JPH01165634U - - Google Patents
Info
- Publication number
- JPH01165634U JPH01165634U JP6132788U JP6132788U JPH01165634U JP H01165634 U JPH01165634 U JP H01165634U JP 6132788 U JP6132788 U JP 6132788U JP 6132788 U JP6132788 U JP 6132788U JP H01165634 U JPH01165634 U JP H01165634U
- Authority
- JP
- Japan
- Prior art keywords
- silver paste
- supply port
- container
- outer edge
- centrifugal force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6132788U JPH01165634U (US06312121-20011106-C00033.png) | 1988-05-10 | 1988-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6132788U JPH01165634U (US06312121-20011106-C00033.png) | 1988-05-10 | 1988-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165634U true JPH01165634U (US06312121-20011106-C00033.png) | 1989-11-20 |
Family
ID=31287002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6132788U Pending JPH01165634U (US06312121-20011106-C00033.png) | 1988-05-10 | 1988-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165634U (US06312121-20011106-C00033.png) |
-
1988
- 1988-05-10 JP JP6132788U patent/JPH01165634U/ja active Pending
