JPH01165165U - - Google Patents
Info
- Publication number
- JPH01165165U JPH01165165U JP5775288U JP5775288U JPH01165165U JP H01165165 U JPH01165165 U JP H01165165U JP 5775288 U JP5775288 U JP 5775288U JP 5775288 U JP5775288 U JP 5775288U JP H01165165 U JPH01165165 U JP H01165165U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead
- immersing
- sandwich
- solder plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Coating With Molten Metal (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5775288U JPH01165165U (es) | 1988-04-28 | 1988-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5775288U JPH01165165U (es) | 1988-04-28 | 1988-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165165U true JPH01165165U (es) | 1989-11-17 |
Family
ID=31283594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5775288U Pending JPH01165165U (es) | 1988-04-28 | 1988-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165165U (es) |
-
1988
- 1988-04-28 JP JP5775288U patent/JPH01165165U/ja active Pending
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