JPH01165631U - - Google Patents

Info

Publication number
JPH01165631U
JPH01165631U JP6120488U JP6120488U JPH01165631U JP H01165631 U JPH01165631 U JP H01165631U JP 6120488 U JP6120488 U JP 6120488U JP 6120488 U JP6120488 U JP 6120488U JP H01165631 U JPH01165631 U JP H01165631U
Authority
JP
Japan
Prior art keywords
positioning
chip
positions
piezoelectric element
positioning member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6120488U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6120488U priority Critical patent/JPH01165631U/ja
Publication of JPH01165631U publication Critical patent/JPH01165631U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP6120488U 1988-05-10 1988-05-10 Pending JPH01165631U (hu)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6120488U JPH01165631U (hu) 1988-05-10 1988-05-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6120488U JPH01165631U (hu) 1988-05-10 1988-05-10

Publications (1)

Publication Number Publication Date
JPH01165631U true JPH01165631U (hu) 1989-11-20

Family

ID=31286880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6120488U Pending JPH01165631U (hu) 1988-05-10 1988-05-10

Country Status (1)

Country Link
JP (1) JPH01165631U (hu)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009517233A (ja) * 2005-11-30 2009-04-30 シーメンス アクチエンゲゼルシヤフト 機械要素ないし加工物の振動低下方法
JP2017204569A (ja) * 2016-05-11 2017-11-16 三益半導体工業株式会社 回転テーブル用ウェーハ保持機構及び方法並びにウェーハ回転保持装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009517233A (ja) * 2005-11-30 2009-04-30 シーメンス アクチエンゲゼルシヤフト 機械要素ないし加工物の振動低下方法
JP2017204569A (ja) * 2016-05-11 2017-11-16 三益半導体工業株式会社 回転テーブル用ウェーハ保持機構及び方法並びにウェーハ回転保持装置

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