JPH01163345U - - Google Patents
Info
- Publication number
- JPH01163345U JPH01163345U JP6039788U JP6039788U JPH01163345U JP H01163345 U JPH01163345 U JP H01163345U JP 6039788 U JP6039788 U JP 6039788U JP 6039788 U JP6039788 U JP 6039788U JP H01163345 U JPH01163345 U JP H01163345U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- island
- inner lead
- thin metal
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6039788U JPH01163345U (US20100223739A1-20100909-C00005.png) | 1988-05-06 | 1988-05-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6039788U JPH01163345U (US20100223739A1-20100909-C00005.png) | 1988-05-06 | 1988-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01163345U true JPH01163345U (US20100223739A1-20100909-C00005.png) | 1989-11-14 |
Family
ID=31286104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6039788U Pending JPH01163345U (US20100223739A1-20100909-C00005.png) | 1988-05-06 | 1988-05-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01163345U (US20100223739A1-20100909-C00005.png) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61240644A (ja) * | 1985-04-18 | 1986-10-25 | Nec Corp | 半導体装置 |
| JPS62128550A (ja) * | 1985-11-30 | 1987-06-10 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
| JPS6310569B2 (US20100223739A1-20100909-C00005.png) * | 1983-08-23 | 1988-03-08 | Tokyo Shibaura Electric Co |
-
1988
- 1988-05-06 JP JP6039788U patent/JPH01163345U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310569B2 (US20100223739A1-20100909-C00005.png) * | 1983-08-23 | 1988-03-08 | Tokyo Shibaura Electric Co | |
| JPS61240644A (ja) * | 1985-04-18 | 1986-10-25 | Nec Corp | 半導体装置 |
| JPS62128550A (ja) * | 1985-11-30 | 1987-06-10 | Toshiba Corp | 半導体装置用リ−ドフレ−ム |
