JPH01165635U - - Google Patents
Info
- Publication number
- JPH01165635U JPH01165635U JP1988061951U JP6195188U JPH01165635U JP H01165635 U JPH01165635 U JP H01165635U JP 1988061951 U JP1988061951 U JP 1988061951U JP 6195188 U JP6195188 U JP 6195188U JP H01165635 U JPH01165635 U JP H01165635U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- chip
- stem
- heat
- mount base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0113—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061951U JPH01165635U (enExample) | 1988-05-11 | 1988-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988061951U JPH01165635U (enExample) | 1988-05-11 | 1988-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165635U true JPH01165635U (enExample) | 1989-11-20 |
Family
ID=31287588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988061951U Pending JPH01165635U (enExample) | 1988-05-11 | 1988-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165635U (enExample) |
-
1988
- 1988-05-11 JP JP1988061951U patent/JPH01165635U/ja active Pending