 6 hours, the mixture was heated to 160°C.
The mixture was stirred for 2 hours to obtain a brown transparent adhesive varnish.

(Example 3) Shin-Etsu Chemical ■5 parts of polyvinyl butyral resin 100 items
5 parts of silicone X-22-1618, 20 parts of isocyanate MDI, 20 parts of cyclohexanone
1 part of flff and 100 parts by weight of xylene were added and stirred at 90°C for 1 hour to obtain a transparent adhesive varnish.

(Example 4) To 100 parts by weight of phenoxy resin, 5 parts of silicone FMO421 manufactured by Chisso ■ and 25 parts of isocyanate MD1 were added.
Parts by weight, 200 parts of cyclohexanone, 15 parts of xylene
0 weight R part was added and stirred at 80°C to obtain a transparent adhesive varnish.

(Example 5) 20 parts by weight of epoxy resin was added to Chisso's Silico:/F.
M3321 (7) Quadruple fLilFMO511 (7) 2f
450 parts by weight of m-cresol was added to the fi hanging part and heated at 70°C.
for 3 hours, then heated and stirred at 160°C for 4 hours, and heated to 50°C.
After that, 601ffi parts of polyamide resin was added, and 1.
After stirring for 5 hours, a brown transparent adhesive varnish was obtained.

(Example 6) 100 parts by weight of polyamide resin, 10 parts by weight of silicone FMO525 manufactured by Chisso ■, and 550 parts by weight of cresol.
1 part was added and stirred at 70°C for 8 hours to obtain a brown transparent adhesive varnish.

(Example 7) 100fflffi parts of polyvinyl butyral resin,
5-fold ω part of Hexistone + 1 Pa2 manufactured by Hexistwax S (montan wax acid), cyclohexanone 200-fold ω part
100 parts by weight of solvent naphtha were added and heated at 135° C. for 4 hours to obtain a brown transparent adhesive varnish.

(Example 8) To 100 parts by weight of polyvinyl butyral resin, 200 parts by weight of terminal-reacted fluorinated oil HF-IC5 manufactured by Okamura Oil Co., Ltd., 200 parts by weight of cyclohexanone, and 100 parts by weight of solvent naphtha were added and heated at 135°C for 4 hours. After stirring, a brown transparent adhesive varnish was obtained.

The varnishes of Examples 1 to 8 above were applied and baked on the outer periphery of seven 0.1 mφ urethane enameled wires arranged in parallel.

(Comparative Example 1) Seven 0.1 mφ urethane enameled wires coated with liquid paraffin on the outermost periphery were arranged in parallel, and 100 parts by weight of polyamide resin and 400 parts by weight of m-cresol were applied to the outer periphery of the wires.
Adhesive varnish mixed with weight parts was applied and baked.

(Comparative Example 2) Same as Comparative Example 1 except that instead of liquid paraffin, microcrystan wax 2x M part dissolved in heptane 98x dark part was used.

(Comparative Example 3) Shi! Same as Example 1 except that JD-ON X-22-160AS was used in an amount of 0.05 parts by weight.

(Comparative Example 4) Same as Example 1 except that 301 ffi parts of Silicon D-ON X-22-160AS were used.

In this case, the varnish was cloudy and a uniform adhesive varnish could not be obtained.

Regarding the multi-core parallel bonded wire obtained as described above, the adhesive force between the cores, the core wire valve ll! The presence or absence of damage to the subsequent insulating layer, flexibility, and coefficient of static friction of the surface were evaluated.

The results are shown in the attached table.

As is clear from the attached table, it can be seen that the multifilamentary parallel bonded wire of the present invention has sufficiently high adhesion between the cores, can be easily separated, and has excellent surface lubricity.

〔Effect of the invention〕

As explained above, the multifilamentary parallel adhesive wire of the present invention has an adhesive resin composition that forms the adhesive layer containing one of higher fatty acids, terminally reactive silicone oil, and terminally reactive fluorine oil.
Since it is a mixture of a specific number of species or more, the adhesive force between the core wires is sufficiently high, and the core wires can be easily separated, and the insulating layer of the core wires will not be damaged when the core wires are separated. Also,
The surface of the adhesive layer has lubricity and is not subjected to processing 10 during winding processing. Furthermore, compared to the conventional method in which a release agent is applied to the core wire and then an adhesive layer is formed, the variation in adhesive strength between the core wires is smaller, and the manufacturing process can be shortened. Can be done. .

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view showing an example of a multi-core parallel bonded wire according to the present invention, and FIG. 2 is a schematic cross-sectional view 1j showing the state of insulation layer damage when the cores of the multi-core parallel bonded wire are separated. . 1... Insulated core wire 2... Conductor 3... Insulating layer 4... Contact layer

Claims (1)

[Claims] A multi-filament parallel bonded wire formed by bonding a plurality of insulated core wires in parallel with an adhesive resin composition, wherein the adhesive resin composition is made of polyamide, polyvinyl butyral, epoxy resin, polyester, polyhydroxyether. Any one or a combination of two or more resins, or an amino resin, a stabilized isocyanate, a triazine resin,
Composition 10 containing one or more of phenol resin and phenol formaldehyde resin
0.1 to 2 parts by weight of one or more of higher fatty acids, terminally reactive silicone oils, and terminally reactive fluorine oils.
A multi-filamentary parallel adhesive wire characterized in that it contains 0 parts by weight.