JPH01165131A - Deflushing device for resin seal type semiconductor - Google Patents

Abstract

PURPOSE:To improve the stability of connection and the stability of work by pushing a lead frame, from which a plurality of terminal sections are removed, and the slant face section of a chamfering section in a resin seal member by two members from upper and lower sections. CONSTITUTION:A member 13 for hold-down fixes a resin seal member 11 to a shape along the slant faces of chamfering sections in the resin seal member in four chamfering sections 15 in the resin seal member 11. Since such constitution is sandwiched by clamps 16, the resin seal member 11 and a lead frame 12 are not moved relatively, the lead frame is not bent and no warpage is generated due to deflush, and the positioning properties of frames at the time of automatic conveyance are also stabilized. The shapes of terminal forming, etc., are also equalized. Flatness after forming is also improved, and the stability of connection and workability at the time of soldering to a printed substrate are enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a deflash device for mold resin of resin-sealed semiconductors.

[Conventional technology]

As shown in FIG. 2, in the conventional deflashing method for a resin-sealed semiconductor mold range, a lead frame 21 after resin-sealing is conveyed while being held between belts 23 guided by rollers 22, and then transferred to a nozzle 24. From, water and abrasive material mixture 2
5 was sprayed onto the lead frame to remove the resin flash from the mold.

[Problem that the invention seeks to solve]

However, recent lead frames, as shown in Figure 3,
A slit 34 is provided between the lead frame 32 and the terminal 330 to prevent warping of the frame caused by curing shrinkage of the sealing member and the difference in thermal expansion coefficients between the sealing member 31 and the lead frame 32. Rigidity is also reduced.

When a lead frame with such a structure is deflashed, the terminals 33 and the lead frame 32 may warp or bend due to the injection of a mixture of water and abrasive material, as shown in FIG. 3(b). , there was a problem in that positioning during automatic transport in the next process could not be performed.

Furthermore, irregular bending of the terminal 33 during terminal forming reduces the flatness of the terminal, resulting in reduced connection stability and work stability when soldering to a printed circuit board.

[Means for solving problems]

The resin-sealed semiconductor deflash device of the present invention is characterized in that the lead frame excluding the plurality of terminals and the sloped surface of the chamfered portion of the resin-sealed member are pressed down by two members from above and below. .

(Example) FIG. 1(a) is a plan view of the present invention, and FIG. 1(b)
is its AA cross section. 11 is a resin sealing member, 12 is a lead frame and a terminal, 13 is a holding member, and 14 is a plurality of terminal upper and lower openings of the holding member. In addition, the holding members are chamfered portions 15 at four locations on the resin sealing member, and have a shape that follows the slope of the chamfered portions of the resin sealing member, and have a shape of 0 or more that fixes the resin sealing member. By sandwiching the structure with the clamp 16, the resin sealing member and lead frame do not move relative to each other, and the lead frame does not bend or warp due to deflashing, making frame positioning easier during automatic transportation. is also stable.

Moreover, the shape during terminal forming becomes uniform.

〔Effect of the invention〕

As described above, according to the present invention, by deflashing,
The lead frame does not bend, and automatic transportation in subsequent processes is stabilized. Furthermore, the flatness of the terminal after forming is improved, improving connection stability and workability when soldering to a printed circuit board.

[Brief explanation of the drawing]

FIG. 1(a) is a plan view of the present invention. FIG. 1(b) is a sectional view of the present invention. FIG. 2 is a diagram showing a conventional deflashing method. FIG. 3(a) is a plan view of the lead frame. FIG. 3(b) is a side view of the lead frame. 11... Resin sealing member 12... Lead frame and terminal 13... Holding member 14... Openings of multiple terminals of holding member 23... Conveying belt 24... Nozzle 25. ... Mixed liquid 34 ... Slit or above Applicant Seiko Epson Co., Ltd. agent Patent attorney Tsutomu Mogami and 1 other person Figure 1 (α) Figure 1 (b) Figure 3 (cL) Figure 3 (b) )

Claims (1)

[Claims] A semiconductor element having a large number of electrodes, an element fixing plate for fixing the semiconductor element, a band-like member connected to the element fixing plate, a tip in the vicinity of the element fixing plate, and a tip attached to the tip of the semiconductor element. A plurality of terminals to which electrodes are electrically connected, the semiconductor element, the element fixing plate, and the plurality of terminals are sealed, and the sealing member has an outer shape of four main sides and a portion between the sides. In a resin-sealed semiconductor deflash device comprising a resin-sealed member having a chamfered portion at a corner, and in which the side edges and the chamfered portion are sloped, a plurality of deflashing devices derived from the resin-sealed member are provided. A deflashing device for a resin-sealed semiconductor, characterized in that the lead frame part excluding the upper and lower parts of the terminal and the chamfered part are pressed and processed by two members from above and below.