JPH01165642U - - Google Patents
Info
- Publication number
- JPH01165642U JPH01165642U JP6267288U JP6267288U JPH01165642U JP H01165642 U JPH01165642 U JP H01165642U JP 6267288 U JP6267288 U JP 6267288U JP 6267288 U JP6267288 U JP 6267288U JP H01165642 U JPH01165642 U JP H01165642U
- Authority
- JP
- Japan
- Prior art keywords
- detecting
- sensor
- semiconductor device
- aluminum tube
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
- Lasers (AREA)
Description
第１図イはアルミチユーブを示す正面図、第１
図ロは本考案の一実施例を示す側面図、第１図ハ
はリード検出センサとモールド検出センサからの
出力信号のタイミング図、第２図イはアルミチユ
ーブを示す正面図、第２図ロは従来例を示す側面
図、第２図ハはリード検出パルスと半導体デバイ
スの位置関係を示す図、第２図ニはリード検出ミ
スが発生した場合の半導体デバイスの位置関係を
示す図である。
１……アルミチユーブ、２……半導体デバイス
、３……リード検出センサ、４……モールド検出
センサ。
Figure 1 A is a front view showing the aluminum tube.
Figure B is a side view showing an embodiment of the present invention, Figure 1C is a timing diagram of output signals from the lead detection sensor and mold detection sensor, Figure 2A is a front view showing the aluminum tube, and Figure 2B is a side view showing an embodiment of the present invention. 2 is a side view showing a conventional example, FIG. 2C is a diagram showing the positional relationship between the lead detection pulse and the semiconductor device, and FIG. 2D is a diagram showing the positional relationship of the semiconductor device when a lead detection error occurs. 1...Aluminum tube, 2...Semiconductor device, 3...Lead detection sensor, 4...Mold detection sensor.
Claims (1)
プの半導体デバイスの位置を検出する装置におい
て、デバイスのリード部を検出するセンサーと、
該デバイスのモールド部を検出するセンサーとを
有することを特徴とする半導体デバイスの位置検
出装置。 A device for detecting the position of a DIP type semiconductor device housed in an aluminum tube, comprising: a sensor for detecting a lead portion of the device;
1. A position detection device for a semiconductor device, comprising a sensor for detecting a mold portion of the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6267288U JPH0625012Y2 (en) | 1988-05-12 | 1988-05-12 | Position detector for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6267288U JPH0625012Y2 (en) | 1988-05-12 | 1988-05-12 | Position detector for semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01165642U true JPH01165642U (en) | 1989-11-20 |
| JPH0625012Y2 JPH0625012Y2 (en) | 1994-06-29 |
Family
ID=31288242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6267288U Expired - Lifetime JPH0625012Y2 (en) | 1988-05-12 | 1988-05-12 | Position detector for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625012Y2 (en) |
-
1988
- 1988-05-12 JP JP6267288U patent/JPH0625012Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625012Y2 (en) | 1994-06-29 |