JPH01164091A - Manufacture of molded circuit board - Google Patents

Abstract

PURPOSE:To determine a reference position easily by a method wherein a head part of a positioning pin inserted into a reference hole in a circuit film is inserted into a positioning-pin fitting recessed part formed to be corresponding to the reference hole in the circuit film on a face where the circuit film of a mold is to be set and a resin is molded in a state that a base protrudes into a cavity of the mold. CONSTITUTION:Positioning pins 13 are inserted into reference holes 15 in a circuit film 11; their head parts are inserted into fitting recessed parts 16 of a metal mold 12A. By this setup, central axis lines of the pins coincide with the reference holes 15 in the film 11; the film 11 is fixed temporarily to the metal mold 12A. Base parts of the pins 13 protrude into a cavity of metal molds 12A, 12B. The metal molds are closed; the cavity is filled with a resin 17. The base parts of the positioning pins 13 inserted into the reference holes 15 in the film 11 are buried in a resin molded body 19 and are fixed; when a creamy solder 20 is coated on a pad part of the circuit film 11, a screen 21 can be positioned simply and accurately only if the pins 13 are inserted into positioning holes 22 in the screen 21.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a molded circuit board in which a resin molded body is integrally formed on the back side of a circuit film.

[Prior art and its problems]

Conventionally, molded circuit boards are manufactured by setting a circuit film with a desired circuit pattern in a mold and molding resin, but resin molded products usually have a three-dimensional shape such as a box shape. Therefore, the technology used for flat circuit boards often cannot be applied as is (
For example, when applying cream solder to a pad portion of a circuit film, it is difficult to fix the screen for applying cream solder in a fixed position, and there is a problem that the screen moves when applying cream solder.

[Means for solving problems and their effects]

SUMMARY OF THE INVENTION In view of the problems of the prior art as described above, an object of the present invention is to provide a method for manufacturing a molded circuit board in which a reference position can be easily determined.

In order to achieve this object, the present invention provides a method for manufacturing a molded circuit board in which a resin molded body and a circuit film are integrated by placing a circuit film in a mold and molding a resin. A positioning pin fitting recess is formed on the circuit film setting surface of the circuit film corresponding to the reference hole of the circuit film, and the head of the positioning pin inserted through the reference hole of the circuit film is inserted into the fitting recess, and the positioning pin of the positioning pin is inserted into the fitting recess. It is characterized by performing resin molding with the base protruding into the cavity of the mold.

When molding is performed in this way, a molded circuit board is obtained in which the base of the positioning bottle inserted into the reference hole of the circuit film is embedded in the resin molding, and the head protrudes from the surface of the circuit film. With this positioning bin as a reference, it becomes possible to easily position a cream solder application screen, etc.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

1 and 2 show one embodiment of the invention.

In the figure, 11 is a circuit film with a required circuit pattern formed on one or both sides of an insulating film, 12A.1
2B is a mold for molding, and 13 is a positioning bottle having a taper with a larger diameter on the base side. As shown in FIG. 1, a positioning pin fitting recess 16 is formed in the surface 14 of the mold 12A on which the circuit film 11 is inserted, in correspondence with the reference hole 15 of the circuit film 11.

First, in order to set the circuit film 11 in a fixed position, the positioning pin 13 is inserted into the reference hole 15 of the circuit film 11, and its head is further inserted into the fitting recess 16 of the mold 12A. The center axis of the positioning bin 13 now coincides with the reference hole 15 of the circuit film 11, and the circuit film 11 is temporarily fixed to the mold 12A. Further, the base of the positioning bin 13 is in a state of protruding into the cavities of the molds 12A and 12B. Note that the back surface (cavity side surface) of the circuit film 11 is coated with an adhesive to the molding resin in advance.

Next, the molds 12A and 12B are closed, and the resin 17 is filled into the cavity as shown in FIG. After the resin 17 is solidified, the molds 12A and 12B are opened to obtain a molded circuit board 18 as shown in FIG. In this molded circuit board 18, a circuit film 11 and a resin molded body 19 are integrated, the base of the positioning pin 13 inserted through the reference hole 15 of the circuit film 11 is embedded and fixed in the resin molded body 19, and the head is connected to the circuit. It has a protruding shape on the surface of the film 11.

Therefore, when applying the cream solder 20 to the pad portion of the circuit film 11, a hole 22 for positioning is formed in the screen 21, and the positioning bottle 1 is inserted into the hole 22.
3 is inserted, the screen 21 can be easily and accurately positioned. Furthermore, even when the cream solder 20 is rubbed with the squeegee 23, there is no risk of the screen 21 moving.

In the above embodiment, a tapered positioning bottle was used, but the shape of the positioning bottle is not limited to this. For example, the positioning bottle 13 of various shapes as shown in FIGS. can be used.

FIG. 5 shows a state in which a molded circuit board is manufactured using the positioning bin 13 shown in FIG. The circuit film 11 is placed at the head of the positioning bin 13.
can be fixed to the resin molded body 19, and there is an advantage that there is no need to apply an adhesive to the back surface of the circuit film 11.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to obtain a molded circuit board in which the base of the positioning bottle inserted into the reference hole of the circuit film is embedded in the resin molding, and the head protrudes from the surface of the circuit film. Therefore, there is an advantage that a cream solder coating screen or the like can be easily and reliably positioned based on the head of the positioning bottle.

[Brief Description of the Drawings] Figures 1 and 2 are cross-sectional views showing a method of manufacturing a molded circuit board according to an embodiment of the present invention, and Figure 3 is a cross-sectional view of a molded circuit board obtained by the same manufacturing method. A cross-sectional view shown together with a screen for applying solder, FIGS. 11: Circuit film, 12A-128: Mold, 13:
Positioning bin, 14: Circuit film setting surface, 15: Reference hole, 16: Positioning bin fitting recess, 17: Resin, 18
: molded circuit board, 19: resin molded body. Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] In a method of manufacturing a molded circuit board in which a resin molded body and a circuit film are integrated by setting a circuit film in a mold and molding a resin, a circuit film reference is placed on the circuit film setting surface of the mold. A positioning pin fitting recess is formed corresponding to the hole, the head of the positioning pin inserted through the reference hole of the circuit film is inserted into the fitting recess, and the base of the positioning pin is made to protrude into the cavity of the mold. A method for producing a molded circuit board, characterized in that resin molding is carried out in a state in which a molded circuit board is molded.