JPH01165641U - - Google Patents
Info
- Publication number
- JPH01165641U JPH01165641U JP1988061374U JP6137488U JPH01165641U JP H01165641 U JPH01165641 U JP H01165641U JP 1988061374 U JP1988061374 U JP 1988061374U JP 6137488 U JP6137488 U JP 6137488U JP H01165641 U JPH01165641 U JP H01165641U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- semiconductor
- face
- bumps
- down bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 16
- 238000003486 chemical etching Methods 0.000 claims 1
- 239000002775 capsule Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988061374U JPH01165641U (US06272168-20010807-M00014.png) | 1988-05-10 | 1988-05-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988061374U JPH01165641U (US06272168-20010807-M00014.png) | 1988-05-10 | 1988-05-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01165641U true JPH01165641U (US06272168-20010807-M00014.png) | 1989-11-20 |
Family
ID=31287047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988061374U Pending JPH01165641U (US06272168-20010807-M00014.png) | 1988-05-10 | 1988-05-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01165641U (US06272168-20010807-M00014.png) |
-
1988
- 1988-05-10 JP JP1988061374U patent/JPH01165641U/ja active Pending