JPH01165601U - - Google Patents
Info
- Publication number
- JPH01165601U JPH01165601U JP6150688U JP6150688U JPH01165601U JP H01165601 U JPH01165601 U JP H01165601U JP 6150688 U JP6150688 U JP 6150688U JP 6150688 U JP6150688 U JP 6150688U JP H01165601 U JPH01165601 U JP H01165601U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- hollow
- solder
- filled
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6150688U JPH01165601U (fr) | 1988-05-09 | 1988-05-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6150688U JPH01165601U (fr) | 1988-05-09 | 1988-05-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01165601U true JPH01165601U (fr) | 1989-11-20 |
Family
ID=31287172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6150688U Pending JPH01165601U (fr) | 1988-05-09 | 1988-05-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01165601U (fr) |
-
1988
- 1988-05-09 JP JP6150688U patent/JPH01165601U/ja active Pending